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    • 1. 发明申请
    • Nitride semiconductor laser chip and method of fabricating same
    • 氮化物半导体激光芯片及其制造方法
    • US20090168827A1
    • 2009-07-02
    • US12318237
    • 2008-12-23
    • Toshiyuki KawakamiTakeshi KamikawaKentaro Tani
    • Toshiyuki KawakamiTakeshi KamikawaKentaro Tani
    • H01S5/00H01L21/02
    • H01S5/16B82Y20/00H01S5/0202H01S5/0425H01S5/2201H01S5/34333
    • A nitride semiconductor laser chip is provided that can not only improve its COD level but also prevent its I-L characteristic curve from rising steeply and that can reduce an operating voltage. The nitride semiconductor laser chip includes layers constituting a nitride semiconductor layer and formed on an n-type GaN substrate, mirror facets including a light emission mirror facet and a light reflection mirror facet, a p-side ohmic contact formed on an upper contact layer to reach the mirror facets and a p-side pad contact formed in a region only a distance L1 away from the light emission mirror facet. The thickness d of the p-side ohmic contact and the distance L1 from the p-side ohmic contact to the light emission mirror facet are adjusted such that the amount of current injected into the light emission mirror facet is 20% or more but 70% or less of the amount of current injected into an area directly below the p-side pad contact.
    • 提供了一种氮化物半导体激光器芯片,其不仅可以提高其COD水平,而且可以防止其I-L特性曲线急剧上升,并且可以降低工作电压。 氮化物半导体激光器芯片包括构成氮化物半导体层并形成在n型GaN衬底上的层,包括发光镜面和光反射镜面的镜面,形成在上接触层上的p侧欧姆接触到 到达镜面和在远离发光镜面的距离L1的区域中形成的p侧焊盘触点。 调整p侧欧姆接触的厚度d和从p侧欧姆接触到发光镜面的距离L1,使得注入发光镜面的电流量为20%以上且70% 或更少的注入到p侧焊盘触点正下方的区域的电流量。