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1. 发明申请

US20100112901A1 SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 有权
标题翻译：基板抛光装置和底板抛光方法
公开(公告)号：US20100112901A1
公开(公告)日：2010-05-06
申请号：US12688021
申请日：2010-01-15
申请人： Tetsuji TOGAWA , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
发明人： Tetsuji TOGAWA , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
IPC分类号： B24B49/04 , B24B49/10
CPC分类号： B24B37/013 , B24B49/105 , B24B49/12 , B24B49/16
摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
摘要翻译：本发明涉及一种用于将诸如半导体晶片的基板抛光到平整的基板抛光装置和基板抛光方法。基板研磨装置具备：具有抛光面（101）的研磨台（100），将基板（W）保持并压靠在研磨台（100）的研磨面（101）上的基板保持架（1），以及用于测量衬底（W）上的膜的厚度的膜厚测量装置（200）。衬底保持器（1）具有多个压力可调节室（22〜25），并且基于由膜厚测量装置（200）测量的膜厚调节各个室（22至25）中的压力。

2. 发明申请

US20080318503A1 SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 有权
标题翻译：基板保持机构，基板抛光装置和基板抛光方法
公开(公告)号：US20080318503A1
公开(公告)日：2008-12-25
申请号：US12184032
申请日：2008-07-31
申请人： Tetsuji TOGAWA , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
发明人： Tetsuji TOGAWA , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
IPC分类号： B24B55/00 , B24B55/12
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。基板保持机构具有安装凸缘，支撑构件6和保持环。待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。安装凸缘设置有至少与保持环相邻的流动通道。通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

3. 发明申请

US20100062691A1 SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 有权
标题翻译：基板保持机构，基板抛光装置和基板抛光方法
公开(公告)号：US20100062691A1
公开(公告)日：2010-03-11
申请号：US12618033
申请日：2009-11-13
申请人： Tetsuji TOGAWA , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
发明人： Tetsuji TOGAWA , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
IPC分类号： B24B55/00 , B24B1/00 , B24B55/12
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。基板保持机构具有安装凸缘，支撑构件6和保持环。待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。安装凸缘设置有至少与保持环相邻的流动通道。通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

4. 发明申请

US20090191797A1 Polishing apparatus 审中-公开
标题翻译：抛光设备
公开(公告)号：US20090191797A1
公开(公告)日：2009-07-30
申请号：US12379597
申请日：2009-02-25
申请人： Osamu NABEYA , Tetsuji TOGAWA , Makoto FUKUSHIMA , Hozumi YASUDA
发明人： Osamu NABEYA , Tetsuji TOGAWA , Makoto FUKUSHIMA , Hozumi YASUDA
IPC分类号： B24B1/00 , B24B41/06 , B24B7/22
CPC分类号： B24B37/20 , B24B37/005 , B24B37/042 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16 , B24B49/18 , B24B49/183
摘要： A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.
摘要翻译：抛光装置（1）具有抛光垫（22），用于保持半导体晶片（W）的顶环（20），可垂直移动顶环（20）的垂直移动机构（24）当所述顶环（20）的下表面与所述抛光垫（22）接触时，所述距离测量传感器（46）可操作以检测所述顶环（20）的位置;以及控制器（47），其可操作以基于由距离测量传感器（46）检测到的位置，计算顶环（20）的最佳位置以对半导体晶片（W）进行抛光。垂直运动机构（24）包括可操作以将顶环（20）移动到最佳位置的滚珠丝杆机构（30,32,38,42）。

5. 发明申请

US20120244787A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20120244787A1
公开(公告)日：2012-09-27
申请号：US13308857
申请日：2011-12-01
申请人： Masaya SEKI , Tetsuji TOGAWA , Masayuki NAKANISHI , Naoki MATSUDA , Atsushi YOSHIDA
发明人： Masaya SEKI , Tetsuji TOGAWA , Masayuki NAKANISHI , Naoki MATSUDA , Atsushi YOSHIDA
IPC分类号： B24B21/06
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/006 , B24B21/008 , B24B21/20
摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.
摘要翻译：抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板周边部分的下表面。支撑台与保持台一致地旋转。

6. 发明申请

US20100056028A1 SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS 审中-公开
标题翻译：基板控制装置和抛光装置
公开(公告)号：US20100056028A1
公开(公告)日：2010-03-04
申请号：US12613016
申请日：2009-11-05
申请人： Tetsuji TOGAWA , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji TOGAWA , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B41/06
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译：本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。具有弹性膜的邻接构件附接到可垂直移动构件的下表面。邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到垂直活动件。连接部由具有高于邻接部的材料的柔软性的材料制成。

7. 发明申请

US20090061748A1 Substrate holding apparatus 有权
标题翻译：基板保持装置
公开(公告)号：US20090061748A1
公开(公告)日：2009-03-05
申请号：US12285936
申请日：2008-10-16
申请人： Tetsuji TOGAWA , Ikutarao NOJI , Keisuke NAMIKI , Hozumi YASUDA , Shunichiro KOJIMA , Kunihiko SAKURAI , Nobuyuki TAKADA , Osamu NABEYA , Makoto FUKUSHIMA , Hideki TAKAYANAGI
发明人： Tetsuji TOGAWA , Ikutarao NOJI , Keisuke NAMIKI , Hozumi YASUDA , Shunichiro KOJIMA , Kunihiko SAKURAI , Nobuyuki TAKADA , Osamu NABEYA , Makoto FUKUSHIMA , Hideki TAKAYANAGI
IPC分类号： B24B41/06
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
摘要翻译：本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。接触构件具有用于接触弹性垫的弹性膜。第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

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