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1. 发明授权

US5358885A Method of manufacturing a field effect transistor with a T-shaped gate electrode and reduced capacitance 失效
标题翻译：制造具有T形栅电极和降低电容的场效应晶体管的方法
公开(公告)号：US5358885A
公开(公告)日：1994-10-25
申请号：US46811
申请日：1993-04-16
申请人： Tomoki Oku , Masayuki Sakai , Yasutaka Kohno
发明人： Tomoki Oku , Masayuki Sakai , Yasutaka Kohno
IPC分类号： H01L21/285 , H01L21/335 , H01L29/423 , H01L21/44
CPC分类号： H01L29/66462 , H01L21/28587 , H01L29/42316 , Y10S148/10 , Y10S148/139 , Y10S438/951
摘要： A method of producing a field effect transistor includes depositing a first insulating film and a refractory metal on a semiconductor substrate, forming a first aperture penetrating the first insulating film and the refractory metal film to provide a gate electrode production region, depositing a second insulating film on the refractory metal film, etching the second insulating film in a direction perpendicular to the surface of the substrate leaving portions of the second insulating film on opposite side walls of the first aperture to form a second aperture, defining a gate length, depositing a gate metal, and patterning the gate metal layer, the first insulating film, and the refractory metal film in a prescribed width to form a T-shaped gate structure. During etching the second insulating film, since the refractory metal film serves as a etch stopping layer, the first insulating film is not etched and its thickness remains as deposited. Therefore, the space between the over-hanging portion of the T-shaped gate electrode and the source electrode increases and the gate-to-source capacitance is reduced.
摘要翻译：制造场效应晶体管的方法包括在半导体衬底上沉积第一绝缘膜和难熔金属，形成穿透第一绝缘膜的第一孔和难熔金属膜以提供栅电极生产区，沉积第二绝缘膜在所述难熔金属膜上，在垂直于所述基板的表面的方向上蚀刻所述第二绝缘膜，从而将所述第二绝缘膜的部分留在所述第一孔的相对侧壁上，以形成限定栅极长度的第二孔，金属，并以规定的宽度图案化栅极金属层，第一绝缘膜和难熔金属膜，以形成T形栅极结构。在蚀刻第二绝缘膜期间，由于难熔金属膜用作蚀刻停止层，所以第一绝缘膜不被蚀刻并且其厚度保持沉积。因此，T形栅电极的过悬挂部分与源电极之间的空间增加，并且栅极 - 源极电容减小。

2. 发明授权

US5322806A Method of producing a semiconductor device using electron cyclotron resonance plasma CVD and substrate biasing 失效
标题翻译：使用电子回旋共振等离子体CVD和衬底偏压制造半导体器件的方法
公开(公告)号：US5322806A
公开(公告)日：1994-06-21
申请号：US393950
申请日：1989-08-15
申请人： Yasutaka Kohno , Masayuki Sakai
发明人： Yasutaka Kohno , Masayuki Sakai
IPC分类号： H01L21/31 , H01L21/28 , H01L21/285 , H01L21/316 , H01L21/338 , H01L21/768 , H01L29/812 , H01L21/00 , H01L21/02 , H01L21/265 , H01L21/44
CPC分类号： H01L29/66878 , H01L21/02164 , H01L21/022 , H01L21/02211 , H01L21/02274 , H01L21/31608 , H01L21/76819
摘要： A method of producing a semiconductor device including the steps of depositing a refractory metal gate electrode at a predetermined region of a semi-insulating substrate surface, and thereafter depositing an insulating film at regions other than the gate electrode region, wherein the production of the insulating film is carried out by an electron cyclotron resonance plasma CVD method while applying a high frequency electrical bias to the substrate.
摘要翻译：一种制造半导体器件的方法，包括以下步骤：在半绝缘衬底表面的预定区域沉积难熔金属栅极电极，然后在除栅电极区域之外的区域沉积绝缘膜，其中绝缘通过电子回旋共振等离子体CVD法进行膜的同时向基板施加高频电偏压。

