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    • 5. 发明授权
    • Test apparatus of semiconductor device and method thereof
    • 半导体器件的测试装置及其方法
    • US08410803B2
    • 2013-04-02
    • US12820623
    • 2010-06-22
    • Nobuhiro SawaKouichi MinamiMasato Chiba
    • Nobuhiro SawaKouichi MinamiMasato Chiba
    • G01R31/00G01R31/20
    • G01R31/2891
    • A test apparatus according to the present invention includes a probe card recognition unit that recognizes positions of at least two probe card marks formed to a probe card and assumes a probe card mark connection line connecting the positions of the probe card marks, a backing material recognition unit that recognizes positions of at least two backing material marks formed to a backing material where a semiconductor chip is fixed thereto and assumes a backing material mark connection line connecting the positions of the backing material mark, a positional relationship recognition unit that recognizes a positional relationship between the probe card and the backing material according to the probe card mark connection line and the backing material mark connection line, and a correction unit that corrects the position of at least one of the probe card and the backing material according to the positional relationship.
    • 根据本发明的测试装置包括探针卡识别单元,其识别形成在探针卡上的至少两个探针卡标记的位置,并且采用连接探针卡标记的位置的探针卡标记连接线,背衬材料识别 单元,其识别形成在其上固定有半导体芯片的背衬材料上的至少两个背衬材料标记的位置,并且呈现连接背衬材料标记的位置的背衬材料标记连接线;识别位置关系的位置关系识别单元 根据探针卡标记连接线和背衬材料标记连接线在探针卡和背衬材料之间,以及根据位置关系校正探针卡和背衬材料中的至少一个的位置的校正单元。