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    • 4. 发明授权
    • Microprocessor boot-up controller, nonvolatile memory controller, and information processing system
    • 微处理器启动控制器,非易失性存储器控制器和信息处理系统
    • US07616507B2
    • 2009-11-10
    • US11838463
    • 2007-08-14
    • Hiroshi SukegawaKenji SakaueHitoshi Tsunoda
    • Hiroshi SukegawaKenji SakaueHitoshi Tsunoda
    • G11C7/00
    • G11C11/5642G06F9/4403G11C16/0483G11C16/20G11C29/74G11C2211/5641
    • A memory system including a nonvolatile semiconductor memory device and a controller. The memory device includes a plurality of word lines; and a plurality of memory cells each connected to a corresponding one of the word lines and each having N threshold voltages for storing multi-valued level, where N is a natural number of 4 or greater; wherein stored data in each of the plurality of memory cells constitutes a plurality of pages, at least only a part of multi-value level is used for storing data, a data “1” is always written to a lower page, a “0” or “1” binary data is written to an upper page, the same data is written in each of the pages when writing in the nonvolatile memory device, and only part of the pages to which the same data is written is accessed when reading out the nonvolatile memory device.
    • 一种包括非易失性半导体存储器件和控制器的存储器系统。 存储装置包括多个字线; 以及多个存储单元,每个存储单元连接到对应的一条字线,并且每个具有用于存储多值电平的N个阈值电压,其中N是4或更大的自然数; 其中,所述多个存储单元的每一个中存储的数据构成多个页面,至少只有一部分多值级别用于存储数据,数据“1”总是写入下页,“0” 或“1”二进制数据被写入上部页面时,在写入非易失性存储器件时,在每个页面中写入相同的数据,并且只有读取相同数据的页面的一部分才被读取 非易失性存储器件。
    • 6. 发明申请
    • Soi wafer and process for producing the same
    • Soi晶圆和生产过程相同
    • US20060246689A1
    • 2006-11-02
    • US10554960
    • 2004-05-07
    • Kiyotaka TakanoHitoshi Tsunoda
    • Kiyotaka TakanoHitoshi Tsunoda
    • H01L21/30H01L21/46H01L27/12H01L27/01H01L31/0392
    • H01L21/76251Y10S65/08Y10T117/10
    • The present invention provides an SOI wafer having at least an SOI layer, in which a plain orientation of the SOI layer is off-angled from {110} only in a direction to , and an off-angle is from 5 minutes to 2 degrees, and a method of producing an SOI wafer comprising at least bonding a base wafer and a bond wafer consisting of a silicon single crystal, and forming an SOI layer by thinning the bond wafer, wherein the bond wafer is used where a plain orientation thereof is off-angled from {110} only in a direction to , and an off-angle is from 5 minutes to 2 degrees. Thereby, there can be provided an SOI wafer having both high uniformity of film thickness and good micro-roughness to be suitable for fabricating high speed devices, and provided a method of producing the SOI wafer.
    • 本发明提供了至少具有SOI层的SOI晶片,其中SOI层的平坦取向仅在{110}仅在<100>的方向偏角,偏角为5分钟至 以及制造SOI晶片的方法,所述SOI晶片至少包括接合由硅单晶构成的基底晶片和接合晶片,并且通过使所述接合晶片变薄来形成SOI层,其中所述接合晶片用于平坦取向 其从{110}仅在<100>的方向偏角,偏角为5分钟至2度。 由此,可以提供具有均匀性均匀的膜厚和良好的微粗糙度的SOI晶片,以适合于制造高速器件,并提供了制造SOI晶片的方法。
    • 8. 发明授权
    • SOI wafer and a method of producing the same
    • SOI晶片及其制造方法
    • US07357839B2
    • 2008-04-15
    • US10554960
    • 2004-05-07
    • Kiyotaka TakanoHitoshi Tsunoda
    • Kiyotaka TakanoHitoshi Tsunoda
    • C30B35/00C03C27/02
    • H01L21/76251Y10S65/08Y10T117/10
    • The present invention provides an SOI wafer having at least an SOI layer, in which a plain orientation of the SOI layer is off-angled from {110} only in a direction to , and an off-angle is from 5 minutes to 2 degrees, and a method of producing an SOI wafer comprising at least bonding a base wafer and a bond wafer consisting of a silicon single crystal, and forming an SOI layer by thinning the bond wafer, wherein the bond wafer is used where a plain orientation thereof is off-angled from {110} only in a direction to , and an off-angle is from 5 minutes to 2 degrees. Thereby, there can be provided an SOI wafer having both high uniformity of film thickness and good micro-roughness to be suitable for fabricating high speed devices, and provided a method of producing the SOI wafer.
    • 本发明提供了至少具有SOI层的SOI晶片,其中SOI层的平坦取向仅在{110}仅在<100>的方向偏角,偏角为5分钟至 以及制造SOI晶片的方法,所述SOI晶片至少包括接合由硅单晶构成的基底晶片和接合晶片,并且通过使所述接合晶片变薄来形成SOI层,其中所述接合晶片用于平坦取向 其从{110}仅在<100>的方向偏角,偏角为5分钟至2度。 由此,可以提供具有均匀性均匀的膜厚和良好的微粗糙度的SOI晶片,以适合于制造高速器件,并提供了制造SOI晶片的方法。
    • 9. 发明申请
    • Microprocessor boot-up controller, nonvolatile memory controller, and information processing system
    • 微处理器启动控制器,非易失性存储器控制器和信息处理系统
    • US20050223211A1
    • 2005-10-06
    • US11084039
    • 2005-03-21
    • Hiroshi SukegawaKenji SakaueHitoshi Tsunoda
    • Hiroshi SukegawaKenji SakaueHitoshi Tsunoda
    • G06F11/10G06F9/00G06F9/445G06F12/00G06F12/02
    • G11C11/5642G06F9/4403G11C16/0483G11C16/20G11C29/74G11C2211/5641
    • The present invention enables a CPU to access a SRAM in the shortest time in sync with the SRAM's ready timing, resulting in a reduction of avarage system boot-up time. The present invention is a processor boot-up controller that includes: volatile memory, which is connected to nonvolatile memory; a selector, which transfers boot-up codes to the volatile memory from the nonvolatile memory; a controller for the nonvolatile memory which is configured from a boot-up control sequencer, which transmits CPU read-in data to the CPU and brings the CPU into a wait state until boot-up code transfer completes; and an error detection and correction unit; is connected to the external CPU and the nonvolatile memory, and boot-up controls the CPU by reading data from the nonvolatile memory. The present invention is an information processing system using a controller for nonvolatile memory, a microprocessor boot-up controller, and multi-valued nonvolatile memory.
    • 本发明使得CPU能够在SRAM的就绪定时同步的最短时间内访问SRAM,从而减少了系统启动时间。 本发明是一种处理器启动控制器,其包括:易失性存储器,其连接到非易失性存储器; 选择器,其将启动代码从非易失性存储器传送到易失性存储器; 用于非易失性存储器的控制器,其由引导控制定序器配置,其将CPU读入数据发送到CPU并使CPU进入等待状态,直到引导代码传送完成; 和错误检测和校正单元; 连接到外部CPU和非易失性存储器,并通过从非易失性存储器读取数据启动控制CPU。 本发明是使用非易失性存储器的控制器,微处理器启动控制器和多值非易失性存储器的信息处理系统。