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    • 3. 发明授权
    • Process of plasma etching silicon
    • 等离子体蚀刻硅的工艺
    • US5536364A
    • 1996-07-16
    • US253704
    • 1994-06-03
    • Takahiko YoshidaKazushi AsamiMuneo YorinagaYoshimi Yoshino
    • Takahiko YoshidaKazushi AsamiMuneo YorinagaYoshimi Yoshino
    • H01L21/3065H01L21/308
    • H01L21/3065H01L21/3081Y10S438/945
    • A plasma etching process for forming a recess or opening on a silicon substrate by generating plasma between a pair of electrodes in an anode-coupled planar-type plasma etching apparatus and etching the silicon substrate located on one of the electrodes with the plasma, an improvement residing in that an etchant is a mixed gas of sulfur hexafluoride and oxygen and an etching mask covering the substrate, except for a portion where the recess or opening is to be formed, is made of chromium or a chromium compound. Preferably the distance between the electrodes is 10 to 30 mm, the volume ratio of sulfur hexafluoride to oxygen is 90:10 to 60:40, the pressure of the etchant gas is 0.15 to 0.4 Torr (20 to 53 Pa), and the temperature of the substrate is not less than 40.degree. C.
    • 一种等离子体蚀刻工艺,用于通过在阳极耦合的平面型等离子体蚀刻装置中的一对电极之间产生等离子体并且利用等离子体蚀刻位于其中一个电极上的硅衬底,在硅衬底上形成凹部或开口, 其特征在于,蚀刻剂是六氟化硫和氧气的混合气体,除了要形成凹部或开口的部分之外,覆盖基板的蚀刻掩模由铬或铬化合物制成。 优选地,电极之间的距离为10〜30mm,六氟化硫与氧的体积比为90:10〜60:40,蚀刻剂气体的压力为0.15〜0.4乇(20〜53Pa),温度 的基材不低于40℃
    • 6. 发明授权
    • Method for producing an acceleration sensor
    • 加速度传感器的制造方法
    • US5525549A
    • 1996-06-11
    • US49801
    • 1993-04-21
    • Tsuyoshi FukadaYoshimi YoshinoYukihiko Tanizawa
    • Tsuyoshi FukadaYoshimi YoshinoYukihiko Tanizawa
    • B81B3/00G01L9/00G01P15/08G01P15/12H01L21/3063H01L21/78H01L21/64
    • B81C1/00888B81C1/00158G01L9/0055G01P15/0802G01P15/123H01L21/3063H01L21/78B81B2201/0235B81C2201/0114B81C2201/053Y10S148/028Y10S148/159Y10S438/977
    • A method for producing a semiconductor device that is capable of solving problems related to dicing a metal thin film used for electrochemical etching. According to the method, an n type epitaxial thin layer is formed on a p type single-crystal silicon wafer. An n.sup.+ type diffusion layer is formed in a scribe line area on the epitaxial layer. An n.sup.+ type diffusion layer is formed in an area of the epitaxial layer which corresponds to a predetermined portion of the wafer. An aluminum film is formed over the diffusion layers. The aluminum film has a clearance for passing a dicing blade. Portions of the wafer are electrochemically etched by supplying electricity through the aluminum film and the diffusion layers, to leave portions of the epitaxial layer. The wafer is diced into chips along the scribe line area. Each of the chips forms a separate semiconductor device. The electrochemical etching of the wafer is carried out after the formation of the aluminum film by immersing the wafer in a KOH aqueous solution and by supplying electricity through the aluminum film. The electrochemical etching is terminated at an inflection point where an etching current inflects to a constant level from a peak level. During the electrochemical etching, the diffusion layer reduces horizontal resistance in the epitaxial layer, so that the etched parts receive a sufficient potential to perform the etching.
    • 一种能够解决与用于电化学蚀刻的金属薄膜切割相关的问题的半导体器件的制造方法。 根据该方法,在p型单晶硅晶片上形成n型外延薄层。 在外延层上的划线区域中形成n +型扩散层。 在对应于晶片的预定部分的外延层的区域中形成n +型扩散层。 在扩散层上形成铝膜。 铝膜具有用于通过切割刀片的间隙。 通过供电通过铝膜和扩散层对晶片的一部分进行电化学蚀刻,以留下外延层的部分。 晶片沿着划线区切成芯片。 每个芯片形成单独的半导体器件。 通过将晶片浸入KOH水溶液中并通过铝膜供电,在形成铝膜之后进行晶片的电化学蚀刻。 在蚀刻电流从峰值水平变为恒定水平的拐点处终止电化学蚀刻。 在电化学蚀刻期间,扩散层减小外延层中的水平电阻,使得蚀刻部分具有足够的电位进行蚀刻。
    • 7. 发明授权
    • Apparatus for optically detecting an extraneous matter on a translucent
shield
    • 用于光学检测半透明屏蔽上的外来物质的装置
    • US4867561A
    • 1989-09-19
    • US87168
    • 1987-08-18
    • Tetsuo FujiiHirohito ShioyaTiaki MizunoTadashi KamadaYasuaki MakinoYoshimi YoshinoSeiichiro Otake
    • Tetsuo FujiiHirohito ShioyaTiaki MizunoTadashi KamadaYasuaki MakinoYoshimi YoshinoSeiichiro Otake
    • B60H1/00B60S1/08
    • B60S1/0822B60H1/00785B60S1/0837G06K9/00791Y10S15/15
    • An apparatus for optically detecting the attachment state of extraneous matters to a translucent shield member. The optically detecting apparatus comprises a light-emitting unit having a plurality of light-emitting elements each emitting a light ray toward the translucent shield member, a photoelectric transducer unit having a plurality of transducer elements each receiving each of the light rays reflected on the translucent shield member, and a data processing unit coupled to the transducer unit. The transducer unit generates detection signals corresponding to the quantities of the received light rays and the data processing unit successively compares the level of each of the detection signals with a predetermined level to produce binary signals in accordance with the results of the comparison so that a binary signal pattern is defined at the respective transducer elements. The data processing unit determines the attachment state of the extraneous matters to the translucent shield member by comparing the defined binary signal pattern with a reference pattern.
    • 一种用于光学地检测外来物质到半透明屏蔽构件的附着状态的装置。 光学检测装置包括具有多个发光元件的发光单元,每个发光元件朝向半透明屏蔽构件发射光线;光电变换器单元,具有多个换能器元件,每个换能器元件接收在半透明屏蔽构件上反射的每个光线 屏蔽构件和耦合到换能器单元的数据处理单元。 换能器单元产生对应于接收光线的量的检测信号,并且数据处理单元根据比较结果将每个检测信号的电平与预定电平连续地进行比较,以产生二进制信号,使得二进制 在相应的换能器元件处限定信号图案。 数据处理单元通过将定义的二进制信号模式与参考模式进行比较来确定外部物质对半透明屏蔽构件的附着状态。