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1. 发明授权

US06297551B1 Integrated circuit packages with improved EMI characteristics 有权
标题翻译：集成电路封装具有改进的EMI特性
公开(公告)号：US06297551B1
公开(公告)日：2001-10-02
申请号：US09401690
申请日：1999-09-22
申请人： Thomas Dixon Dudderar , Dean Paul Kossives , Yee Leng Low
发明人： Thomas Dixon Dudderar , Dean Paul Kossives , Yee Leng Low
IPC分类号： H01L2334
CPC分类号： H01L23/055 , H01L23/49833 , H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/3025 , H05K1/0218 , H05K1/141 , H05K3/3442 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099
摘要： The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization. The normally exposed top and side surfaces of the MCM package are also metallized. A solder wall is provided on the interconnect PCB which seals the gap between the MCM tile and the PCB interconnect substrate. The solder wall can be formed using standard solder bump technology, and the seal between the MCM and the PCB may be made during the same reflow operation that is used to flip-chip bond the MCM tile to the PCB.
摘要翻译：该规范描述了具有集成电磁屏蔽的嵌入式芯片MCM封装。容纳IC器件的腔的表面涂有金属化。通常暴露的MCM封装的顶部和侧面也被金属化。在互连PCB上提供焊接壁，其密封MCM瓦片和PCB互连基板之间的间隙。可以使用标准焊料凸块技术形成焊接壁，并且可以在用于将MCM瓦片贴合到PCB的相同回流操作期间进行MCM和PCB之间的密封。

2. 发明授权

US06370766B1 Manufacture of printed circuit cards 失效
标题翻译：印刷电路卡的制造
公开(公告)号：US06370766B1
公开(公告)日：2002-04-16
申请号：US08807266
申请日：1997-02-28
申请人： Yinon Degani , Thomas Dixon Dudderar , Dean Paul Kossives , Yee Leng Low
发明人： Yinon Degani , Thomas Dixon Dudderar , Dean Paul Kossives , Yee Leng Low
IPC分类号： H05K330
CPC分类号： H05K1/0268 , G01R31/2818 , H05K3/0052 , Y10T29/4913 , Y10T29/49144
摘要： The specification describes methods for the manufacture of printed circuit cards which allow for final testing, including burn-in if required, of multiples of printed circuit cards as an integrated process panel prior to final packaging and singulation. This desired sequence of operations is made possible by the addition of arrays of test contacts at the edge of the integrated process panel where the test contacts can be accessed with an insertion test apparatus.
摘要翻译：本说明书描述了用于制造印刷电路卡的方法，其允许最终测试，包括如果需要，在最终包装和分割之前作为集成处理面板的多个印刷电路卡进行最终测试。通过在集成处理面板的边缘添加测试触点的阵列，可以使用插入测试装置访问测试触点，从而可以实现所需的操作顺序。

3. 发明授权

US5778913A Cleaning solder-bonded flip-chip assemblies 失效
标题翻译：清洁焊接的倒装芯片组件
公开(公告)号：US5778913A
公开(公告)日：1998-07-14
申请号：US803474
申请日：1997-02-20
申请人： Yinon Degani , Thomas Dixon Dudderar , Dean Paul Kossives
发明人： Yinon Degani , Thomas Dixon Dudderar , Dean Paul Kossives
IPC分类号： B08B3/04 , H01L21/00 , B08B3/02
CPC分类号： H01L21/67051 , B08B3/04 , Y10S134/902
摘要： Cleaning of a micromimiature high-density flip-chip assembly is carried out by spinning the assembly while applying cleaning fluid to a central portion of the assembly. Confinement of the cleaning fluid to a critical interconnection space of the assembly is ensured by a centrally apertured cover that resiliently engages the top of the assembly. During spinning, cleaning fluid is introduced through the aperture in the cover and is directed into and confined to flow radially in the interconnection space.
摘要翻译：通过在将组件的中央部分应用清洁流体的同时旋转组件来进行微型高密度倒装芯片组件的清洁。通过与组件的顶部弹性接合的中心有孔盖确保清洁流体到组件的关键互连空间的限制。在纺纱期间，清洁液通过盖中的孔引入并被引导并限制在互连空间中径向流动。

4. 发明授权

US07525812B2 Chip carrier and fabrication method 有权
标题翻译：芯片载体和制造方法
公开(公告)号：US07525812B2
公开(公告)日：2009-04-28
申请号：US11877613
申请日：2007-10-23
申请人： Dean Paul Kossives , Byung Joon Han
发明人： Dean Paul Kossives , Byung Joon Han
IPC分类号： H05K7/00
CPC分类号： H05K1/16 , H01L23/3677 , H01L23/645 , H01L23/66 , H01L25/16 , H01L2223/6622 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/15311 , H01L2924/3025 , H05K1/0237 , H05K1/141 , H05K1/181 , H05K3/3436 , H05K2201/0191 , H05K2201/10674 , Y10T29/49124 , Y10T29/49155 , H01L2224/05599
摘要： A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side.
摘要翻译：提供具有接地面，第一面和第二面的基板。形成将第一侧电连接到第二侧的通孔。印刷线形成在第一侧上，印刷线形成在第二面上。在第一侧形成无源部件。无源部件形成为没有接地平面。活动部件附接到第一侧。

