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1. 发明授权

US08765002B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US08765002B2
公开(公告)日：2014-07-01
申请号：US13409879
申请日：2012-03-01
申请人： Tomoyuki Azuma , Kenji Yamada , Hiroyuki Araki , Koji Ando
发明人： Tomoyuki Azuma , Kenji Yamada , Hiroyuki Araki , Koji Ando
IPC分类号： C03C15/00
CPC分类号： H01L21/67075 , H01L21/67028 , H01L21/67051 , H01L21/6708 , H01L21/67167 , H01L21/67253
摘要： A substrate processing apparatus includes a first processing chamber and a second processing chamber, a first substrate holding unit that holds a substrate in the first processing chamber, a chemical solution supply unit that supplies a chemical solution containing an etching component and a thickening agent to the substrate held by the first substrate holding unit, a substrate transfer unit that transfers the substrate from the first processing chamber to the second processing chamber in a state in which the chemical solution is held on the substrate, and a second substrate holding unit that holds a plurality of substrates on each of which the chemical solution is held in the second processing chamber.
摘要翻译：基板处理装置包括第一处理室和第二处理室，第一处理室中保持基板的第一基板保持单元，向所述第一处理室供给含有蚀刻成分和增稠剂的化学溶液的化学溶液供给单元，由第一基板保持单元保持的基板，在将化学溶液保持在基板上的状态下将基板从第一处理室转移到第二处理室的基板转印单元，多个基板，每个基板上的化学溶液保持在第二处理室中。

2. 发明授权

US08815048B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US08815048B2
公开(公告)日：2014-08-26
申请号：US11853231
申请日：2007-09-11
申请人： Masahiro Miyagi , Masanobu Sato , Hiroyuki Araki
发明人： Masahiro Miyagi , Masanobu Sato , Hiroyuki Araki
IPC分类号： H01L21/461 , B08B3/04
CPC分类号： H01L21/67051
摘要： A substrate processing apparatus has a cup part for receiving processing liquid which is applied from a processing liquid applying part and is splashed from a substrate, and the cup part is formed of electrical insulation material. Hydrophilic treatment is performed on an outer annular surface of the cup part and water is held on the outer annular surface of the cup part while processing the substrate. With this structure, charged potential of the cup part generated in splashing of pure water can be suppressed by the water held on the outer annular surface, without greatly increasing the manufacturing cost of the substrate processing apparatus by forming the cup part with special conductive material. As a result, it is possible to prevent electric discharge from occurring on the substrate due to induction charging of the substrate, in application of the processing liquid onto the substrate.
摘要翻译：基板处理装置具有用于接收从处理液施加部施加并从基板溅出的处理液的杯部，杯部由电绝缘材料形成。在杯部的外环形表面上进行亲水处理，并且在处理基板的同时将水保持在杯部的外环形表面上。通过这种结构，通过保持在外环形表面上的水可以抑制在纯水溅出中产生的杯部分的带电电位，而不会通过用特殊导电材料形成杯部而大大增加基板处理装置的制造成本。结果，可以在将处理液施加到基板上时防止由于基板的感应充电而在基板上发生放电。

3. 发明授权

US07670283B2 Endoscope information system 有权
标题翻译：内窥镜信息系统
公开(公告)号：US07670283B2
公开(公告)日：2010-03-02
申请号：US10693432
申请日：2003-10-24
申请人： Hiroyuki Araki
发明人： Hiroyuki Araki
IPC分类号： A61B1/00
CPC分类号： A61B1/00059 , A61B1/00006 , A61B1/00057 , A61B1/04 , A61B2560/0271 , A61B2560/0276 , G06F19/00 , G06Q30/016 , G06Q50/22 , G16H40/40
摘要： A history information obtaining unit obtains information about a use history of an endoscope. An estimating unit makes an estimation of a secular change in the endoscope from its use start until the present time based on this information. A displaying unit displays a ratio of a result of the estimation made by the estimating unit to the degree of the secular change, which is preset for the endoscope.
摘要翻译：历史信息获取单元获取关于内窥镜的使用历史的信息。基于该信息，估计单元从其使用开始至现在的时间估计内窥镜的长期变化。显示单元显示由估计单元估计的结果与针对内窥镜预设的长期变化的程度的比率。

