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    • 6. 发明申请
    • Radar Device
    • 雷达装置
    • US20080062038A1
    • 2008-03-13
    • US11840680
    • 2007-08-17
    • Shiro OuchiTadashi IsonoKazuo MatsuuraYoshiyuki Sasada
    • Shiro OuchiTadashi IsonoKazuo MatsuuraYoshiyuki Sasada
    • G01S13/00
    • G01S7/032G01S13/931G01S2007/027H05K7/20436H05K7/20854
    • In a radar device, in order to make it simple to attach a connector to a housing and connect a control circuit board to an antenna module, to make it possible to automate assembly, and to achieve downsizing and weight reduction, the radar device comprises a resin housing having upper and lower opening portions, and a control circuit board attached to the resin housing, a metal front cover and a metal rear cover are arranged so as to close the upper and lower opening portions of the resin housing, an opening portion is formed in the metal front cover, and an antenna module is arranged in the opening portion so as to be firmly attached, whereby the radar device can be assembled from one side, it is possible to improve efficiency of assembling work and it is possible to achieve downsizing and cost reduction of the radar device.
    • 在雷达装置中,为了简单地将连接器连接到外壳并将控制电路板连接到天线模块,使得能够自动组装,并且实现小型化和减轻重量,雷达装置包括 具有上开口部和下开口部的树脂壳体和安装在树脂壳体上的控制电路基板,金属前盖和金属后盖配置成封闭树脂壳体的上下开口部,开口部为 形成在金属前盖中,并且天线模块布置在开口部分中以牢固地附接,从而可以从一侧组装雷达装置,可以提高组装作业的效率,并且可以实现 雷达装置的精简和降低成本。
    • 7. 发明申请
    • On-vehicle radar
    • 车载雷达
    • US20060290564A1
    • 2006-12-28
    • US11178408
    • 2005-07-12
    • Yoshiyuki SasadaShiro OuchiHiroshi Shinoda
    • Yoshiyuki SasadaShiro OuchiHiroshi Shinoda
    • G01S13/90
    • G01S13/931G01S2013/9321G01S2013/9342G01S2013/9346G01S2013/9375H01Q1/3233H01Q1/425H01Q15/24H01Q19/021H01Q19/028H01Q21/065
    • A small, light and low-cost on-vehicle radar which reduces noise caused by a road surface, own car and radar itself, prevents road clutter and improves detection performance is provided. The on-vehicle radar includes an antenna having one or a plurality of radiation elements which radiate linearly polarized waves, a slit plate provided with a plurality of slits on a metal plate disposed in front of this antenna surface and a foamed material provided between the antenna and slit plate. Side lobes whose principal component is a cross polarized wave from a feeder line of the antenna can be reduced and road clutter can be prevented. Resonance of slits whose characteristic frequency becomes equal to or smaller than the frequency of vehicle can be reduced and noise can be suppressed. Therefore, it is possible to obtain excellent detection performance as the radar apparatus.
    • 一种小型,轻便和低成本的车载雷达,减少路面噪音,自身车载雷达本身,防止道路杂波,提高检测性能。 车载雷达包括具有辐射线性偏振波的一个或多个辐射元件的天线,在设置在该天线表面之前的金属板上设置有多个狭缝的狭缝板和设置在该天线之间的泡沫材料 和狭缝板。 其主要成分是来自天线的馈电线的交叉极化波的旁瓣可以减少,并且可以防止道路杂波。 可以减小特征频率变得等于或小于车辆频率的缝隙的共振,并且可以抑制噪声。 因此,作为雷达装置,可以获得优异的检测性能。
    • 8. 发明授权
    • Mounting structure of high frequency semiconductor apparatus and its production method
    • 高频半导体装置的安装结构及其制作方法
    • US06771150B2
    • 2004-08-03
    • US10245724
    • 2002-09-18
    • Yoshiyuki Sasada
    • Yoshiyuki Sasada
    • H01P710
    • H01P11/008H01P7/10
    • In a high-frequency circuit having a substrate having a high-frequency transmission line and an dielectric resonator formed on said substrate so that said dielectric resonator and said high-frequency transmission line may be coupled electro-magnetically to each other, a hole part or a cavity part is formed at a part of said substrate and a dielectric resonator is embedded in said hole part or said cavity part. In the same object, a high-frequency circuit having a dielectric resonator is produced by the step for forming a high-frequency transmission line on a substrate, the step for forming a hole part or a cavity part on a part of the substrate, and the step for mounting a dielectric resonator in the hole par formed on the surface of the substrate.