5. 发明申请

US20090161330A1 CHIP CARRIER AND FABRICATION METHOD 有权
标题翻译：芯片载体和制造方法
公开(公告)号：US20090161330A1
公开(公告)日：2009-06-25
申请号：US12393034
申请日：2009-02-25
申请人： Dean Paul Kossives , Byung Joon Han
发明人： Dean Paul Kossives , Byung Joon Han
IPC分类号： H05K7/00 , H05K3/10
CPC分类号： H05K1/16 , H01L23/3677 , H01L23/645 , H01L23/66 , H01L25/16 , H01L2223/6622 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/15311 , H01L2924/3025 , H05K1/0237 , H05K1/141 , H05K1/181 , H05K3/3436 , H05K2201/0191 , H05K2201/10674 , Y10T29/49124 , Y10T29/49155 , H01L2224/05599
摘要： A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side.
摘要翻译：提供具有接地面，第一面和第二面的基板。形成将第一侧电连接到第二侧的通孔。印刷线形成在第一侧上，印刷线形成在第二面上。在第一侧形成无源部件。无源部件形成为没有接地平面。活动部件附接到第一侧。

6. 发明授权

US06683384B1 Air isolated crossovers 失效
标题翻译：空气隔离交叉
公开(公告)号：US06683384B1
公开(公告)日：2004-01-27
申请号：US08946693
申请日：1997-10-08
申请人： Dean Paul Kossives , Fan Ren , King Lien Tai
发明人： Dean Paul Kossives , Fan Ren , King Lien Tai
IPC分类号： H01L2348
CPC分类号： H01L24/10 , H01L23/147 , H01L23/538 , H01L23/5385 , H01L24/13 , H01L24/81 , H01L2224/05124 , H01L2224/05147 , H01L2224/05171 , H01L2224/05644 , H01L2224/05647 , H01L2224/13 , H01L2224/13099 , H01L2224/16145 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/00 , H01L2924/00014
摘要： The specification describes integrated circuit air isolated crossover interconnections designed for flip chip multi-chip module interconnection technology. The crossovers are made using a crossover interconnection substrate separate from the interconnection substrate of the integrated circuit. In one embodiment the integrated circuit is flip chip bonded to a multi-chip or multi-component interconnection substrate, and the crossover interconnections are made through solder bumps or balls soldered to a conductive layer on the crossover interconnection substrate. In another embodiment the crossover is made via a crossover substrate flip chip bonded to an integrated circuit mounted on a multi-chip or multi-component interconnection substrate.
摘要翻译：该规范描述了针对倒装芯片多芯片模块互连技术设计的集成电路空气隔离交叉互连。使用与集成电路的互连基板分离的交叉互连基板来进行交叉。在一个实施例中，集成电路被倒装芯片接合到多芯片或多组件互连衬底，并且通过焊接到交叉互连衬底上的导电层的焊料凸块或球形成交叉互连。在另一个实施例中，通过结合到安装在多芯片或多部件互连基板上的集成电路的交叉基板倒装芯片来进行交叉。

7. 发明授权

US07733661B2 Chip carrier and fabrication method 有权
标题翻译：芯片载体和制造方法
公开(公告)号：US07733661B2
公开(公告)日：2010-06-08
申请号：US12393034
申请日：2009-02-25
申请人： Dean Paul Kossives , Byung Joon Han
发明人： Dean Paul Kossives , Byung Joon Han
IPC分类号： H05K7/00
CPC分类号： H05K1/16 , H01L23/3677 , H01L23/645 , H01L23/66 , H01L25/16 , H01L2223/6622 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/15311 , H01L2924/3025 , H05K1/0237 , H05K1/141 , H05K1/181 , H05K3/3436 , H05K2201/0191 , H05K2201/10674 , Y10T29/49124 , Y10T29/49155 , H01L2224/05599
摘要： A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side.
摘要翻译：提供具有接地面，第一面和第二面的基板。形成将第一侧电连接到第二侧的通孔。印刷线形成在第一侧上，印刷线形成在第二面上。在第一侧形成无源部件。无源部件形成为没有接地平面。活动部件附接到第一侧。