4. 发明申请

US20080078423A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：US20080078423A1
公开(公告)日：2008-04-03
申请号：US11860733
申请日：2007-09-25
申请人： Hiroyuki Araki , Toyohide Hayashi
发明人： Hiroyuki Araki , Toyohide Hayashi
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , H01L21/02057 , H01L21/68728 , H01L21/68742
摘要： Holes having a variety of shapes exist on a surface of a substrate. When pure water is supplied on the substrate in a rinsing process, part of the pure water enters the holes. The pure water which have entered the holes can be hardly shaken off even though the substrate is rotated at a high speed. Therefore, HFE is held on the substrate so as to form an HFE layer after the rinsing process. In this case, the HFE enters the holes while the pure water emerges from the holes to the upper surface of the HFE due to a difference in specific gravity between the pure water and the HFE. Thus, the pure water is reliably prevented from remaining in the holes.
摘要翻译：具有各种形状的孔存在于基板的表面上。当在漂洗过程中在基材上供应纯水时，部分纯水进入孔中。进入孔的纯水即使基材高速旋转也难以摇动。因此，HFE被保持在基板上，以便在漂洗过程之后形成HFE层。在这种情况下，由于纯水和HFE之间的比重差异，HFE进入孔，而纯水从孔到HFE的上表面出现。因此，可靠地防止纯水残留在孔中。

5. 发明授权

US06354311B1 Substrate drying apparatus and substrate processing apparatus 失效
标题翻译：基板干燥装置和基板处理装置
公开(公告)号：US06354311B1
公开(公告)日：2002-03-12
申请号：US09522205
申请日：2000-03-09
申请人： Masahiro Kimura , Hiroyuki Araki
发明人： Masahiro Kimura , Hiroyuki Araki
IPC分类号： B08B704
CPC分类号： H01L21/67034 , H01L21/67028 , Y10S134/902
摘要： A deionized water temperature control part cools deionized water which is supplied from a deionized water supply source into a processing bath through a pipe after completely cleaning a substrate in the processing bath for maintaining the deionized water at a constant temperature which is lower than the ordinary temperature. A supply port of an IPA.N2 supply part provided in a casing of a multi-functional processing part is directed upward, thereby supplying IPA vapor upward with carrier gas of N2 for forming an atmosphere containing IPA vapor in high concentration above the processing bath. Thus, the substrate cooled to a low temperature is dried in the atmosphere containing the IPA vapor of the ordinary temperature in the upper portion of the processing bath when pulled up from the processing bath. Thus, the amount of the IPA vapor dissolved in the deionized water stored in the processing bath may be small, whereby consumption of the IPA vapor as well as generation of particles can be suppressed.
摘要翻译：去离子水温度控制部件在去离子水中冷却去离子水，所述去离子水在完全清洁处理槽中的基底之后通过管道从加工槽中提供到处理槽中，以将去离子水保持在低于常温的恒定温度。设置在多功能处理部件的壳体中的IPA.N2供给部的供给口朝向上方，从而向N 2的载气向上供给IPA蒸气，以形成含有高浓度的IPA蒸汽的气氛，高于处理槽。因此，在从处理槽拉出时，在含有处理槽上部的常温的IPA蒸气的气氛中冷却到低温的基板被干燥。因此，溶解在处理槽中的去离子水中的IPA蒸气的量可能较小，从而可以抑制IPA蒸气的消耗以及颗粒的产生。

6. 发明授权

US06352083B1 Substrate treating apparatus and substrate treating method 有权
标题翻译：基板处理装置及基板处理方法
公开(公告)号：US06352083B1
公开(公告)日：2002-03-05
申请号：US09195190
申请日：1998-11-17
申请人： Hiroyuki Araki , Kenichiro Arai , Masaaki Yabuta
发明人： Hiroyuki Araki , Kenichiro Arai , Masaaki Yabuta
IPC分类号： B08B300
CPC分类号： H01L21/67057 , B08B3/102 , H01L21/67051
摘要： A control unit controls a lifter to raise at least part of each of a group of substrates above the liquid level of a treating liquid in a treating bath. Thereafter, a valve is opened to drain the treating liquid from the treating bath at a high speed. As a result, a physical force to tilt and adhere an upper portion of the adjacent substrates accompanied by lowering of the liquid level of the treating liquid due to the high speed drainage acts upon a lower portion of the substrates near the lowered liquid level of the treating liquid, thereby reducing the physical force exerted on the substrates. This arrangement, even if a holding interval between the substrates is narrowed at a half of a normal pitch, eliminates a contact of the adjacent substrates and prevents damage of the substrates due to the contact without providing an additional member such as a substrate support guide in the treating bath.
摘要翻译：控制单元控制升降器，以将处理液中的处理液的液面以上的一组基板中的每一个的至少一部分升高。此后，打开阀门以高速排出处理液。结果，伴随着由于高速排水引起的处理液的液面的降低而倾斜并附着相邻基板的上部的物理力作用在基板的较低部分附近，从而减少施加在基板上的物理力。这种布置，即使基板之间的保持间隔在正常间距的一半处变窄，消除了相邻基板的接触，并且防止了由于接触而导致的基板的损坏，而没有提供诸如基板支撑引导件的附加构件治疗浴。

