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1. 发明授权

US06974071B2 Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components 失效
标题翻译：波峰焊双面针孔电子元件的倾斜焊波方法
公开(公告)号：US06974071B2
公开(公告)日：2005-12-13
申请号：US10605257
申请日：2003-09-18
申请人： Todd H. Buley , Brian Chapman , Roger Lam , Wai Mon Ma , John P. Weir
发明人： Todd H. Buley , Brian Chapman , Roger Lam , Wai Mon Ma , John P. Weir
IPC分类号： B23K1/00 , B23K1/08 , B23K1/20 , B23K3/06 , B23K3/08 , H05K3/34 , B23K37/02
CPC分类号： B23K3/087 , B23K1/0016 , B23K1/085 , B23K1/20 , B23K3/0653 , B23K3/08 , B23K2101/42 , H05K3/3468 , H05K2201/10189 , H05K2203/0165 , H05K2203/1527 , H05K2203/304
摘要： An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.
摘要翻译：用于将焊料施加到电子电路板基板的装置包括用于产生焊料的熔融波的焊波装置，以及其上方的可移动的基板支架。衬底保持器包括用于电子电路板衬底的支撑件，用于相对于其方向以一定角度倾斜并且在其底部上具有开口，用于接近设置在衬底的端部附近的突出连接器与熔融焊料波。当衬底保持器在焊波装置上移动时，倾斜角足以防止设置在距离衬底端部一定距离处的部件接触熔融焊波。衬底保持器中的屏蔽件防止组件不被焊接以接触熔融焊料波。

2. 发明授权

US07841078B2 Method of optimizing land grid array geometry 有权
标题翻译：优化土地网格阵列几何的方法
公开(公告)号：US07841078B2
公开(公告)日：2010-11-30
申请号：US11970346
申请日：2008-01-07
申请人： Roger Lam , Wai Mon Ma , Arch F. Nuttall
发明人： Roger Lam , Wai Mon Ma , Arch F. Nuttall
IPC分类号： H05K3/30 , H01L23/495
CPC分类号： H05K3/0014 , H05K1/0271 , H05K3/0058 , H05K2201/09036 , H05K2201/10719 , H05K2201/2009 , H05K2203/0278 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49213 , Y10T29/49218
摘要： Disclosed is a method, system, and computer program storage product for optimizing land grid array site geometry on an electronic assembly mounting. A first member including at least one convex region is aligned with a first portion of an electronic assembly mounting. A second member is aligned with a second portion of the electronic assembly mounting. The second portion includes at least one concave region corresponding to the convex region of the first portion. The second member includes a dome-shaped region having a predefined geometry. Heat is applied to at least one of the electronic assembly mounting, the first member, and the second member. Pressure is applied to at least one of the first member and the second member to reshape the convex region into a substantially flat surface. Applying pressure also reshapes the concave region into a geometry corresponding to the predefined geometry of the dome-shaped region.
摘要翻译：公开了一种用于在电子组件安装件上优化陆地网格阵列位置几何的方法，系统和计算机程序存储产品。包括至少一个凸起区域的第一构件与电子组件安装件的第一部分对准。第二构件与电子组件安装件的第二部分对准。第二部分包括对应于第一部分的凸起区域的至少一个凹入区域。第二构件包括具有预定几何形状的圆顶形区域。热量被施加到电子组件安装件，第一构件和第二构件中的至少一个。将压力施加到第一构件和第二构件中的至少一个，以将凸区域重新形成为基本平坦的表面。施加压力还将凹区重新形成对应于圆顶形区域的预定几何形状的几何形状。

3. 发明申请

US20090172941A1 LAND GRID ARRAY SITE GEOMETRY FOR ELECTRONIC ASSEMBLIES 有权
标题翻译：电子组装的土地网格阵列几何
公开(公告)号：US20090172941A1
公开(公告)日：2009-07-09
申请号：US11970346
申请日：2008-01-07
申请人： Roger Lam , Wai Mon Ma , Arch F. Nuttall
发明人： Roger Lam , Wai Mon Ma , Arch F. Nuttall
IPC分类号： H01R43/02 , H01L21/02
CPC分类号： H05K3/0014 , H05K1/0271 , H05K3/0058 , H05K2201/09036 , H05K2201/10719 , H05K2201/2009 , H05K2203/0278 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49213 , Y10T29/49218
摘要： Disclosed is a method, system, and computer program storage product for optimizing land grid array site geometry on an electronic assembly mounting. A first member including at least one convex region is aligned with a first portion of an electronic assembly mounting. A second member is aligned with a second portion of the electronic assembly mounting. The second portion includes at least one concave region corresponding to the convex region of the first portion. The second member includes a dome-shaped region having a predefined geometry. Heat is applied to at least one of the electronic assembly mounting, the first member, and the second member. Pressure is applied to at least one of the first member and the second member to reshape the convex region into a substantially flat surface. Applying pressure also reshapes the concave region into a geometry corresponding to the predefined geometry of the dome-shaped region.
摘要翻译：公开了一种用于在电子组件安装件上优化陆地网格阵列位置几何的方法，系统和计算机程序存储产品。包括至少一个凸起区域的第一构件与电子组件安装件的第一部分对准。第二构件与电子组件安装件的第二部分对准。第二部分包括对应于第一部分的凸起区域的至少一个凹部区域。第二构件包括具有预定几何形状的圆顶形区域。热量被施加到电子组件安装件，第一构件和第二构件中的至少一个。将压力施加到第一构件和第二构件中的至少一个，以将凸区域重新形成为基本平坦的表面。施加压力还将凹区重新形成对应于圆顶形区域的预定几何形状的几何形状。

