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1. 发明申请

US20100062691A1 SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 有权
标题翻译：基板保持机构，基板抛光装置和基板抛光方法
公开(公告)号：US20100062691A1
公开(公告)日：2010-03-11
申请号：US12618033
申请日：2009-11-13
申请人： Tetsuji TOGAWA , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
发明人： Tetsuji TOGAWA , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
IPC分类号： B24B55/00 , B24B1/00 , B24B55/12
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。基板保持机构具有安装凸缘，支撑构件6和保持环。待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。安装凸缘设置有至少与保持环相邻的流动通道。通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

2. 发明申请

US20060205323A1 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method 有权
标题翻译：基板保持机构，基板研磨装置和基板研磨方法
公开(公告)号：US20060205323A1
公开(公告)日：2006-09-14
申请号：US10539245
申请日：2003-12-26
申请人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
发明人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
IPC分类号： B24B51/00 , B24B29/00 , B24B47/02
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing the polishing solution and polishing dust from adhering to the outer peripheral portion of the substrate holding part and drying out thereon. The substrate holding mechanism (top ring 1) has a mounting flange 2, a support member 6, and a retainer ring 3. A substrate W to be polished is held on the lower side of the support member 6 surrounded by the retainer ring 3, and the substrate W is pressed against a polishing surface. The mounting flange 2 is provided with a flow passage 26 contiguous with at least the retainer ring 3. A temperature-controlled gas supplied through the flow passage 26 to cool the mounting flange 2, the support member 6 and the retainer ring 3. The retainer ring 3 is provided with a plurality of through-holes 3a communicating with the flow passage 26 to spray the gas flowing through the flow passage 26 onto the polishing surface of a polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和研磨粉尘附着在基板保持部的外周部并在其上干燥。基板保持机构（顶环1）具有安装凸缘2，支撑构件6和保持环3.待被抛光的基板W被保持在由保持环3包围的支撑构件6的下侧，将基板W压在研磨面上。安装凸缘2设置有与至少保持环3相邻的流动通道26。通过流路26提供的温度控制气体，以冷却安装凸缘2，支撑构件6和保持环3。保持环3设置有与流路26连通的多个通孔3a，以将流过流路26的气体喷射到研磨台的研磨面上。

3. 发明授权

US08292694B2 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method 有权
标题翻译：基板保持机构，基板研磨装置和基板研磨方法
公开(公告)号：US08292694B2
公开(公告)日：2012-10-23
申请号：US12618033
申请日：2009-11-13
申请人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
发明人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
IPC分类号： B24B49/00
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。基板保持机构具有安装凸缘，支撑构件6和保持环。待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。安装凸缘设置有至少与保持环相邻的流动通道。通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

4. 发明授权

US07883394B2 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method 有权
标题翻译：基板保持机构，基板研磨装置和基板研磨方法
公开(公告)号：US07883394B2
公开(公告)日：2011-02-08
申请号：US12184032
申请日：2008-07-31
申请人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
发明人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
IPC分类号： B24B49/00
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。基板保持机构具有安装凸缘，支撑构件6和保持环。待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。安装凸缘设置有至少与保持环相邻的流动通道。通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

5. 发明申请

US20080318503A1 SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 有权
标题翻译：基板保持机构，基板抛光装置和基板抛光方法
公开(公告)号：US20080318503A1
公开(公告)日：2008-12-25
申请号：US12184032
申请日：2008-07-31
申请人： Tetsuji TOGAWA , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
发明人： Tetsuji TOGAWA , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
IPC分类号： B24B55/00 , B24B55/12
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。基板保持机构具有安装凸缘，支撑构件6和保持环。待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。安装凸缘设置有至少与保持环相邻的流动通道。通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

6. 发明授权

US07419420B2 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method 有权
标题翻译：基板保持机构，基板研磨装置和基板研磨方法
公开(公告)号：US07419420B2
公开(公告)日：2008-09-02
申请号：US10539245
申请日：2003-12-26
申请人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
发明人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
IPC分类号： B24B49/00 , B24B5/00
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。基板保持机构具有安装凸缘，支撑构件6和保持环。待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。安装凸缘设置有至少与保持环相邻的流动通道。通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

7. 发明授权

US09669407B2 Microchip 有权
公开(公告)号：US09669407B2
公开(公告)日：2017-06-06
申请号：US13292699
申请日：2011-11-09
申请人： Kensuke Kojima , Yuji Segawa , Hidetoshi Watanabe , Yoshiaki Kato , Toshio Watanabe
发明人： Kensuke Kojima , Yuji Segawa , Hidetoshi Watanabe , Yoshiaki Kato , Toshio Watanabe
IPC分类号： B01L3/00 , B01L9/00
CPC分类号： B01L3/502715 , B01L9/527 , B01L2200/025 , B01L2200/027 , B01L2200/04 , B01L2200/0684 , B01L2200/0689 , B01L2200/18 , B01L2300/043 , B01L2300/044 , B01L2300/0609 , B01L2300/0672 , B01L2300/0816 , B01L2300/123 , B01L2400/049
摘要： Disclosed herein is a microchip that allows a sample to be introduced into a region easily and accurately, and which makes it possible to obtain high analysis accuracy. The microchip includes an airtight region into which a solution is externally introduced; and positioning means for positioning a channel for injecting the solution into the region by penetrating a substrate layer forming the region with respect to a puncture part of the region.

