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    • 1. 发明授权
    • Thermosetting resin composition
    • 热固性树脂组合物
    • US08420216B2
    • 2013-04-16
    • US12669416
    • 2008-07-11
    • Tomokazu UmezawaTetsuo WadaHirofumi Inoue
    • Tomokazu UmezawaTetsuo WadaHirofumi Inoue
    • B32B27/40H05K1/02C08L75/04
    • H05K3/285C08G59/4246H01L23/293H01L2924/0002H05K2203/124Y10T428/31551Y10T428/31605Y10T428/31609H01L2924/00
    • The thermosetting resin composition according to the present invention includes a resin (A) containing two or more carboxyl groups and having a polyurethane structure, a strongly basic nitrogen-containing heterocyclic compound having pKa of 10.0 to 14.0 as a curing accelerator (B) and a curing agent (C). A cured product of the thermosetting resin composition is used as an insulating protective film for printed wiring boards, flexible printed wiring boards, chip-on-films, etc. The thermosetting resin composition of the invention has improved low-temperature curability and instantaneous curability, can realize tack-free property, can simultaneously realize low warpage property and electrical insulation property, does not contaminate a curing oven and the like by outgassing during heating, has a sufficient pot life, can form excellent cured products and insulating protective films, and can form solder resists and insulating protective films at low cost with good productivity.
    • 根据本发明的热固性树脂组合物包含含有两个或更多个羧基并具有聚氨酯结构的树脂(A),作为固化促进剂(B)的pKa为10.0〜14.0的强碱性含氮杂环化合物和 固化剂(C)。 热固性树脂组合物的固化物用作印刷线路板,柔性印刷电路板,片上胶片等的绝缘保护膜。本发明的热固性树脂组合物具有改善的低温固化性和瞬时固化性, 可实现无粘性,可同时实现低翘曲性和电绝缘性,加热时除气不会污染固化炉等,具有足够的使用期限,可形成优良的固化产物和绝缘保护膜,并可 以低成本形成阻焊和绝缘保护膜,生产率高。
    • 2. 发明申请
    • THERMOSETTING RESIN COMPOSITION
    • 热固性树脂组合物
    • US20100186996A1
    • 2010-07-29
    • US12669416
    • 2008-07-11
    • Tomokazu UmezawaTetsuo WadaHirofumi Inoue
    • Tomokazu UmezawaTetsuo WadaHirofumi Inoue
    • H05K1/02C08L75/04
    • H05K3/285C08G59/4246H01L23/293H01L2924/0002H05K2203/124Y10T428/31551Y10T428/31605Y10T428/31609H01L2924/00
    • The thermosetting resin composition according to the present invention includes a resin (A) containing two or more carboxyl groups and having a polyurethane structure, a strongly basic nitrogen-containing heterocyclic compound having pKa of 10.0 to 14.0 as a curing accelerator (B) and a curing agent (C). A cured product of the thermosetting resin composition is used as an insulating protective film for printed wiring boards, flexible printed wiring boards, chip-on-films, etc. The thermosetting resin composition of the invention has improved low-temperature curability and instantaneous curability, can realize tack-free property, can simultaneously realize low warpage property and electrical insulation property, does not contaminate a curing oven and the like by outgassing during heating, has a sufficient pot life, can form excellent cured products and insulating protective films, and can form solder resists and insulating protective films at low cost with good productivity.
    • 根据本发明的热固性树脂组合物包含含有两个或更多个羧基并具有聚氨酯结构的树脂(A),作为固化促进剂(B)的pKa为10.0〜14.0的强碱性含氮杂环化合物和 固化剂(C)。 热固性树脂组合物的固化物用作印刷线路板,柔性印刷电路板,片上胶片等的绝缘保护膜。本发明的热固性树脂组合物具有改善的低温固化性和瞬时固化性, 可实现无粘性,可同时实现低翘曲性和电绝缘性,加热时除气不会污染固化炉等,具有足够的使用期限,可形成优良的固化产物和绝缘保护膜,并可 以低成本形成阻焊和绝缘保护膜,生产率高。
    • 3. 发明授权
    • Electrostatic discharge protector
    • 静电放电保护器
    • US08625248B2
    • 2014-01-07
    • US13123262
    • 2009-10-06
    • Mina OnishiYoshimitsu IshiharaHirofumi InoueYukihiko Azuma
    • Mina OnishiYoshimitsu IshiharaHirofumi InoueYukihiko Azuma
    • H02H1/04H02H3/22
    • H01C7/12H01T4/10H05K1/0259H05K2201/09672H05K2201/09881
    • The present invention provides an electrostatic discharge protector capable of protecting electronic circuit boards having various designs from electrostatic discharge freely, simply and easily. The electrostatic discharge protector of the present invention comprises at least three conductive members containing one pair of electrodes and the conductive members other than the electrodes, the conductive members are each disposed in such a way that the gap between one conductive member and the other conductive member has a width of 0.1 to 10 μm, an insulating member is disposed and embedded in at least one of gaps having a width of 0.1 to 10 μm which are adjacent to each conductive member and one electrode is connected to the other electrode paired with the one electrode through the insulating member and the conductive members other than electrodes.