4. 发明授权

US06711810B2 Method of assembling a land grid array module 失效
标题翻译：组合地面栅格阵列模块的方法
公开(公告)号：US06711810B2
公开(公告)日：2004-03-30
申请号：US09956369
申请日：2001-09-19
申请人： Todd H. Buley , Roger Lam , Daniel O'Connor , Charles Hampton Perry
发明人： Todd H. Buley , Roger Lam , Daniel O'Connor , Charles Hampton Perry
IPC分类号： H05K336
CPC分类号： H05K7/1061 , H05K3/303 , H05K3/325 , H05K2201/10325 , H05K2201/10719 , H05K2203/0195 , H05K2203/167 , Y02P70/613 , Y10S269/903 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/53174 , Y10T29/53261 , Y10T29/53265 , Y10T29/53283 , Y10T29/53961
摘要： A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.
摘要翻译：使用由嵌套和引导工具组成的对准工具来对准嵌套中的LGA模块，然后将LGA模块从嵌套中移除并通过使用引导工具与电路卡对准的方法。

5. 发明申请

US20050061850A1 INCLINED SOLDER WAVE METHODOLOGY FOR WAVE SOLDERING DOUBLE SIDED PIN-IN-HOLE ELECTRONIC COMPONENTS 失效
标题翻译：用于波形焊接双面PIN孔内电子元件的嵌入式波形方法
公开(公告)号：US20050061850A1
公开(公告)日：2005-03-24
申请号：US10605257
申请日：2003-09-18
申请人： Todd Buley , Brian Chapman , Roger Lam , Wai Ma , John Weir
发明人： Todd Buley , Brian Chapman , Roger Lam , Wai Ma , John Weir
IPC分类号： B23K1/00 , B23K1/08 , B23K1/20 , B23K3/06 , B23K3/08 , H05K3/34 , B23K31/02
CPC分类号： B23K3/087 , B23K1/0016 , B23K1/085 , B23K1/20 , B23K3/0653 , B23K3/08 , B23K2101/42 , H05K3/3468 , H05K2201/10189 , H05K2203/0165 , H05K2203/1527 , H05K2203/304
摘要： An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.
摘要翻译：用于将焊料施加到电子电路板基板的装置包括用于产生焊料的熔融波的焊波装置，以及其上方的可移动的基板支架。衬底保持器包括用于电子电路板衬底的支撑件，用于相对于其方向以一定角度倾斜并且在其底部上具有开口，用于接近设置在衬底的端部附近的突出连接器与熔融焊料波。当衬底保持器在焊波装置上移动时，倾斜角足以防止设置在距离衬底端部一定距离处的部件接触熔融焊波。衬底保持器中的屏蔽件防止组件不被焊接以接触熔融焊料波。

6. 发明申请

US20050174738A1 METHOD AND STRUCTURE FOR HEAT SINK ATTACHMENT IN SEMICONDUCTOR DEVICE PACKAGING 审中-公开
标题翻译：半导体器件封装中的散热器接头的方法和结构
公开(公告)号：US20050174738A1
公开(公告)日：2005-08-11
申请号：US10708066
申请日：2004-02-06
申请人： Roger Lam , Wai Ma , Vincent Montalbano , Arch Nuttall , Nandu Ranadive
发明人： Roger Lam , Wai Ma , Vincent Montalbano , Arch Nuttall , Nandu Ranadive
IPC分类号： H01L23/36 , H01L23/427 , H05K7/20
CPC分类号： H01L23/36 , H01L23/4275 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011
摘要： A heat sink attachment structure includes an integrated circuit chip mounted on a substrate surface, and a thermal interface layer in contact with the integrated circuit chip. A heat sink is in contact with the thermal interface layer, and at least one spacer member is in contact between the substrate surface and the heat sink, wherein the at least one spacer member is provided with an adhesive material on top and bottom surfaces thereof.
摘要翻译：散热器附接结构包括安装在基板表面上的集成电路芯片和与集成电路芯片接触的热界面层。散热器与热界面层接触，并且至少一个间隔构件在基板表面和散热器之间接触，其中至少一个间隔件在其顶表面和底表面上设置有粘合剂材料。

7. 发明申请

US20060071775A1 Remote field command post 有权
标题翻译：远程现场指挥所
公开(公告)号：US20060071775A1
公开(公告)日：2006-04-06
申请号：US11232186
申请日：2005-09-21
申请人： Kevin Otto , John Crocket , Roger Lam
发明人： Kevin Otto , John Crocket , Roger Lam
IPC分类号： G08B1/00 , G08B19/00 , G08B1/08
CPC分类号： G08B13/19684 , G07C9/00 , G08B13/19641 , G08B13/19697 , G08B25/006 , H04L67/025
摘要： A communication and intelligence gathering system and method for monitoring a crisis scene from a remote command post. The system includes an access node positioned within communication range of multiple observation platforms that each provide information relating to the crisis scene, such as a video feed. The access node communicates with a main transfer module that relays the audio/video/data from the crisis scene to a main transfer module remotely positioned. A second main transfer module communicates with a field command post such that personnel at the field command post can monitor, react to and manage the crisis situation from the remote location. The access node position near the crisis scene also communications video and relevant information to field agents such that the field agents can monitor the video and information from a hand held/portable device.
摘要翻译：一种用于从远程指挥所监测危机场景的通信和情报收集系统和方法。该系统包括位于多个观察平台的通信范围内的接入节点，每个观测平台提供与危机场景相关的信息，例如视频馈送。接入节点与主传输模块进行通信，该主传输模块将音频/视频/数据从危机场景转发到远程定位的主传输模块。第二主要传输模块与现场指挥所通信，使得现场指挥所的人员可以从远程位置监视，反应和管理危机情况。在危机场景附近的接入节点位置还将视频和相关信息通信给现场代理，使得现场代理可以监视来自手持/便携式设备的视频和信息。

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