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    • 2. 发明申请
    • METHOD FOR FABRICATION OF SEMICONDUCTOR DEVICE
    • 半导体器件制造方法
    • US20080261357A1
    • 2008-10-23
    • US11956858
    • 2007-12-14
    • Norifumi KAMESHIROToshiyuki MineTomoyuki IshiiToshiaki Sano
    • Norifumi KAMESHIROToshiyuki MineTomoyuki IshiiToshiaki Sano
    • H01L21/84
    • H01L29/66757H01L29/66613H01L29/66772
    • After forming a source-drain material film on an insulator layer, an opening portion reaching the insulator layer is formed in the source-drain material film. Then, a channel having desired thickness and a gate insulator are sequentially formed on the insulator layer and the source-drain material film in the opening portion. Thereafter, a gate material film embedding the opening portion is formed on the gate insulator. Subsequently, a cap film is formed on the gate material film, thereby forming the gate made of the gate material film. Then, a mask layer is formed on the source-drain material film. Next, the source-drain material film not protected by the mask layer is removed while protecting the gate by the cap film, thereby leaving the source-drain material film on both sides of the gate. The source-drain material film on one side becomes the source and that on the other side becomes the drain.
    • 在绝缘体层上形成源极 - 漏极材料膜之后,在源极 - 漏极材料膜中形成到达绝缘体层的开口部分。 然后,在开口部分的绝缘体层和源极 - 漏极材料膜上依次形成具有期望厚度的沟道和栅极绝缘体。 此后,在栅极绝缘体上形成嵌入开口部的栅极材料膜。 随后,在栅极材料膜上形成盖膜,从而形成由栅极材料膜制成的栅极。 然后,在源极 - 漏极材料膜上形成掩模层。 接下来,除去未被掩模层保护的源极 - 漏极材料膜,同时通过盖膜保护栅极,从而在栅极的两侧留下源极 - 漏极材料膜。 一侧的源极 - 漏极材料膜成为源极,而另一侧的源极 - 漏极材料膜变成漏极。
    • 3. 发明授权
    • Method for fabrication of semiconductor device
    • 半导体器件制造方法
    • US07772053B2
    • 2010-08-10
    • US11956858
    • 2007-12-14
    • Norifumi KameshiroToshiyuki MineTomoyuki IshiiToshiaki Sano
    • Norifumi KameshiroToshiyuki MineTomoyuki IshiiToshiaki Sano
    • H01L21/00
    • H01L29/66757H01L29/66613H01L29/66772
    • After forming a source-drain material film on an insulator layer, an opening portion reaching the insulator layer is formed in the source-drain material film. Then, a channel having desired thickness and a gate insulator are sequentially formed on the insulator layer and the source-drain material film in the opening portion. Thereafter, a gate material film embedding the opening portion is formed on the gate insulator. Subsequently, a cap film is formed on the gate material film, thereby forming the gate made of the gate material film. Then, a mask layer is formed on the source-drain material film. Next, the source-drain material film not protected by the mask layer is removed while protecting the gate by the cap film, thereby leaving the source-drain material film on both sides of the gate. The source-drain material film on one side becomes the source and that on the other side becomes the drain.