    • 本发明提供一种静电放电保护器,其能够简单且容易地保护具有各种设计的电子电路板免受静电放电。 本发明的静电放电保护器包括至少三个包含一对电极的导电构件和除电极之外的导电构件,导电构件各自设置成使得一个导电构件和另一个导电构件之间的间隙 具有0.1至10微米的宽度,绝缘构件设置并嵌入在与每个导电构件相邻的宽度为0.1至10μm的间隙中的至少一个中,并且一个电极连接到与该一个配对的另一个电极 电极通过绝缘构件和除电极之外的导电构件。
    • 4. 发明授权
    • Suspension system for vehicle
    • 车辆悬挂系统
    • US08398091B2
    • 2013-03-19
    • US12935703
    • 2009-05-08
    • Hirofumi InoueTakuhiro Kondo
    • Hirofumi InoueTakuhiro Kondo
    • B60G17/0165
    • B60G17/0157B60G17/06B60G2202/42B60G2400/102B60G2400/206B60G2400/252
    • A suspension system for a vehicle, including: an electromagnetic actuator configured to generate an actuator force and including a sprung-side unit supported by a sprung portion, an unsprung-side unit supported by an unsprung portion, a screw mechanism, and an electromagnetic motor; a connecting mechanism including a support spring for permitting one of the sprung-side and unsprung-side units to be floatingly supported as a floating unit by a unit-floatingly support portion that is one of the sprung and unsprung portions by which the floating unit is supported; and a controller including a sprung-vibration-damping control portion and a relative-vibration-damping control portion that is configured to execute a relative-vibration damping control for damping a vibration of the floating unit caused by the structure in which the floating unit is floatingly supported by the support spring.
    • 一种用于车辆的悬架系统,包括:电磁致动器,其被配置为产生致动器力,并且包括由簧上部支撑的簧上侧单元,由簧下部支撑的簧下侧单元,螺旋机构和电磁马达 ; 一种连接机构,包括:支撑弹簧,用于通过单元浮动支撑部分将所述簧上侧和簧下侧单元中的一个作为浮动单元浮动地支撑,所述单元浮动支撑部分是所述浮动单元和簧下侧单元之一 支持的; 以及控制器,其包括弹簧减振控制部分和相对减振控制部分,所述相关减振控制部分被配置为执行相对振动衰减控制,以减缓由所述浮动单元是 由支撑弹簧浮动支撑。
    • 8. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US08110867B2
    • 2012-02-07
    • US12240246
    • 2008-09-29
    • Shinichi WatanabeHirofumi Inoue
    • Shinichi WatanabeHirofumi Inoue
    • H01L27/115H01L21/336
    • H01L21/28123H01L29/4238
    • A semiconductor device includes a device isolation insulating film which is buried in a semiconductor substrate, a gate insulation film which is provided on the semiconductor substrate, a gate electrode which is provided on the gate insulation film, a source region and a drain region which are provided in the semiconductor substrate and spaced apart from each other in a manner to sandwich the gate electrode, both end portions of each of the source region and the drain region being offset from the device isolation insulating film in a channel width direction by a predetermined distance, and first and second gate electrode extension portions which are provided in a manner to cover both end portions of each of the source region and the drain region in a channel length direction.
    • 半导体器件包括埋在半导体衬底中的器件隔离绝缘膜,设置在半导体衬底上的栅极绝缘膜,设置在栅极绝缘膜上的栅极电极,源极区域和漏极区域 设置在半导体基板中并且以夹着栅电极的方式彼此间隔开,源极区域和漏极区域中的每一个的两个端部在沟道宽度方向上偏离器件隔离绝缘膜预定距离 以及第一和第二栅电极延伸部分,其以在沟道长度方向上覆盖源极区域和漏极区域中的每一个的两个端部的方式设置。