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1. 发明授权

US07767472B2 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US07767472B2
公开(公告)日：2010-08-03
申请号：US11882398
申请日：2007-08-01
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/00
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

2. 发明申请

US20060019417A1 Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20060019417A1
公开(公告)日：2006-01-26
申请号：US11187024
申请日：2005-07-22
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/66 , H01L21/302
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

3. 发明申请

US20100255757A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：US20100255757A1
公开(公告)日：2010-10-07
申请号：US12819578
申请日：2010-06-21
申请人： Atsushi SHIGETA , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi SHIGETA , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： B24B49/10 , B24B49/16 , B24B21/12
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

4. 发明申请

US20070287364A1 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20070287364A1
公开(公告)日：2007-12-13
申请号：US11882398
申请日：2007-08-01
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： B24B7/00 , B24B1/00
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

5. 发明申请

US20090017730A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20090017730A1
公开(公告)日：2009-01-15
申请号：US11665001
申请日：2005-10-12
申请人： Takeo Kubota , Atsushi Shigeta , Gen Toyota , Tamami Takahashi , Daisaku Fukuoka , Kenya Ito
发明人： Takeo Kubota , Atsushi Shigeta , Gen Toyota , Tamami Takahashi , Daisaku Fukuoka , Kenya Ito
IPC分类号： B24B1/00 , B24B21/00
CPC分类号： H01L21/02021 , B24B9/065 , B24B21/002
摘要： A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).
摘要翻译：抛光装置具有研磨带（21），用于将研磨带（21）供给到研磨带（21）与切口部（11）接触的接触部（30）的供带盘（22））和用于从所述接触部分（30）卷绕所述研磨带（21）的卷取卷轴（23）。抛光装置还具有第一引导部分（24），其具有用于将研磨带（21）直接供应到接触部分（30）的引导表面（241），以及具有引导表面的第二引导部分（25）研磨带（21）卷绕在卷取卷轴（23）上。第一引导部（24）的引导面（241）和/或第二引导部（25）的引导面具有与基板（10）的切口部（11）的形状对应的形状。

6. 发明授权

US07744445B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US07744445B2
公开(公告)日：2010-06-29
申请号：US11665001
申请日：2005-10-12
申请人： Takeo Kubota , Atsushi Shigeta , Gen Toyota , Tamami Takahashi , Daisaku Fukuoka , Kenya Ito
发明人： Takeo Kubota , Atsushi Shigeta , Gen Toyota , Tamami Takahashi , Daisaku Fukuoka , Kenya Ito
IPC分类号： B24B1/00
CPC分类号： H01L21/02021 , B24B9/065 , B24B21/002
摘要： A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).
摘要翻译：抛光装置具有研磨带（21），用于将研磨带（21）供给到研磨带（21）与切口部（11）接触的接触部（30）的供带盘（22））和用于从所述接触部分（30）卷绕所述研磨带（21）的卷取卷轴（23）。抛光装置还具有第一引导部分（24），其具有用于将研磨带（21）直接供应到接触部分（30）的引导表面（241），以及具有引导表面的第二引导部分（25）研磨带（21）卷绕在卷取卷轴（23）上。第一引导部（24）的引导面（241）和/或第二引导部（25）的引导面具有与基板（10）的切口部（11）的形状对应的形状。

7. 发明申请

US20070178701A1 Method of processing a substrate 审中-公开
标题翻译：处理基板的方法
公开(公告)号：US20070178701A1
公开(公告)日：2007-08-02
申请号：US11730890
申请日：2007-04-04
申请人： Gen Toyota , Atsushi Shigeta , Hiroyuki Yano
发明人： Gen Toyota , Atsushi Shigeta , Hiroyuki Yano
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/02043 , B24B9/065 , B24B37/02 , H01L21/02021 , H01L21/30625
摘要： There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.
摘要翻译：公开了一种处理基材的方法，该方法包括将表面活性剂或水溶性聚合物试剂涂布到待加工基材的表面上，并将基材的圆周部分和抛光部件相互滑动以使周向部分基板。

8. 发明授权

US07241205B2 Method of processing a substrate 有权
标题翻译：处理基板的方法
公开(公告)号：US07241205B2
公开(公告)日：2007-07-10
申请号：US11085495
申请日：2005-03-22
申请人： Gen Toyota , Atsushi Shigeta , Hiroyuki Yano
发明人： Gen Toyota , Atsushi Shigeta , Hiroyuki Yano
IPC分类号： B24B1/00
CPC分类号： B24B37/00 , B24B9/065 , B24D3/28
摘要： A method of processing a substrate is disclosed, wherein a sidewall surface of a notch portion formed in a circumferential portion of a substrate to be processed is polished by using a cylindrical polishing head rotatable with an axis as a rotational center.
摘要翻译：公开了一种处理基板的方法，其中通过使用以轴线作为旋转中心可旋转的圆柱形抛光头来抛光形成在待处理基板的圆周部分中的切口部分的侧壁表面。

9. 发明授权

US07217662B2 Method of processing a substrate 有权
公开(公告)号：US07217662B2
公开(公告)日：2007-05-15
申请号：US11088199
申请日：2005-03-24
申请人： Gen Toyota , Atsushi Shigeta , Hiroyuki Yano
发明人： Gen Toyota , Atsushi Shigeta , Hiroyuki Yano
IPC分类号： H01L21/461 , H01L21/302
CPC分类号： H01L21/02043 , B24B9/065 , B24B37/02 , H01L21/02021 , H01L21/30625
摘要： There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.

10. 发明申请

US20050245174A1 Method of processing a substrate 有权
标题翻译：处理基板的方法
公开(公告)号：US20050245174A1
公开(公告)日：2005-11-03
申请号：US11085495
申请日：2005-03-22
申请人： Gen Toyota , Atsushi Shigeta , Hiroyuki Yano
发明人： Gen Toyota , Atsushi Shigeta , Hiroyuki Yano
IPC分类号： B24B9/00 , B24B1/00 , B24B9/06 , B24B37/00 , B24D3/28 , H01L21/304
CPC分类号： B24B37/00 , B24B9/065 , B24D3/28
摘要： A method of processing a substrate is disclosed, wherein a sidewall surface of a notch portion formed in a circumferential portion of a substrate to be processed is polished by using a cylindrical polishing head rotatable with an axis as a rotational center.
摘要翻译：公开了一种处理基板的方法，其中通过使用以轴线作为旋转中心可旋转的圆柱形抛光头来抛光形成在待处理基板的圆周部分中的切口部分的侧壁表面。

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