    • 在具有高频传输线的衬底和形成在所述衬底上的介质谐振器的高频电路中,使得所述介质谐振器和所述高频传输线可以彼此电磁耦合,孔部分或 在所述基板的一部分上形成空腔部分,并且介电谐振器嵌入在所述孔部分或所述空腔部分中。 在同一个目的中,通过在衬底上形成高频传输线的步骤,在衬底的一部分上形成孔部或空腔部的步骤,制造具有介质谐振器的高频电路,以及 将介质谐振器安装在基板表面上形成的孔中的步骤。
    • 9. 发明授权
    • Semiconductor type pressure sensor
    • 半导体式压力传感器
    • US6122974A
    • 2000-09-26
    • US139273
    • 1998-08-25
    • Shinya SatoSeikou SuzukiShinichi YamaguchiYoshiyuki SasadaMasayuki MikiMasanori KubotaAtsushi Miyazaki
    • Shinya SatoSeikou SuzukiShinichi YamaguchiYoshiyuki SasadaMasayuki MikiMasanori KubotaAtsushi Miyazaki
    • G01L9/04G01L9/00G01L7/08
    • G01L19/147
    • A pressure sensor superior in pressure resistance and capable of covering from a low to high pressure range as a measuring range is to be provided. Plural pressure sensing sections for high and low pressures are formed on a silicon board, the pressure sensing sections each com ing an outer frame portion, a diaphragm portion, a strain gauge portion and an electrode portion. The silicon board side with the strain gauge portions formed thereon and an insulating substrate having electrode take-out portions are bonded together in such a manner that the strain gauge portions are hermetically sealed and that the electrode portions on the silicon board and the electrode take-out portions of the insulating substrate are electrically connected with each other, to constitute a pressure sensing unit. The pressure sensing unit, a low-melting glass and a stem are laminated together in such a manner that lead pins are electrically bonded by solder to the electrode portions of the silicon board through the electrode take-out portions of the insulating substrate. In this state, the low-melting glass is melted to bond the pressure sensing unit and the stem with each other.
    • 要提供耐压性能优异且能够从低压到高压范围覆盖的压力传感器作为测量范围。 用于高压和低压的多个压力感测部分形成在硅板上,每个压力感测部分均设有外框部分,隔膜部分,应变计部分和电极部分。 在其上形成有应变计部分的硅板侧和具有电极取出部分的绝缘基板以使应变计部分气密密封的方式接合在一起,并且硅板和电极上的电极部分 绝缘基板的外侧部分彼此电连接,以构成压力感测单元。 将压力感测单元,低熔点玻璃和阀杆以这样的方式层压在一起,使得引脚通过焊料通过绝缘基板的电极取出部分与硅板的电极部分电连接。 在这种状态下,低熔点玻璃被熔化,以将压力感测单元和杆彼此粘合。
    • 10. 发明授权
    • Mounting structure of high-frequency semiconductor apparatus and its production method
    • 高频半导体装置的安装结构及其制作方法
    • US07307581B2
    • 2007-12-11
    • US10871054
    • 2004-06-21
    • Yoshiyuki Sasada
    • Yoshiyuki Sasada
    • G01S13/491H03B1/00G01S13/93G01S13/00
    • H01P11/008H01P7/10
    • In a high-frequency circuit having a substrate having a high-frequency transmission line and an dielectric resonator formed on said substrate so that said dielectric resonator and said high-frequency transmission line may be coupled electro-magnetically to each other, a hole part or a cavity part is formed at a part of said substrate and a dielectric resonator is embedded in said hole part or said cavity part. In the same object, a high-frequency circuit having a dielectric resonator is produced by the step for forming a high-frequency transmission line on a substrate, the step for forming a hole part or a cavity part on a part of the substrate, and the step for mounting a dielectric resonator in the hole par formed on the surface of the substrate.
    • 在具有高频传输线的衬底和形成在所述衬底上的介质谐振器的高频电路中,使得所述介质谐振器和所述高频传输线可以彼此电磁耦合,孔部分或 在所述基板的一部分上形成空腔部分,并且介电谐振器嵌入在所述孔部分或所述空腔部分中。 在同一个目的中,通过在衬底上形成高频传输线的步骤,在衬底的一部分上形成孔部或空腔部的步骤,制造具有介质谐振器的高频电路,以及 将介质谐振器安装在基板表面上形成的孔中的步骤。