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1. 发明授权

US07744445B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US07744445B2
公开(公告)日：2010-06-29
申请号：US11665001
申请日：2005-10-12
申请人： Takeo Kubota , Atsushi Shigeta , Gen Toyota , Tamami Takahashi , Daisaku Fukuoka , Kenya Ito
发明人： Takeo Kubota , Atsushi Shigeta , Gen Toyota , Tamami Takahashi , Daisaku Fukuoka , Kenya Ito
IPC分类号： B24B1/00
CPC分类号： H01L21/02021 , B24B9/065 , B24B21/002
摘要： A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).
摘要翻译：抛光装置具有研磨带（21），用于将研磨带（21）供给到研磨带（21）与切口部（11）接触的接触部（30）的供带盘（22））和用于从所述接触部分（30）卷绕所述研磨带（21）的卷取卷轴（23）。抛光装置还具有第一引导部分（24），其具有用于将研磨带（21）直接供应到接触部分（30）的引导表面（241），以及具有引导表面的第二引导部分（25）研磨带（21）卷绕在卷取卷轴（23）上。第一引导部（24）的引导面（241）和/或第二引导部（25）的引导面具有与基板（10）的切口部（11）的形状对应的形状。

2. 发明申请

US20090017730A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20090017730A1
公开(公告)日：2009-01-15
申请号：US11665001
申请日：2005-10-12
申请人： Takeo Kubota , Atsushi Shigeta , Gen Toyota , Tamami Takahashi , Daisaku Fukuoka , Kenya Ito
发明人： Takeo Kubota , Atsushi Shigeta , Gen Toyota , Tamami Takahashi , Daisaku Fukuoka , Kenya Ito
IPC分类号： B24B1/00 , B24B21/00
CPC分类号： H01L21/02021 , B24B9/065 , B24B21/002
摘要： A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).
摘要翻译：抛光装置具有研磨带（21），用于将研磨带（21）供给到研磨带（21）与切口部（11）接触的接触部（30）的供带盘（22））和用于从所述接触部分（30）卷绕所述研磨带（21）的卷取卷轴（23）。抛光装置还具有第一引导部分（24），其具有用于将研磨带（21）直接供应到接触部分（30）的引导表面（241），以及具有引导表面的第二引导部分（25）研磨带（21）卷绕在卷取卷轴（23）上。第一引导部（24）的引导面（241）和/或第二引导部（25）的引导面具有与基板（10）的切口部（11）的形状对应的形状。

3. 发明授权

US08506362B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08506362B2
公开(公告)日：2013-08-13
申请号：US12667891
申请日：2008-07-08
申请人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B7/26
CPC分类号： B24B21/002 , B24B9/065 , H01L21/02021
摘要： A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.
摘要翻译：抛光装置包括：基板保持器，其构造成保持和旋转基板;压垫，其构造成将具有抛光表面的抛光带压靠在由基板保持器保持的基板的斜面部分上;以及馈送机构，其构造成使抛光胶带沿其纵向行进。压垫包括具有用于通过研磨带挤压基板的斜面部分的按压表面的硬质部件和用于通过带状抛光工具将硬质部件压靠在基板的斜面部分上的至少一个弹性部件。

4. 发明申请

US20110003537A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20110003537A1
公开(公告)日：2011-01-06
申请号：US12667891
申请日：2008-07-08
申请人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B21/16 , B24B21/22
CPC分类号： B24B21/002 , B24B9/065 , H01L21/02021
摘要： A polishing apparatus according to the present invention includes a substrate holder (32) configured to hold and rotate a substrate (W), a press pad (50) configured to press a polishing tape (41) having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism (45) configured to cause the polishing tape to travel in its longitudinal direction. The press pad (50) includes a hard member (51) having a pressing surface (51a) for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member (53) for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.
摘要翻译：根据本发明的抛光装置包括：衬底保持器（32），其被构造成保持和旋转衬底（W），压垫（50）被构造成将具有抛光表面的抛光带（41）压靠在衬底由基板保持器保持的基板和构造成使研磨带沿其纵向方向行进的进给机构（45）。压垫（50）包括具有用于通过研磨带挤压基板的斜面部分的按压表面（51a）的硬质构件（51）和用于将硬构件压靠在斜面上的至少一个弹性构件（53）通过带状抛光工具的基底部分。

5. 发明申请

US20100255757A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：US20100255757A1
公开(公告)日：2010-10-07
申请号：US12819578
申请日：2010-06-21
申请人： Atsushi SHIGETA , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi SHIGETA , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： B24B49/10 , B24B49/16 , B24B21/12
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

6. 发明申请

US20070287364A1 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20070287364A1
公开(公告)日：2007-12-13
申请号：US11882398
申请日：2007-08-01
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： B24B7/00 , B24B1/00
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

7. 发明授权

US07767472B2 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US07767472B2
公开(公告)日：2010-08-03
申请号：US11882398
申请日：2007-08-01
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/00
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

8. 发明申请

US20060019417A1 Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20060019417A1
公开(公告)日：2006-01-26
申请号：US11187024
申请日：2005-07-22
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/66 , H01L21/302
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

9. 发明授权

US07976361B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US07976361B2
公开(公告)日：2011-07-12
申请号：US12213186
申请日：2008-06-16
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
IPC分类号： B24B1/00
CPC分类号： B24B21/002 , B24B9/065 , H01L21/68707 , H01L21/68792
摘要： A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.
摘要翻译：抛光装置适用于抛光半导体晶片等基板的周边。抛光装置包括：保持部，其构造成保持工件;以及抛光头，其被配置为使研磨带与工件接触。抛光装置还包括供给卷轴，其构造成将抛光带供给到抛光头，构造成重绕与工件接触的研磨带的倒带卷轴和摆动机构，其构造成使抛光头与第一抛光头进行摆动运动，其枢轴在预定点。

10. 发明申请

US20100178851A1 POLISHING APPARATUS AND POLISHING METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20100178851A1
公开(公告)日：2010-07-15
申请号：US12685793
申请日：2010-01-12
申请人： Masayuki NAKANISHI , Kenya Ito , Tamami Takahashi , Kumiko Miyamoto , Kenji Kodera
发明人： Masayuki NAKANISHI , Kenya Ito , Tamami Takahashi , Kumiko Miyamoto , Kenji Kodera
IPC分类号： B24B9/06 , B24B1/00 , B24B21/00
CPC分类号： B24B9/065 , B24B21/004
摘要： A polishing apparatus for polishing a periphery of a substrate includes a substrate holder configured to rotate the substrate, a first polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a first polishing tool into contact with the periphery of the substrate when rotated by the substrate holder, and a second polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a second polishing tool into contact with the periphery of the substrate when rotated by the substrate holder. The polishing layer of the first polishing tool has hard first abrasive grains, and the polishing layer of the second polishing tool has second abrasive grains that are softer than the first abrasive grains.
摘要翻译：用于抛光基板周边的抛光装置包括：基板保持器，其被构造成旋转基板;第一抛光部，其被配置为通过使第一抛光工具的抛光层与基板的周边接触来抛光基板的周边; 当被基板保持器旋转时，以及第二抛光部分，被配置为当第二抛光工具的抛光层与基板保持器旋转时与基板的周边接触，从而抛光基板的周边。第一研磨工具的抛光层具有硬的第一磨料颗粒，并且第二抛光工具的抛光层具有比第一磨料颗粒更软的第二磨料颗粒。

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