7. 发明授权

US07885826B2 Medical service support system, medical service support server, and medical service support terminal for supporting medical service 有权
标题翻译：医疗服务支持系统，医疗服务支持服务器，医疗服务支持终端支持医疗服务
公开(公告)号：US07885826B2
公开(公告)日：2011-02-08
申请号：US12197507
申请日：2008-08-25
申请人： Hiroyuki Araki , Shinichi Omori
发明人： Hiroyuki Araki , Shinichi Omori
IPC分类号： G06Q10/00 , G06Q50/00 , A61B5/00 , G06F19/00
CPC分类号： G06F19/3456 , G06F19/00 , G06Q10/10 , G06Q50/22 , G06Q50/24 , G16H40/20
摘要： In the embodiment of the present invention, when identification information acquired from a drug or instrument to be used on a patient is not included in schedule information stored beforehand, a user is notified to confirm that the identification information is not included in the schedule information. After the notification is provided, in registering the acquired identification information as practice details, the name of a doctor who instructed to use the drug or instrument, which is different from the drug or instrument specified by schedule information, and the reason for the instruction are registered, while associated with the practice details. Accordingly, drugs or instruments necessary for patients can be used in an appropriate manner.
摘要翻译：在本发明的实施例中，当从用于患者的药物或器具获取的识别信息不包括在预先存储的调度信息中时，通知用户以确认标识信息不包括在调度信息中。在提供通知后，在获取的身份信息作为实践细节登记时，指示使用药物或器具的医生名称与由时间表信息指定的药物或器械不同，以及指示的原因是注册，同时与实践细节相关联。因此，可以以适当的方式使用患者所需的药物或器械。

8. 发明授权

US07549428B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07549428B2
公开(公告)日：2009-06-23
申请号：US11190620
申请日：2005-07-27
申请人： Hiroshi Masuda , Hiroyuki Araki
发明人： Hiroshi Masuda , Hiroyuki Araki
IPC分类号： B08B3/04
CPC分类号： H01L21/67057 , Y10S134/902
摘要： A substrate processing apparatus includes a photosensor for detecting the presence/absence of a substrate in each place within a carrier cassette, a pair of processing tanks for performing the same process at the same time, and a supply mechanism for supplying a processing solution to the processing tanks independently. The number of substrates is detected in accordance with the result of the detection of the photosensor. If the number of substrates detected is not greater than an allowable number for one of the processing tanks, the processing solution is supplied to only the one processing tank to perform the process. This reduces the consumption of the processing solution in a batch process.
摘要翻译：基板处理装置包括用于检测载体盒内的各处的基板的有无的光传感器，用于同时执行相同处理的一对处理槽，以及用于将处理液提供给处理罐独立。根据光电传感器的检测结果检测基板的数量。如果检测到的基板的数量不大于其中一个处理槽的允许数量，则处理溶液仅提供给一个处理槽以执行处理。这减少了批处理中处理溶液的消耗。

9. 发明申请

US20080026976A1 Highly productive alpha-amylases 审中-公开
标题翻译：高生产力的α-淀粉酶
公开(公告)号：US20080026976A1
公开(公告)日：2008-01-31
申请号：US11590769
申请日：2006-11-01
申请人： Hiroyuki Araki , Keiji Endo , Hiroshi Hagihara , Kazuaki Igarashi , Yasuhiro Hayashi , Katsuya Ozaki
发明人： Hiroyuki Araki , Keiji Endo , Hiroshi Hagihara , Kazuaki Igarashi , Yasuhiro Hayashi , Katsuya Ozaki
IPC分类号： C11D3/386 , C07H21/00 , C12N1/00 , C12N15/63 , C12N9/26 , C12P21/00
CPC分类号： C12N9/2417 , C11D3/386
摘要： The invention relates to mutant α-amylases that may be produced at high yield from recombinant microorganisms.
摘要翻译：本发明涉及可以从重组微生物以高产率产生的突变型α-淀粉酶。

10. 发明申请

US20080006302A1 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20080006302A1
公开(公告)日：2008-01-10
申请号：US11773629
申请日：2007-07-05
申请人： Hiroyuki Araki , Masahiro Miyagi , Masanobu Sato
发明人： Hiroyuki Araki , Masahiro Miyagi , Masanobu Sato
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , H01L21/0206 , H01L21/67028
摘要： The substrate treatment method includes a deionized water supply step of supplying deionized water on a surface of a substrate; a resistivity reducing gas supply step of supplying a resistivity reducing gas so as to change ambient air to which the deionized water in contact with the surface of the substrate is exposed, into an ambient of the resistivity reducing gas capable of reducing the resistivity of deionized water; and a deionized water removal step of removing the deionized water from the surface of the substrate after the resistivity reducing gas supply step.
摘要翻译：基板处理方法包括在基板的表面上供给去离子水的去离子水供给工序; 电阻率降低气体供给步骤，其供给电阻率降低气体，以便将与基板表面接触的去离子水暴露于其中的环境空气转化成能够降低去离子水电阻率的电阻率降低气体的环境 ; 以及去离子水去除步骤，在所述电阻率降低气体供给步骤之后从所述基板的表面除去去离子水。

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