3. 发明授权

US08794951B2 Mold for resin molding, method for manufacturing mold for resin molding, and resin molded product 有权
标题翻译：用于树脂模制的模具，用于制造用于树脂模制的模具的方法和树脂模制产品
公开(公告)号：US08794951B2
公开(公告)日：2014-08-05
申请号：US12517042
申请日：2007-11-21
申请人： Sadayuki Yoneshima , Masayuki Sakai , Hisao Aota , Hiroshi Watanabe , Mitsuaki Samejima , Yumiko Omiya
发明人： Sadayuki Yoneshima , Masayuki Sakai , Hisao Aota , Hiroshi Watanabe , Mitsuaki Samejima , Yumiko Omiya
IPC分类号： B29C33/10 , B29C33/40 , B29C51/36
CPC分类号： B29C33/10 , B29C33/3814 , B29C33/40 , B29C51/36
摘要： An object of the present invention is to provide a mold for resin molding which ensures ventilation characteristic without requiring an enormous amount of work.The mold for resin molding of the present invention includes: a mold 12; a design layer 16 formed inside the mold 12; and a air permeable interposing layer 22 for forming the design layer 16 on an inner surface of the mold 12. The mold 12 forms a ventilating throughhole 14. The design layer 16 is made of a resin having projections and depressions on the surface, and has a ventilating throughhole 18 formed so as to couple to the ventilating throughhole 14. The air permeable interposing layer 22 is arranged next to the inner surface of the mold 12 so that an inner surface of the design layer 16, the ventilating throughhole 18 of the design layer 16, and the ventilating throughhole 14 of the mold 12 couple to each other.
摘要翻译：本发明的目的是提供一种用于树脂模制的模具，其确保通风特性而不需要大量的工作。本发明的树脂成型用模具包括：模具12; 形成在模具12内部的设计层16; 以及用于在模具12的内表面上形成设计层16的透气中介层22.模具12形成通风通孔14.设计层16由表面上具有凹凸的树脂制成，并具有形成为连接到通风通孔14的通气孔18.透气性中介层22靠近模具12的内表面设置，使得设计层16的内表面，设计的通风通孔18 层16和模具12的通风通孔14彼此连接。

4. 外观设计

USD706329S1 Electronic camera 有权
公开(公告)号：USD706329S1
公开(公告)日：2014-06-03
申请号：US29411245
申请日：2012-01-18
申请人： Masayuki Sakai
设计人： Masayuki Sakai

5. 外观设计

USD660898S1 Electronic camera 有权
公开(公告)号：USD660898S1
公开(公告)日：2012-05-29
申请号：US29361632
申请日：2010-05-13
申请人： Masayuki Sakai , Masazumi Imai
设计人： Masayuki Sakai , Masazumi Imai

6. 外观设计

USD638456S1 Electronic camera 有权
公开(公告)号：USD638456S1
公开(公告)日：2011-05-24
申请号：US29340558
申请日：2009-07-21
申请人： Masayuki Sakai
设计人： Masayuki Sakai

7. 发明申请

US20100075149A1 MOLD FOR RESIN MOLDING, METHOD FOR MANUFACTURING MOLD FOR RESIN MOLDING, AND RESIN MOLDED PRODUCT 有权
标题翻译：用于树脂模制的模具，用于制造用于树脂模制的模具的方法和树脂模制产品
公开(公告)号：US20100075149A1
公开(公告)日：2010-03-25
申请号：US12517042
申请日：2007-11-21
申请人： Sadayuki Yoneshima , Masayuki Sakai , Hisao Aota , Hiroshi Watanabe , Mitsuaki Samejima , Yumiko Omiya
发明人： Sadayuki Yoneshima , Masayuki Sakai , Hisao Aota , Hiroshi Watanabe , Mitsuaki Samejima , Yumiko Omiya
IPC分类号： B32B17/10 , B29C33/10
CPC分类号： B29C33/10 , B29C33/3814 , B29C33/40 , B29C51/36
摘要： An object of the present invention is to provide a mold for resin molding which ensures ventilation characteristic without requiring an enormous amount of work. The mold for resin molding of the present invention includes: a mold 12; a design layer 16 formed inside the mold 12; and a air permeable interposing layer 22 for forming the design layer 16 on an inner surface of the mold 12. The mold 12 forms a ventilating throughhole 14. The design layer 16 is made of a resin having projections and depressions on the surface, and has a ventilating throughhole 18 formed so as to couple to the ventilating throughhole 14. The air permeable interposing layer 22 is arranged next to the inner surface of the mold 12 so that an inner surface of the design layer 16, the ventilating throughhole 18 of the design layer 16, and the ventilating throughhole 14 of the mold 12 couple to each other.
摘要翻译：本发明的目的是提供一种用于树脂模制的模具，其确保通风特性而不需要大量的工作。本发明的树脂成型用模具包括：模具12; 形成在模具12内部的设计层16; 以及用于在模具12的内表面上形成设计层16的透气中介层22.模具12形成通风通孔14.设计层16由表面上具有凹凸的树脂制成，并具有形成为连接到通风通孔14的通风通孔18.透气中介层22靠近模具12的内表面设置，使得设计层16的内表面，设计的通风通孔18 层16和模具12的通风通孔14彼此连接。