    • 在绝缘体层上形成源极 - 漏极材料膜之后,在源极 - 漏极材料膜中形成到达绝缘体层的开口部分。 然后,在开口部分的绝缘体层和源极 - 漏极材料膜上依次形成具有期望厚度的沟道和栅极绝缘体。 此后,在栅极绝缘体上形成嵌入开口部的栅极材料膜。 随后,在栅极材料膜上形成盖膜,从而形成由栅极材料膜制成的栅极。 然后,在源极 - 漏极材料膜上形成掩模层。 接下来,除去未被掩模层保护的源极 - 漏极材料膜,同时通过盖膜保护栅极,从而在栅极的两侧留下源极 - 漏极材料膜。 一侧的源极 - 漏极材料膜成为源极,而另一侧的源极 - 漏极材料膜变成漏极。
    • 7. 再颁专利
    • Semiconductor memory device
    • 半导体存储器件
    • USRE41868E1
    • 2010-10-26
    • US11708145
    • 2007-02-20
    • Toshiaki SanoTomoyuki IshiiKazuo YanoToshiyuki Mine
    • Toshiaki SanoTomoyuki IshiiKazuo YanoToshiyuki Mine
    • H01L29/76H01L29/788
    • B82Y10/00G11C11/5621G11C11/5628G11C11/5635G11C11/5642G11C11/5671G11C16/0416G11C16/10G11C16/16G11C16/26G11C2216/08H01L21/28273H01L27/115H01L27/11519H01L27/11521H01L29/42324H01L29/66825H01L29/7883H01L29/7888H01L29/7889
    • A memory cell with a small surface area is fabricated by forming source lines and data lines above and below and by running the channels to face up and down. The local data lines for each vertically stacked memory cell are connected to a global data line by way of separate selection by a molecular oxide semiconductor, and use of a large surface area is avoided by making joint use of peripheral circuits such as global data lines and sensing amplifiers by performing read and write operations in a timed multiplex manner. Moreover, data lines in multi-layers and memory cells (floating electrode cell) which are non-destructive with respect to readout are utilized to allow placement of memory cells at all intersecting points of word lines and data lines while having a folded data line structure. An improved noise tolerance is attained by establishing a standard threshold voltage for identical dummy cells even in any of the read verify, write verify and erase verify operations. A register to temporarily hold write data in a memory cell during writing is also used as a register to hold a flag showing that writing has ended during write verify. Also, a circuit comprised of one nMOS transistor is utilized as a means to change values on the write-end flag.
    • 通过在上下形成源极线和数据线,并且通过使通道正面上下而制造具有小表面积的存储单元。 每个垂直堆叠的存储单元的本地数据线通过分子氧化物半导体的单独选择连接到全局数据线,并且通过联合使用诸如全局数据线和外围电路的外围电路来避免使用大的表面积 通过以定时复用方式执行读和写操作来感测放大器。 此外,利用相对于读出非破坏性的多层和存储单元(浮动电极单元)中的数据线,以允许在字线和数据线的所有交叉点处放置存储单元,同时具有折叠的数据线结构 。 即使在读取验证,写入验证和擦除验证操作中的任何一个中,通过建立用于相同虚拟单元的标准阈值电压来获得改善的噪声容限。 在写入期间暂时保持写入数据在存储单元中的寄存器也被用作寄存器来保存写入验证期间写入结束的标志。 此外,由一个nMOS晶体管组成的电路被用作改变写入端标志的值的手段。
    • 8. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06194759B1
    • 2001-02-27
    • US09436225
    • 1999-11-09
    • Toshiaki SanoTomoyuki IshiiKazuo YanoToshiyuki Mine
    • Toshiaki SanoTomoyuki IshiiKazuo YanoToshiyuki Mine
    • H01L2976
    • B82Y10/00G11C11/5621G11C11/5628G11C11/5635G11C11/5642G11C11/5671G11C16/0416G11C16/10G11C16/16G11C16/26G11C2216/08H01L27/115H01L29/42324H01L29/66825H01L29/7883H01L29/7888
    • A memory cell with a small surface area is fabricated by forming source lines and data lines above and below and by running the channels to face up and down. The local data lines for each vertically stacked memory cell are connected to a global data line by way of separate selection by a molecular oxide semiconductor, and use of a large surface area is avoided by making joint use of peripheral circuits such as global data lines and sensing amplifiers by performing read and write operations in a timed multiplex manner. Moreover, data lines in multi-layers and memory cells (floating electrode cell) which are non-destructive with respect to readout are utilized to allow placement of memory cells at all intersecting points of word lines and data lines while having a folded data line structure. An improved noise tolerance is attained by establishing a standard threshold voltage for identical dummy cells even in any of the read verify, write verify and erase verify operations. A register to temporarily hold write data in a memory cell during writing is also used as a register to hold a flag showing that writing has ended during write verify. Also, a circuit comprised of one nMOS transistor is utilized as a means to change values on the write-end flag.