8. 发明授权

US06232212B1 Flip chip bump bonding 有权
标题翻译：倒装芯片凸块接合
公开(公告)号：US06232212B1
公开(公告)日：2001-05-15
申请号：US09256443
申请日：1999-02-23
申请人： Yinon Degani , Dean Paul Kossives
发明人： Yinon Degani , Dean Paul Kossives
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/03912 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05644 , H01L2224/05647 , H01L2224/1147 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/013
摘要： The specification describes techniques for applying solder bumps to IC chips. The solder bump sites are first provided with under bump metallization (UBM) for solder bump interconnections to the Al bonding sites on the IC chip. The substrate, i.e. the capping layer of the IC chip, is coated with photoresist and patterned to expose the UBM and a peripheral portion of the capping layer around the UBM. The solder paste is then applied and reflowed to form the solder bump. Since the photoresist hardens and becomes difficult to remove after the reflow step, a sacrificial buffer layer is interposed between the photoresist and the capping layer to facilitate removal of the photoresist without attacking the IC chip surface.
摘要翻译：该说明书描述了将焊料凸点应用于IC芯片的技术。焊料凸点部位首先设置有凸块下金属化（UBM），用于与IC芯片上的Al键合位置的焊料凸块互连。衬底（即IC芯片的覆盖层）涂覆有光致抗蚀剂并且被图案化以暴露UBM周围的UBM和覆盖层的周边部分。然后将焊膏施加并回流以形成焊料凸块。由于在回流步骤之后，光致抗蚀剂硬化并变得难以去除，所以在光致抗蚀剂和覆盖层之间插入牺牲缓冲层，以便于去除光致抗蚀剂而不会攻击IC芯片表面。

9. 发明申请

US20110171084A1 Reversible reaction sensors and assemblies 审中-公开
标题翻译：可逆反应传感器和组件
公开(公告)号：US20110171084A1
公开(公告)日：2011-07-14
申请号：US12807340
申请日：2010-09-02
申请人： Dean Paul Kossives
发明人： Dean Paul Kossives
IPC分类号： B01J19/00
CPC分类号： G01N21/783 , G01N21/7703 , G01N21/78 , G01N33/0057 , G01N2021/7779 , G01N2201/0221
摘要： A reversible reaction sensor provides for detecting medical, biologic or explosive airborne compounds. The sensor may be formed in semiconductor material and is activated by radiation from sources to provide sensing of particular airborne compounds optically detectable by detectors, and reversed by other radiation from a source (or removal of activating radiation) to take away such airborne compounds from the sensor. The reversible reaction sensor device has a sensing material of one or more photo-chromic or photo-biologic compounds for a specific compound(s) or analytic(s) having receptor sites which bound molecularly to specific compound(s) or analytic(s) when present, in which sensing relies only on the response time to saturation for the sensing material as measured by an optical property of the sensing material when exposed to radiation. The sensing material is self cleaning by one or more of light of a specific wavelength, radio waves of a specific frequency, absence of said light illuminating said material, absence or presence of a magnetic field, which causes the receptor sites to close and the bound specific analytic are released and swept away by flow of air. The sensor may be in hermetically sealed and non-hermetic assemblies.
摘要翻译：可逆反应传感器用于检测医疗，生物或爆炸性空气传播的化合物。传感器可以形成在半导体材料中并且通过来自辐射源的激光被激活，以提供对由检测器光学可检测的特定空气传播的化合物的感测，并且由来自源的其它辐射（或去除活化辐射）反转，以将这些空气传播的化合物从传感器。可逆反应传感器装置具有用于特定化合物或具有与特定化合物或分析物分子结合的受体位点的分析物的一种或多种光致变色或光生物化合物的感测材料，当存在时，其中感测仅依赖于当暴露于辐射时由感测材料的光学性质测量的感测材料的响应时间达到饱和度。感测材料通过一种或多种特定波长的光，特定频率的无线电波，不存在照射所述材料的所述光，不存在或存在磁场而导致受体部位闭合和束缚特定的分析物被释放并被空气流扫除。传感器可以是密封的和非密封的组件。

10. 发明授权

US07304859B2 Chip carrier and fabrication method 有权
标题翻译：芯片载体和制造方法
公开(公告)号：US07304859B2
公开(公告)日：2007-12-04
申请号：US11277973
申请日：2006-03-30
申请人： Dean Paul Kossives , Byung Joon Han
发明人： Dean Paul Kossives , Byung Joon Han
IPC分类号： H05K7/00
CPC分类号： H05K1/16 , H01L23/3677 , H01L23/645 , H01L23/66 , H01L25/16 , H01L2223/6622 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/15311 , H01L2924/3025 , H05K1/0237 , H05K1/141 , H05K1/181 , H05K3/3436 , H05K2201/0191 , H05K2201/10674 , Y10T29/49124 , Y10T29/49155 , H01L2224/05599
摘要： A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of a ground plane. An active component is attached to the first side.
摘要翻译：提供具有接地面，第一面和第二面的基板。形成将第一侧电连接到第二侧的通孔。印刷线形成在第一侧上，印刷线形成在第二面上。在第一侧形成无源部件。无源部件形成为没有接地平面。活动部件附接到第一侧。

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