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1. 发明申请

US20190022822A1 WHEEL BLANK POSITIONING END FACE CORRECTION DEVICE 审中-公开
公开(公告)号：US20190022822A1
公开(公告)日：2019-01-24
申请号：US15801952
申请日：2017-11-02
申请人： CITIC Dicastal CO.,LTD
发明人： Huiying Liu , Weidong Liu , Bowen Xue
IPC分类号： B24B49/12 , B24B9/04 , B24B29/00
CPC分类号： B24B49/12 , B24B5/44 , B24B9/04 , B24B29/005 , B24B47/22
摘要： The present application disclose a wheel blank positioning end face correction device, comprising a frame, a servo motor I, a support frame, a bearing seat, a bearing, a shaft, a rotating platform, a guide rail, a cylinder, a left slide plate, a left bearing seat, a left shaft, a left bearing, a left driven grooved friction wheel, a left workbench, corner cylinder pressure claws, mandrel seats, mandrels, a grinding wheel, a grinding wheel drive motor, a support plate, a feeding slide plate, feeding guide rails, a linear motor, a distance measuring sensor, a fixed plate, a servo motor II, a driving grooved friction wheel, a right workbench, a right driven grooved friction wheel, a right shaft, a gear rack structure and a right slide plate.

2. 发明申请

US20160250735A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：US20160250735A1
公开(公告)日：2016-09-01
申请号：US15150279
申请日：2016-05-09
申请人： EBARA CORPORATION
发明人： Osamu NABEYA , Tetsuji TOGAWA , Makoto FUKUSHIMA , Hozumi YASUDA
IPC分类号： B24B37/20 , B24B37/005
CPC分类号： B24B37/20 , B24B37/005 , B24B37/042 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16 , B24B49/18 , B24B49/183
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
摘要翻译：抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光基于由距离测量传感器检测到的位置的半导体晶片。垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

3. 发明申请

US20140357164A1 POLISHING APPARATUS 有权
标题翻译：抛光装置
公开(公告)号：US20140357164A1
公开(公告)日：2014-12-04
申请号：US14464130
申请日：2014-08-20
申请人： EBARA CORPORATION
发明人： Osamu NABEYA , Tetsuji TOGAWA , Makoto FUKUSHIMA , Hozumi YASUDA
IPC分类号： B24B37/32 , B24B37/10
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
摘要翻译：抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光基于由距离测量传感器检测到的位置的半导体晶片。垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

4. 发明申请

US20120083186A1 EYEGLASS LENS PROCESSING APPARATUS 有权
标题翻译：眼镜镜片加工设备
公开(公告)号：US20120083186A1
公开(公告)日：2012-04-05
申请号：US13248640
申请日：2011-09-29
申请人： Ryoji SHIBATA
发明人： Ryoji SHIBATA
IPC分类号： B24B51/00
CPC分类号： B24B9/148 , B24B9/14 , B24B9/144 , B24B47/22 , B24B49/02 , B24B51/00
摘要： In an eyeglass lens processing apparatus, if a material selector selects a thermoplastic material for the lens, a control unit performs a first step and then a second step. In the first step, the control unit controls a lens rotating unit to position a lens in a plurality of lens rotation angles and controls an axis-to-axis distance changing unit to cause a roughing tool to cut into the lens up to a roughing path for each of the plurality of lens rotation angles, the lens being not rotated by the lens rotating unit when the roughing tool is cutting into the lens up to the roughing path. In the second step, the control unit controls the lens rotating unit and the axis-to-axis distance changing unit to rough the lens based on the roughing path while the lens rotating unit rotates the lens.
摘要翻译：在眼镜透镜处理装置中，如果材料选择器选择用于透镜的热塑性材料，则控制单元执行第一步骤，然后进行第二步骤。在第一步骤中，控制单元控制透镜旋转单元以将透镜定位在多个透镜旋转角度，并且控制轴对轴距离改变单元，以使粗加工工具切入透镜直到粗略路径对于多个透镜旋转角度中的每一个，当粗加工工具正在切割成透镜直到粗加工路径时，透镜不被透镜旋转单元旋转。在第二步骤中，当透镜旋转单元旋转透镜时，控制单元控制透镜旋转单元和轴对轴距离改变单元，以粗糙化基于粗略路径的透镜。

5. 发明授权

US08083571B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US08083571B2
公开(公告)日：2011-12-27
申请号：US11665648
申请日：2005-10-31
申请人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima
发明人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima
IPC分类号： B24B49/00
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
摘要翻译：抛光装置具有抛光垫，用于保持半导体晶片的顶环和可操作以沿垂直方向移动顶环的垂直移动机构。抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光基于由距离测量传感器检测到的位置的半导体晶片。垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

