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    • 1. 发明申请
    • METHOD FOR FABRICATION OF SEMICONDUCTOR DEVICE
    • 半导体器件制造方法
    • US20080261357A1
    • 2008-10-23
    • US11956858
    • 2007-12-14
    • Norifumi KAMESHIROToshiyuki MineTomoyuki IshiiToshiaki Sano
    • Norifumi KAMESHIROToshiyuki MineTomoyuki IshiiToshiaki Sano
    • H01L21/84
    • H01L29/66757H01L29/66613H01L29/66772
    • After forming a source-drain material film on an insulator layer, an opening portion reaching the insulator layer is formed in the source-drain material film. Then, a channel having desired thickness and a gate insulator are sequentially formed on the insulator layer and the source-drain material film in the opening portion. Thereafter, a gate material film embedding the opening portion is formed on the gate insulator. Subsequently, a cap film is formed on the gate material film, thereby forming the gate made of the gate material film. Then, a mask layer is formed on the source-drain material film. Next, the source-drain material film not protected by the mask layer is removed while protecting the gate by the cap film, thereby leaving the source-drain material film on both sides of the gate. The source-drain material film on one side becomes the source and that on the other side becomes the drain.
    • 在绝缘体层上形成源极 - 漏极材料膜之后,在源极 - 漏极材料膜中形成到达绝缘体层的开口部分。 然后,在开口部分的绝缘体层和源极 - 漏极材料膜上依次形成具有期望厚度的沟道和栅极绝缘体。 此后,在栅极绝缘体上形成嵌入开口部的栅极材料膜。 随后,在栅极材料膜上形成盖膜,从而形成由栅极材料膜制成的栅极。 然后,在源极 - 漏极材料膜上形成掩模层。 接下来,除去未被掩模层保护的源极 - 漏极材料膜,同时通过盖膜保护栅极,从而在栅极的两侧留下源极 - 漏极材料膜。 一侧的源极 - 漏极材料膜成为源极,而另一侧的源极 - 漏极材料膜变成漏极。
    • 6. 发明授权
    • Method for fabrication of semiconductor device
    • 半导体器件制造方法
    • US07772053B2
    • 2010-08-10
    • US11956858
    • 2007-12-14
    • Norifumi KameshiroToshiyuki MineTomoyuki IshiiToshiaki Sano
    • Norifumi KameshiroToshiyuki MineTomoyuki IshiiToshiaki Sano
    • H01L21/00
    • H01L29/66757H01L29/66613H01L29/66772
    • After forming a source-drain material film on an insulator layer, an opening portion reaching the insulator layer is formed in the source-drain material film. Then, a channel having desired thickness and a gate insulator are sequentially formed on the insulator layer and the source-drain material film in the opening portion. Thereafter, a gate material film embedding the opening portion is formed on the gate insulator. Subsequently, a cap film is formed on the gate material film, thereby forming the gate made of the gate material film. Then, a mask layer is formed on the source-drain material film. Next, the source-drain material film not protected by the mask layer is removed while protecting the gate by the cap film, thereby leaving the source-drain material film on both sides of the gate. The source-drain material film on one side becomes the source and that on the other side becomes the drain.
    • 在绝缘体层上形成源极 - 漏极材料膜之后,在源极 - 漏极材料膜中形成到达绝缘体层的开口部分。 然后,在开口部分的绝缘体层和源极 - 漏极材料膜上依次形成具有期望厚度的沟道和栅极绝缘体。 此后,在栅极绝缘体上形成嵌入开口部的栅极材料膜。 随后,在栅极材料膜上形成盖膜,从而形成由栅极材料膜制成的栅极。 然后,在源极 - 漏极材料膜上形成掩模层。 接下来,除去未被掩模层保护的源极 - 漏极材料膜,同时通过盖膜保护栅极,从而在栅极的两侧留下源极 - 漏极材料膜。 一侧的源极 - 漏极材料膜成为源极,而另一侧的源极 - 漏极材料膜变成漏极。