8. 发明授权

US07641833B2 Method for producing a pellet from a fiber-filled resin composition and injection-molded products thereof 失效
标题翻译：从纤维填充树脂组合物及其注射成型体制造颗粒的方法
公开(公告)号：US07641833B2
公开(公告)日：2010-01-05
申请号：US10594679
申请日：2005-04-12
申请人： Kei Aoki , Masayuki Sakai , Kazufumi Watanabe
发明人： Kei Aoki , Masayuki Sakai , Kazufumi Watanabe
IPC分类号： B29C47/60 , B29B7/24
CPC分类号： B29B9/14 , B29B7/90 , B29C47/1081 , B29C47/6025 , B29C47/6031 , B29C47/6037 , B29C47/6056 , B29C2947/9218 , B29C2947/92704
摘要： An object of the present invention is to economically produce a resin composition pellet with the degradation of resin suppressed, by using an ordinary extruder, the resin composition pellet being filled with a desired filling amount of a uniformly compounded fibrous filler, and having a required weight average fiber length, in particular, to produce a resin composition pellet used for a socket of a planar socket pin in which the pitch interval of a lattice area of a semiconductor device is 2.0 mm or less, the thickness of the lattice area is 0.5 mm or less, and the height of the socket is 5.0 mm or less. To achieve the object, in supplying 80 to 55% by weight of resin and 20 to 45% by weight of the fibrous filler with a weight average fiber length of 1 mm or more to an extruder to produce a resin composition pellet in which a weight average fiber length of a fibrous filler is 180 to 360 μm, a part of an amount (x) of the resin is supplied through a main feed port of the extruder, and the fibrous filler and a remaining amount (1−x) of the resin are supplied through a side-feed port so that x/(1−x) becomes 50/50 to 10/90% by weight.
摘要翻译：本发明的目的是通过使用普通的挤出机经济地生产树脂降解降解的树脂组合物颗粒，所述树脂组合物颗粒填充有所需的填充量的均匀复合的纤维填料并具有所需的重量平均纤维长度，特别是为了制造用于平面插座销的插座的树脂组合物颗粒，其中半导体器件的晶格面积的间距间隔为2.0mm或更小，晶格面积的厚度为0.5mm 以下，插座的高度为5.0mm以下。为了达到上述目的，向挤出机中供给80〜55重量％的树脂和20〜45重量％的重均纤维长度为1mm以上的纤维填料，制成树脂组合物颗粒，其中重量纤维填料的平均纤维长度为180〜360μm，树脂的量（x）的一部分通过挤出机的主供料口供给，纤维填料的剩余量（1-x）树脂通过侧进料口供给，使得x /（1-x）成为50/50至10/90重量％。

9. 外观设计

USD603886S1 Electronic camera 有权
公开(公告)号：USD603886S1
公开(公告)日：2009-11-10
申请号：US29321701
申请日：2008-07-22
申请人： Masayuki Sakai
设计人： Masayuki Sakai

10. 发明申请

US20090109325A1 PORTABLE DEVICE AND IMAGE PICKUP DEVICE 审中-公开
标题翻译：便携式设备和图像拾取设备
公开(公告)号：US20090109325A1
公开(公告)日：2009-04-30
申请号：US12261526
申请日：2008-10-30
申请人： Ryo IMAI , Kazuhisa Horikiri , Masayuki Sakai , Noriko Katayama , Atsushi Misawa
发明人： Ryo IMAI , Kazuhisa Horikiri , Masayuki Sakai , Noriko Katayama , Atsushi Misawa
IPC分类号： H04N5/225 , G03B17/00
CPC分类号： H04M1/0239 , G03B17/00 , H04M1/0227 , H04M1/0247 , H04M2250/52 , H04N5/2251 , H04N5/232 , H04N5/23245
摘要： A portable device having a first enclosure and a second enclosure, comprises: a linking device which slidably links the first enclosure and second enclosure in a slidable manner, the linking device permitting a first action of shifting the first enclosure between a first position and a second position in a plane, and a second action of shifting the first enclosure at least in a direction different from a direction of the first action in the plane using at least one of the first position and second position as a reference position; and a command input device which inputs a command to the portable device on the basis of at least the second action of the first enclosure, thereby enabling to operate the portable device according to the action of the first enclosure.
摘要翻译：一种具有第一外壳和第二外壳的便携式设备，包括：链接装置，其以可滑动的方式可滑动地连接所述第一外壳和第二外壳，所述连接装置允许在第一位置和第二外壳之间移动所述第一外壳的第一动作并且使用第一位置和第二位置中的至少一个作为参考位置，至少在与平面中的第一动作的方向不同的方向上移动第一外壳的第二动作; 以及命令输入装置，其基于至少第一外壳的第二动作向便携式装置输入命令，从而能够根据第一外壳的动作来操作便携式装置。

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