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    • 3. 发明授权
    • Process for optimization of island to trench ratio in patterned media
    • 在图案化介质中优化岛对沟比的方法
    • US08715515B2
    • 2014-05-06
    • US12730147
    • 2010-03-23
    • Houng T. NguyenRen XuMichael S. Barnes
    • Houng T. NguyenRen XuMichael S. Barnes
    • B44C1/22
    • G11B5/855
    • A sequence of process steps having balanced process times are implemented in sequence of etch chambers coupled linearly and isolated one from the other, resulting in the optimization of island to trench ratio for a patterned media. A biased chemical etching using active etching gas is used to descum and trim the resist patterns. An inert gas sputter etch is performed on the magnetic layers, resulting in the patterned magnetic layer on the disk. A final step of stripping is then performed to remove the residual capping resist and carbon hard mask on top of un-etched magnetic islands. The effective magnetic material remaining on the disk surface can be optimized by adjusting the conditions of chemical etch and sputter etch conditions. Relevant process conditions that may be adjusted include: pressure, bias, time, and the type of gas in each step.
    • 具有平衡处理时间的一系列工艺步骤以蚀刻室的顺序实现,该蚀刻室线性地并且彼此隔离,导致图案化介质的岛与沟槽比的优化。 使用有源蚀刻气体的偏压化学蚀刻来除去和修整抗蚀剂图案。 对磁性层进行惰性气体溅射蚀刻,得到盘上图案化的磁性层。 然后进行剥离的最后一步,以除去未蚀刻的磁岛顶部上的残余覆盖抗蚀剂和碳硬掩模。 可以通过调整化学蚀刻和溅射蚀刻条件的条件来优化残留在盘表面上的有效磁性材料。 可能调整的相关工艺条件包括:压力,偏压,时间和每一步中的气体类型。
    • 4. 发明授权
    • System and method for commercial fabrication of patterned media
    • 用于商业制作图案化介质的系统和方法
    • US08349196B2
    • 2013-01-08
    • US12329462
    • 2008-12-05
    • Kevin P. FairbairnMichael S. BarnesTerry BluckRen XuCharles LiuRalph Kerns
    • Kevin P. FairbairnMichael S. BarnesTerry BluckRen XuCharles LiuRalph Kerns
    • B44C1/22
    • G11B5/84G11B5/855H01J37/3438
    • A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.
    • 提供了用于蚀刻用于硬盘驱动器的图案化介质盘的系统。 模块化系统可以被定制以执行特定的处理顺序,使得图案化的介质盘被制造而不从真空环境中移除盘。 在一些顺序中,磁性堆叠被蚀刻,而另一些蚀刻则在形成磁性堆叠之前进行。 在另外的序列中,使用离子注入而没有蚀刻步骤。 为了蚀刻可移动的非接触电极用于进行溅射蚀刻。 阴极移动到与衬底接近但不接触的接近距离,以将RF能量耦合到盘。 衬底垂直地保持在载体中,并且两侧被连续蚀刻。 也就是说,在一个室中蚀刻一面,然后在下一个室中蚀刻第二面。
    • 10. 发明授权
    • Method of and apparatus for igniting a plasma in an r.f. plasma processor
    • 用于点燃r.f.中的等离子体的方法和装置 等离子处理器
    • US5982099A
    • 1999-11-09
    • US624124
    • 1996-03-29
    • Michael S. BarnesBrett RichardsonTuan NgoJohn Patrick Holland
    • Michael S. BarnesBrett RichardsonTuan NgoJohn Patrick Holland
    • H05H1/36H05H1/24
    • H05H1/36
    • A gas in a vacuum plasma processing chamber is ignited to a plasma by subjecting the gas to an r.f. field derived from an r.f. source having a frequency and power level sufficient to ignite the gas into the plasma and to maintain the plasma. The r.f. field is supplied to the gas by a reactive impedance element connected via a matching network to the r.f. source. The matching network includes first and second variable reactances that control loading of the source and tuning a load, including the reactive impedance element and the plasma, to the source. The value of only one of the reactances is varied until a local maximum of a function of power coupled between the source and the load is reached. The value of only the other reactance is varied until a local maximum of the function is reached. The two varying steps are then repeated as necessary.
    • 真空等离子体处理室中的气体通过使气体经受r.f.而点燃到等离子体。 来自r.f.的字段 源具有足以将气体点燃到等离子体中并维持等离子体的频率和功率水平。 r.f. 场由通过匹配网络连接到r.f的无功阻抗元件提供给气体。 资源。 匹配网络包括第一和第二可变电抗,其控制源的负载并且将包括无功阻抗元件和等离子体的负载调谐到源。 只有一个电抗的值是变化的,直到达到源和负载之间的功率函数的局部最大值。 只有其他电抗的值才会变化,直到达到功能的局部最大值。 然后根据需要重复两个可变步骤。