    • 通过在上下形成源极线和数据线,并且通过使通道正面上下而制造具有小表面积的存储单元。 每个垂直堆叠的存储单元的本地数据线通过分子氧化物半导体的单独选择连接到全局数据线,并且通过联合使用诸如全局数据线和外围电路的外围电路来避免使用大的表面积 通过以定时复用方式执行读和写操作来感测放大器。 此外,利用相对于读出非破坏性的多层和存储单元(浮动电极单元)中的数据线,以允许在字线和数据线的所有交叉点处放置存储单元,同时具有折叠的数据线结构 。 即使在读取验证,写入验证和擦除验证操作中的任何一个中,通过建立用于相同虚拟单元的标准阈值电压来获得改善的噪声容限。 在写入期间暂时保持写入数据在存储单元中的寄存器也被用作寄存器来保存写入验证期间写入结束的标志。 此外,由一个nMOS晶体管组成的电路被用作改变写入端标志的值的手段。
    • 9. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US6040605A
    • 2000-03-21
    • US236630
    • 1999-01-26
    • Toshiaki SanoTomoyuki IshiiKazuo YanoToshiyuki Mine
    • Toshiaki SanoTomoyuki IshiiKazuo YanoToshiyuki Mine
    • G11C11/56G11C16/04G11C16/10G11C16/16G11C16/26H01L21/336H01L27/115H01L29/423H01L29/788H01L29/76H01L29/94H01L31/062H01L31/113
    • B82Y10/00G11C11/5621G11C11/5628G11C11/5635G11C11/5642G11C11/5671G11C16/0416G11C16/10G11C16/16G11C16/26H01L27/115H01L29/42324H01L29/66825H01L29/7883H01L29/7888G11C2216/08
    • A memory cell with a small surface area is fabricated by forming source lines and data lines above and below and by running the channels to face up and down. The local data lines for each vertically stacked memory cell are connected to a global data line by way of separate selection by a molecular oxide semiconductor, and use of a large surface area is avoided by making joint use of peripheral circuits such as global data lines and sensing amplifiers by performing read and write operations in a timed multiplex manner. Moreover, data lines in multi-layers and memory cells (floating electrode cell) which are non-destructive with respect to readout are utilized to allow placement of memory cells at all intersecting points of word lines and data lines while having a folded data line structure. An improved noise tolerance is attained by establishing a standard threshold voltage for identical dummy cells even in any of the read verify, write verify and erase verify operations. A register to temporarily hold write data in a memory cell during writing is also used as a register to hold a flag showing that writing has ended during write verify. Also, a circuit comprised of one nMOS transistor is utilized as a means to change values on the write-end flag.
    • 通过在上下形成源极线和数据线,并且通过使通道正面上下而制造具有小表面积的存储单元。 每个垂直堆叠的存储单元的本地数据线通过分子氧化物半导体的单独选择连接到全局数据线,并且通过联合使用诸如全局数据线和外围电路的外围电路来避免使用大的表面积 通过以定时复用方式执行读和写操作来感测放大器。 此外,利用相对于读出非破坏性的多层和存储单元(浮动电极单元)中的数据线,以允许在字线和数据线的所有交叉点处放置存储单元,同时具有折叠的数据线结构 。 即使在读取验证,写入验证和擦除验证操作中的任何一个中,通过建立用于相同虚拟单元的标准阈值电压来获得改善的噪声容限。 在写入期间暂时保持写入数据在存储单元中的寄存器也被用作寄存器来保存写入验证期间写入结束的标志。 此外,由一个nMOS晶体管组成的电路被用作改变写入端标志的值的手段。