8. 发明授权

US09360629B2 Waveguide type optical switch 有权
标题翻译：波导型光开关
公开(公告)号：US09360629B2
公开(公告)日：2016-06-07
申请号：US13984282
申请日：2012-02-14
申请人： Toshio Watanabe , Kenya Suzuki , Takashi Goh , Hiroshi Yamazaki , Atsushi Mori
发明人： Toshio Watanabe , Kenya Suzuki , Takashi Goh , Hiroshi Yamazaki , Atsushi Mori
IPC分类号： G02B6/35 , G02F1/313 , H04Q11/00 , G02B6/12 , G02F1/01 , G02F1/225 , G02F1/21
CPC分类号： G02B6/3546 , G02B6/3594 , G02B2006/12145 , G02F1/0147 , G02F1/225 , G02F1/3137 , G02F2001/212 , H04Q11/0005 , H04Q2011/0052
摘要： A waveguide type optical switch that can reduce the number of intersections in a matrix optical switch having the configuration of connecting unit optical switches and optical combining devices or optical branching devices to have a connecting function from “multiple inputs to one output” to “one input to multiple outputs”. To reduce the number of intersections in an entire matrix optical switch, an optical combining device of M inputs and one output is divided into (M−1) pieces of unit optical combining elements each having two inputs and one output, which are arranged immediately after (N−1) pieces of respective output ports excluding one piece of the output port closer to the input in the matrix optical switch out of N pieces of the output ports in the optical switch of one input and N outputs.
摘要翻译：一种波导型光开关，其可以减少具有连接单元光开关和光学组合装置或光分路装置的配置的矩阵光开关中的交叉数，以具有从“多输入到一输出”到“一输入”的连接功能到多个输出“。为了减少整个矩阵光开关中的交点的数量，将M个输入和一个输出的光学组合装置分成（M-1）个单元光学组合元件，它们分别具有两个输入和一个输出（N-1）个输出端口，在一个输入的光开关中的N个输出端口中，除了在矩阵光开关中的输入端更靠近的一个输出端口，N个输出。

9. 发明授权

US08894455B2 Outboard motor 有权
标题翻译：舷外马达
公开(公告)号：US08894455B2
公开(公告)日：2014-11-25
申请号：US13397848
申请日：2012-02-16
申请人： Toshio Watanabe
发明人： Toshio Watanabe
IPC分类号： B63H20/32 , F02M35/10 , F02M35/16
CPC分类号： F02M35/168 , B63H20/32 , F02M35/10013 , F02M35/10262 , Y02T10/146
摘要： In an outboard motor having an engine unit housed in an engine room formed by an exterior cover, a protruding portion is projectingly formed on the upper surface of an engine cover covering the upper portion of the outboard motor, and an outside air inlet opened to face forward is provided at the protruding portion.
摘要翻译：在具有容纳在由外盖形成的发动机室中的发动机单元的舷外马达中，突出部分突出地形成在覆盖舷外马达的上部的发动机盖的上表面上，并且外部空气入口向外敞开前端设置在突出部分。

10. 发明申请

US20120149005A1 REACTION TREATMENT DEVICE AND REACTION TREATMENT METHOD 审中-公开
标题翻译：反应处理装置和反应处理方法
公开(公告)号：US20120149005A1
公开(公告)日：2012-06-14
申请号：US13294443
申请日：2011-11-11
申请人： Kensuke Kojima , Hiroshi Katayama , Akira Shinozaki , Akira Toda , Yoshiaki Kato , Hidetoshi Watanabe , Tasuku Yotoriyama , Junji Kajihara , Toshio Watanabe , Masahiro Miyachi , Takanori Anaguchi
发明人： Kensuke Kojima , Hiroshi Katayama , Akira Shinozaki , Akira Toda , Yoshiaki Kato , Hidetoshi Watanabe , Tasuku Yotoriyama , Junji Kajihara , Toshio Watanabe , Masahiro Miyachi , Takanori Anaguchi
IPC分类号： C12Q3/00 , C12M1/38
CPC分类号： B01L7/52 , B01L3/5027 , B01L2200/147 , B01L2300/0654 , B01L2300/0829 , B01L2300/0887
摘要： Disclosed herein is a reaction treatment device including a temperature control section which includes a first temperature control section disposed at an outer peripheral edge part of a group of reaction regions and a planar second temperature control section, wherein the first temperature control section and the second temperature control section are disposed opposite to each other, with the reaction region group therebetween.
摘要翻译：本文公开了一种反应处理装置，其包括温度控制部，该温度控制部包括设置在一组反应区域的外周缘部的第一温度控制部和平面的第二温度控制部，其中，第一温度控制部和第二温度控制部分彼此相对设置，反应区域组在它们之间。

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