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1. 发明授权

US08926402B2 Method of polishing a substrate using a polishing tape having fixed abrasive 有权
标题翻译：使用具有固定磨料的研磨带研磨基材的方法
公开(公告)号：US08926402B2
公开(公告)日：2015-01-06
申请号：US13303485
申请日：2011-11-23
申请人： Masayuki Nakanishi , Masaya Seki , Kenji Kodera
发明人： Masayuki Nakanishi , Masaya Seki , Kenji Kodera
IPC分类号： B24B1/00 , B24B9/06 , B24B21/00 , B24B37/02
CPC分类号： B24B9/065 , B24B21/002 , B24B37/02
摘要： A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance.
摘要翻译：提供了研磨基板周边部分的方法。该方法包括：引起基板的周边部分与研磨带之间的滑动接触; 以及将研磨液供给到与基板的周边部分接触的研磨带上。抛光带包括形成在基带上的基带和固定磨料，抛光液是含有碱性化学物质和包含引起空间位阻的分子的添加剂的碱性抛光液。

2. 发明授权

US08535117B2 Method and apparatus for polishing a substrate having a grinded back surface 有权
标题翻译：用于研磨具有研磨后表面的基材的方法和设备
公开(公告)号：US08535117B2
公开(公告)日：2013-09-17
申请号：US12956381
申请日：2010-11-30
申请人： Masayuki Nakanishi , Masunobu Onozawa , Masaya Seki
发明人： Masayuki Nakanishi , Masunobu Onozawa , Masaya Seki
IPC分类号： B24B1/00
CPC分类号： B24B9/065 , B24B21/002
摘要： A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.
摘要翻译：提供了一种能够快速抛光由磨削的背面和基板的圆周表面形成的角部，而不会在薄基板上造成损坏的方法。该方法包括使基板围绕其中心旋转，并且将研磨带压靠在由基板的背面和圆周表面形成的角部上以抛光角部。

3. 发明申请

US20110256811A1 POLISHING METHOD 审中-公开
标题翻译：抛光方法
公开(公告)号：US20110256811A1
公开(公告)日：2011-10-20
申请号：US13080821
申请日：2011-04-06
申请人： Masayuki NAKANISHI , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki NAKANISHI , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： B24B1/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/04 , B24B37/042
摘要： A polishing method can obtain a good polishing profile which, for example, will not cause peeling of a semiconductor layer from a silicon substrate. The polishing method includes: positioning a polishing head at a position above a polishing start position in an edge portion of a rotating substrate; lowering a polishing tool of the polishing head until the polishing tool comes into contact with the polishing start position in the edge portion of the rotating substrate and a pressure between the polishing tool and the polishing start position reaches a set pressure; allowing the polishing tool to stay at the polishing start position for a predetermined amount of time; and then moving the polishing head toward a peripheral end of the substrate while keeping the polishing tool in contact with the edge portion of the rotating substrate at the set pressure.
摘要翻译：抛光方法可以获得良好的抛光轮廓，其例如不会导致半导体层从硅衬底剥离。抛光方法包括：将抛光头定位在旋转基板的边缘部分中的抛光开始位置上方的位置; 降低抛光头的抛光工具，直到研磨工具与旋转基板的边缘部分中的抛光开始位置接触，并且抛光工具和抛光开始位置之间的压力达到设定压力; 允许抛光工具在抛光开始位置停留预定的时间量; 然后将抛光头朝向基板的周缘移动，同时保持抛光工具在旋转基板的边缘部分处于设定压力。

4. 发明申请

US20110237164A1 POLISHING APPARATUS, POLISHING METHOD AND PRESSING MEMBER FOR PRESSING A POLISHING TOOL 有权
标题翻译：抛光设备，抛光方法和压制用于压制抛光工具的构件
公开(公告)号：US20110237164A1
公开(公告)日：2011-09-29
申请号：US12986481
申请日：2011-01-07
申请人： Masaya SEKI , Kenya Ito , Masayuki Nakanishi
发明人： Masaya SEKI , Kenya Ito , Masayuki Nakanishi
IPC分类号： B24B1/00 , B24B27/00
CPC分类号： B24B9/065 , B24B21/004 , B24B37/27
摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.
摘要翻译：抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。抛光装置包括旋转保持机构3，其构造成水平地保持基板W并使基板W旋转; 以及设置在基板的周边部分附近的至少一个抛光头30。抛光头30具有沿着基板W的圆周方向延伸的至少一个突起51a，51b，并且抛光头30被构造成通过突起51a，51b将抛光带23的抛光表面压靠在基板基底W从上方或下方。