6. 发明授权

US07787982B2 Working system, method for detecting contact, and acoustic emission contact detection device 有权
标题翻译：工作系统，接触检测方法和声发射接触检测装置
公开(公告)号：US07787982B2
公开(公告)日：2010-08-31
申请号：US12087705
申请日：2006-11-01
申请人： Kazuo Meki
发明人： Kazuo Meki
IPC分类号： B29C39/00 , B05B13/02 , B05B13/00 , B24B49/00 , B24B1/00 , G06F15/00 , G05D23/00
CPC分类号： B23Q17/22 , B24B47/22 , B24B49/003 , B24B49/10
摘要： The object is to aim at the reduction in the influence of noises in an output of an AE sensor in a working machine. In a working system comprising a working device for working a work W by causing a tool 14 to come into contact work W, an AE sensor 21, and an AE signal processing section 22 for processing an AE signal output from the AE sensor, AE signal processing section 22 comprises an A/D converter 33 for converting an AE signal into a digital signal, a frequency analysis section 34 for calculating the frequency characteristics of a digital AE signal, storage sections 35, 37 for storing the frequency characteristics when the tool is not in contact with the work or tool dresser as non-contact frequency characteristics, and a difference calculation section 35 for calculating a difference between the frequency characteristics of the detected digital AE signal and the non-contact frequency characteristics.
摘要翻译：目的在于减少工作机中AE传感器的输出中的噪声的影响。在包括用于通过使工具14接触工件W来工作工件W的工作装置，AE传感器21和用于处理从AE传感器输出的AE信号的AE信号处理部分22的AE信号处理部分22包括用于将AE信号转换为数字信号的A / D转换器33，用于计算数字AE信号的频率特性的频率分析部分34，用于存储当工具为频率特性时的存储部分35,37 不与作业或工具修整器接触作为非接触频率特性;以及差分计算部35，用于计算检测到的数字AE信号的频率特性与非接触频率特性之间的差。

7. 发明申请

US20090112355A1 Device and Method for Dressing Cutting Tools 审中-公开
标题翻译：切割工具的装置和方法
公开(公告)号：US20090112355A1
公开(公告)日：2009-04-30
申请号：US12040528
申请日：2008-02-29
申请人： Gregory Hyatt , Koji Okura , Nitin Chaphalkar
发明人： Gregory Hyatt , Koji Okura , Nitin Chaphalkar
IPC分类号： G05B19/19
CPC分类号： B24B27/0061 , B24B47/22 , B24B49/18 , B24B51/00 , B24B53/00
摘要： Disclosed are a computer numerically controlled machine and methods for forming, grinding, or dressing cutting tools in a computer numerically controlled machine. In some embodiments, the computer numerically controlled machine is provided with a cutting tool and an abrasive surface. The abrasive surface is brought into contact with the cutting tool to abrade material from the cutting tool in a grinding or dressing operation. In certain embodiments, it is not necessary to remove the cutting tool from the computer numerically controlled machine for dressing. In some non-mutually-exclusive embodiments, the machine is provided with tool blanks, from which cutting tools are prepared using an abrasive surface in the machine.
摘要翻译：公开了一种用于在计算机数控机器中形成，研磨或修整切削工具的计算机数字控制机器和方法。在一些实施例中，计算机数控机床设置有切削工具和研磨表面。研磨表面与切削工具接触以在研磨或修整操作中从切削工具磨蚀材料。在某些实施例中，不需要从用于修整的计算机数字控制机器移除切割工具。在一些非相互排斥的实施例中，机器设置有工具坯料，使用机器中的研磨表面来制备切削工具。

8. 发明申请

US20080070479A1 Polishing Apparatus 有权
标题翻译：抛光装置
公开(公告)号：US20080070479A1
公开(公告)日：2008-03-20
申请号：US11665648
申请日：2005-10-31
申请人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima , Hozumi Yasuda
发明人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima , Hozumi Yasuda
IPC分类号： B24B49/00 , B24B51/00 , B24B29/00 , B24B5/00
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.
摘要翻译：抛光装置（1）具有抛光垫（22），用于保持半导体晶片（W）的顶环（20），可垂直移动顶环（20）的垂直运动机构（24）当所述顶环（20）的下表面与所述抛光垫（22）接触时，所述距离测量传感器（46）可操作以检测所述顶环（20）的位置;以及控制器（47），其可操作以基于由距离测量传感器（46）检测到的位置，计算顶环（20）的最佳位置以对半导体晶片（W）进行抛光。垂直运动机构（24）包括可操作以将顶环（20）移动到最佳位置的滚珠丝杆机构（30,32,38,42）。

9. 发明授权

US07326103B2 Vertically adjustable chemical mechanical polishing head and method for use thereof 有权
标题翻译：化学机械抛光头及其使用方法
公开(公告)号：US07326103B2
公开(公告)日：2008-02-05
申请号：US10700984
申请日：2003-11-04
申请人： Kunihiko Sakurai , Gerard Moloney , Huey-Ming Wang , Jun Liu , Peter Lao
发明人： Kunihiko Sakurai , Gerard Moloney , Huey-Ming Wang , Jun Liu , Peter Lao
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B47/22
摘要： The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof.
摘要翻译：本发明提供了一种具有枢转机构和方法的可垂直调节的化学机械抛光头。

10. 发明授权

US07037181B1 Device for grinding of clothing in a textile machine 失效
公开(公告)号：US07037181B1
公开(公告)日：2006-05-02
申请号：US09786731
申请日：1999-09-08
申请人： Jürg Faas , Beat Näf , Christian Sauter , Yücel Yildirim , Roland Styner , Roland Bischof , Christian Müller
发明人： Jürg Faas , Beat Näf , Christian Sauter , Yücel Yildirim , Roland Styner , Roland Bischof , Christian Müller
IPC分类号： B24B29/08
CPC分类号： B24B29/005 , B24B3/60 , B24B19/18 , B24B47/22 , B24B55/06 , B24D13/10 , D01G15/38
摘要： A grinding device for the flats of a card comprises elastically bendable elements which enter between the clothing points, brush over the side flanks of the points and thereby grind the points. Additional grinding elements are provided in order to treat the front sides of the clothing points. The ground-off material may be removed by a suction device.

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