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    • 6. 发明申请
    • Treatment of a Germanium Layer Bonded with a Substrate
    • 用基材粘合的锗层的处理
    • US20080268615A1
    • 2008-10-30
    • US12090318
    • 2006-10-17
    • Frederic AllibertChrystel DeguetClaire Richtarch
    • Frederic AllibertChrystel DeguetClaire Richtarch
    • H01L21/46
    • H01L21/76254
    • The invention relates to a treatment method of a structure comprising a thin Ge layer on a substrate, said layer having been previously bonded with the substrate, the method comprising a treatment to improve the electrical properties of the layer and/or the interface of the Ge layer with the underlying layer, characterised in that said treatment is a heat treatment applied at a temperature between 500° C. and 600° C. for not more than 3 hours.The invention also relates to a method to produce a structure comprising a Ge layer, the method comprising bonding between a donor substrate comprising at least in the upper part thereof a thin Ge layer and a receiving substrate, characterised in that it comprises the following steps: (a) bonding of the donor with the receiving substrate such that the Ge layer is located in proximity to the bonding interface; (b) removal of the part of the donor substrate not comprising the Ge layer; (c) treatment of the structure comprising the receiving substrate and the Ge layer in accordance with said treatment method.
    • 本发明涉及一种结构的处理方法,该方法包括在衬底上的薄Ge层,所述层已预先与衬底接合,该方法包括改善Ge层的电性能和/或Ge界面的处理 层,其特征在于所述处理是在500℃和600℃之间的温度下施加不超过3小时的热处理。 本发明还涉及一种产生包括Ge层的结构的方法,该方法包括至少在其上部包括薄Ge层和接收衬底之间的施主衬底之间的结合,其特征在于包括以下步骤: (a)将所述施主与所述接收基板接合,使得所述Ge层位于所述接合界面附近; (b)去除不包括Ge层的供体衬底的部分; (c)根据所述处理方法处理包括接收衬底和Ge层的结构。
    • 8. 发明授权
    • Data storage medium and associated method
    • 数据存储介质及相关方法
    • US08445122B2
    • 2013-05-21
    • US12338281
    • 2008-12-18
    • Chrystel DeguetLaurent ClavelierFranck FournelJean-Sebastien Moulet
    • Chrystel DeguetLaurent ClavelierFranck FournelJean-Sebastien Moulet
    • G11C11/22H01L21/02
    • G11B9/02B82Y10/00G11B5/743G11B9/1472G11B9/149Y10T428/115
    • A data storage medium includes a carrier substrate having an electrode layer on the surface thereof and a sensitive material layer extending along the electrode layeradapted to be locally modified between two electrical states by the action of a localized electric field. A reference plane extends globally parallel to the sensitive material layer and is configured to accommodate at least one element for application of an electrostatic field in combination with the electrode layer the electrode layer including a plurality of conductive portions having a dimension at most equal to 100 nm in at least one direction parallel to the reference plane and separated by at least one electrically insulative zone, where at least some of the conductive portions are electrically interconnected, the conductive portions defining data write/read locations within the sensitive material layer.
    • 数据存储介质包括其表面上具有电极层的载体衬底和沿着电极层延伸的敏感材料层,所述敏感材料层通过局部电场的作用被局部地改变为两个电气状态。 参考平面全局平行于敏感材料层延伸,并且被配置为容纳用于与电极层组合施加静电场的至少一个元件,该电极层包括具有至多等于100nm的尺寸的多个导电部分 在平行于参考平面的至少一个方向上并且由至少一个电绝缘区隔开,其中至少一些导电部分电互连,导电部分在敏感材料层内限定数据写/读位置。