5. 发明授权

US06938968B2 Vacuum insulating material and device using the same 有权
标题翻译：真空绝热材料及使用其的装置
公开(公告)号：US06938968B2
公开(公告)日：2005-09-06
申请号：US10258131
申请日：2001-04-23
申请人： Yasuaki Tanimoto , Tomohisa Tenra , Masayuki Nakanishi , Akiko Yuasa
发明人： Yasuaki Tanimoto , Tomohisa Tenra , Masayuki Nakanishi , Akiko Yuasa
IPC分类号： B65D81/18 , B65D81/38 , C03C13/00 , F16L59/065 , F25D23/06 , B32B1/06 , F25D11/00
CPC分类号： F16L59/065 , B65D81/18 , B65D81/3823 , B65D81/3897 , C03C13/00 , F25D23/062 , F25D2201/124 , F25D2201/126 , F25D2201/14 , F25D2400/04 , Y10T428/1362 , Y10T428/231
摘要： Vacuum heat insulator comprising a laminated core made of a plurality of sheets of inorganic fibers having 10 μm or smaller in diameter and a certain composition including SiO2 as a main component, Al2O3, CaO, and MgO, a gas barrier enveloping member, and an absorbent. The vacuum heat insulator is characterized by having at least one groove formed therein after fabrication of the vacuum heat insulator. Further, the vacuum heat insulator is characterized by using inorganic fiber core of which a peak of distribution in fiber diameter lies between 1 μm or smaller and 0.1 μm or larger, and not containing binding material for binding the fiber material. Electronic apparatuses use the vacuum heat insulator. With use of the vacuum heat insulator, electronic and electric apparatuses superior in energy saving and not to present uncomfortable feeling to the user can be provided.
摘要翻译：真空绝热体包括由直径10μm以下的多个无机纤维片构成的叠层铁芯，以及以SiO 2为主要成分的一定成分，Al 2 N 2 氧化铝，氧化镁，氧化镁，阻气性包封材料和吸收剂。真空绝热器的特征在于在制造真空隔热件之后具有形成在其中的至少一个凹槽。此外，真空绝热体的特征在于使用纤维直径分布的峰值在1μm以上0.1μm以下的无机纤维芯，不含粘合纤维材料的粘合材料。电子设备使用真空绝热体。通过使用真空绝热体，可以提供节能性优异且不给使用者带来不适感的电子电气装置。

6. 发明授权

US5017225A Microencapsulated photochromic material, process for its preparation and a water-base ink composition prepared therefrom 失效
标题翻译：微胶囊化光致变色材料，其制备方法和由其制备的水性油墨组合物
公开(公告)号：US5017225A
公开(公告)日：1991-05-21
申请号：US392913
申请日：1989-07-27
申请人： Masayuki Nakanishi , Takashi Iwasaki , Shuichi Maeda
发明人： Masayuki Nakanishi , Takashi Iwasaki , Shuichi Maeda
IPC分类号： C09D11/00 , C09K9/02 , G03C1/00 , G03C1/685
CPC分类号： C09D11/50 , C09K9/02 , G03C1/002 , G03C1/685 , Y10T428/2984
摘要： This invention relates to a microencapsulated photochromic material and a process for its preparation. More particularly, it relates to a microencapsulated photochromic material having a good durability and a process for its preparation.The present invention further relates to a water-base ink composition comprising said microencapsulated photochromic material.
摘要翻译： PCT No.PCT / JP88 / 01215 Sec。 371日期：1989年7月27日 102（e）日期1989年7月27日PCT提交1988年12月1日PCT公布。第WO89 / 05335号公报日本6月15日，1989年。本发明涉及一种微囊化光致变色材料及其制备方法。更具体地说，本发明涉及具有良好耐久性的微囊化光致变色材料及其制备方法。本发明还涉及包含所述微囊化光致变色材料的水性油墨组合物。

7. 发明授权

US08986069B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08986069B2
公开(公告)日：2015-03-24
申请号：US13459421
申请日：2012-04-30
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B9/00 , B24B1/00 , B24B21/00 , B24B9/06 , B24B37/04 , B24B37/30
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译：抛光装置抛光基板的周边。该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

8. 发明授权

US08445360B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08445360B2
公开(公告)日：2013-05-21
申请号：US13027551
申请日：2011-02-15
申请人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： H01L21/46 , H01L21/30 , H01L21/78 , H01L21/301
CPC分类号： H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.
摘要翻译：一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜，暴露下面的硅。在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。

9. 发明申请

US20120244787A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20120244787A1
公开(公告)日：2012-09-27
申请号：US13308857
申请日：2011-12-01
申请人： Masaya SEKI , Tetsuji TOGAWA , Masayuki NAKANISHI , Naoki MATSUDA , Atsushi YOSHIDA
发明人： Masaya SEKI , Tetsuji TOGAWA , Masayuki NAKANISHI , Naoki MATSUDA , Atsushi YOSHIDA
IPC分类号： B24B21/06
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/006 , B24B21/008 , B24B21/20
摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.
摘要翻译：抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板周边部分的下表面。支撑台与保持台一致地旋转。

10. 发明授权

US08187055B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08187055B2
公开(公告)日：2012-05-29
申请号：US12292662
申请日：2008-11-24
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B1/00 , B24B49/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译：抛光装置抛光基板的周边。该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

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