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    • 1. 发明授权
    • Vapor deposition apparatus
    • 蒸镀装置
    • US5002011A
    • 1991-03-26
    • US181091
    • 1988-04-13
    • Toshimitsu OhmineKeiichi AkagawaAkira Ishihata
    • Toshimitsu OhmineKeiichi AkagawaAkira Ishihata
    • C23C16/458
    • C23C16/4588
    • A vapor deposition apparatus for forming thin films on substrates with reactive gases, by rotating and revolving the substrates while heating the substrates in a reactor vessel, comprises a hollow susceptor carrier rotatably disposed inside the reactor vessel, susceptors rotatably disposed on the susceptor carrier to hold the substrates respectively, a driving motor for rotating the susceptor carrier such that the substrates held by the susceptors are revolved with respect to the reactor vessel, and a converting mechanism for converting a rotating motion of the susceptor carrier rotated by the driving motor into a motion for rotating the susceptors together with the substrates around themselves. The converting mechanism is disposed within the hollow of the susceptor carrier.
    • 一种用于在具有反应气体的基板上形成薄膜的气相沉积设备,通过在反应器容器中加热基板的同时旋转和旋转基板,包括可旋转地设置在反应器容器内的中空基座托架,可旋转地设置在基座托架上的托架 所述基板分别用于使所述基座托架旋转使得由所述基座保持的基板相对于所述反应堆容器旋转的驱动马达;以及用于将由所述驱动马达旋转的所述基座托架的旋转运动转换成运动的转换机构 用于使基座与其周围的基板一起旋转。 转换机构设置在基座托架的中空部内。
    • 2. 发明授权
    • Vapor deposition apparatus
    • 蒸镀装置
    • US5151133A
    • 1992-09-29
    • US639182
    • 1991-01-09
    • Toshimitsu OhmineKeiichi AkagawaAkira Ishihata
    • Toshimitsu OhmineKeiichi AkagawaAkira Ishihata
    • C23C16/458
    • C23C16/4588
    • A vapor deposition apparatus for forming thin films on substrates with reactive gases, by rotating and revolving the substrates while heating the substrates in a reactor vessel, comprises a hollow susceptor carrier rotatably disposed inside the reactor vessel, susceptors rotatably disposed on the susceptor carrier to hold the substrates respectively, a driving motor for rotating the susceptor carrier such that the substrates held by the susceptors are revolved with respect to the reactor vessel, and a converting mechanism for converting a rotation motion of the susceptor carrier rotated by the driving motor into a motion for rotating the susceptors together with the substrates around themselves. The converting mechanism is disposed within the hollow of the susceptor carrier.
    • 一种用于在具有反应气体的基板上形成薄膜的气相沉积设备,通过在反应器容器中加热基板的同时旋转和旋转基板,包括可旋转地设置在反应器容器内的中空基座托架,可旋转地设置在基座托架上的托架 所述基板分别用于使所述基座托架旋转使得由所述基座保持的基板相对于所述反应堆容器旋转的驱动马达和用于将由所述驱动马达旋转的所述基座托架的旋转运动转换为运动的转换机构 用于使基座与其周围的基板一起旋转。 转换机构设置在基座托架的中空部内。
    • 4. 发明授权
    • Vapor deposition system
    • 蒸气沉积系统
    • US5088444A
    • 1992-02-18
    • US487188
    • 1990-03-01
    • Toshimitsu OhmineKeiichi Akagawa
    • Toshimitsu OhmineKeiichi Akagawa
    • C23C16/54H01L21/677
    • H01L21/67748C23C16/54
    • A vapor deposition system deposits a semiconductor film on a substrate. The system comprises a susceptor on which the substrate is positioned, and a reactor tube in which the susceptor having the substrate is positioned and the semiconductor film is deposited on the substrate. The reactor tube is composed of two parts to be fitted to and separated from each other. An airtight vessel airtightly covers the reactor tube. The system further comprises a mover for moving at least one of the two parts of the reactor tube relative to the other part, thereby fitting and separating the two parts to and from each other. A carrying device is provided for the system to carry the susceptor having the substrate from the airtight vessel into the reactor tube through an opening to be opened by separating the two parts of the reactor tube from each other, and to carry the susceptor from the reactor tube to the airtight vessel through the opening.
    • 蒸镀系统将半导体膜沉积在基板上。 该系统包括其上定位有基底的感受体,以及反应器管,其中具有基底的基座被定位并且半导体膜沉积在基底上。 反应器管由两部分组成,以便彼此装配和分离。 气密的船舶气密地覆盖反应管。 该系统还包括用于相对于另一部分移动反应器管的两个部分中的至少一个的移动器,从而将两个部件彼此配合和分离。 提供了一种承载装置,用于将具有基材的基座从气密容器通过打开的开口携带到反应器管中,该开口通过将反应器管的两个部分彼此分离,并将基座从反应器 通过开口管到气密的容器。
    • 8. 发明授权
    • Exhaust processing apparatus
    • 废气处理装置
    • US4940213A
    • 1990-07-10
    • US222905
    • 1988-07-22
    • Toshimitsu OhmineTakaaki HondaKeiiti Akagawa
    • Toshimitsu OhmineTakaaki HondaKeiiti Akagawa
    • B01D53/00B01D53/34B01D53/46
    • B01D53/34B01D53/00B01D53/46
    • An exhaust processing apparatus comprises a cracking furnace for cracking and solidifying exhaust discharged from a reactor for forming crystals on a semiconductor substrate, a first collecting device for collecting relatively large components solidified in the cracking furnace, a second collecting device for collecting relatively small solidified components passed through the first collecting device, and a chemical or a physical adsorbing member for chemically or physically adsorbing the exhaust passed through the first and second collecting devices.The apparatus may be provided with bypass piping for bypassing a particular section of the apparatus, a shutoff member for opening and closing the bypass piping and a control device for controlling the shutoff member.The cracking furnace of the apparatus has a heating portion for heating the exhaust, an enlarged portion disposed downstream the heating portion and having a passage whose cross-sectional area is larger than that of the heating portion, and a cooling mechanism for forcibly cooling the heated exhaust.
    • 废气处理装置包括:裂解炉,用于将从用于在半导体基板上形成晶体的反应器排出的废气进行裂化和固化;第一收集装置,用于收集在裂解炉中固化的相对大的组分;第二收集装置,用于收集较小的凝固组分 通过第一收集装置,以及用于化学或物理吸附通过第一和第二收集装置的废气的化学或物理吸附构件。 该设备可以设置有用于绕过设备的特定部分的旁路管道,用于打开和关闭旁路管道的关闭构件以及用于控制关闭构件的控制装置。 该装置的裂解炉具有用于加热排气的加热部,设置在加热部下游的具有截面积大于加热部的通道的扩大部,以及强制冷却加热部的冷却机构 排气。