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1. 发明授权

US07935891B2 Wiring board manufacturing method 有权
标题翻译：接线板制造方法
公开(公告)号：US07935891B2
公开(公告)日：2011-05-03
申请号：US12068992
申请日：2008-02-14
申请人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
发明人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
IPC分类号： H05K1/03
CPC分类号： H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.
摘要翻译：本发明涉及一种制造布线板的方法，包括：堆叠层，其中布线图案用绝缘层堆叠; 以及与所述堆积层分开形成的芯基板，所述方法包括以下步骤：在板状支撑体上可分离地形成所述堆积层; 将芯基板电连接到支撑体上的堆积层的布线图案; 并且从堆积层移除支撑体，以形成其中堆积层连接到芯基板的布线板。通过可分离地形成积层和芯基板，可以制造有效显示其特性的布线板。

2. 发明申请

US20080142256A1 Wiring board manufacturing method 有权
公开(公告)号：US20080142256A1
公开(公告)日：2008-06-19
申请号：US12068992
申请日：2008-02-14
申请人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
发明人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
IPC分类号： H05K3/02 , H05K1/11
CPC分类号： H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

3. 发明申请

US20060112544A1 Wiring board manufacturing method 有权
标题翻译：接线板制造方法
公开(公告)号：US20060112544A1
公开(公告)日：2006-06-01
申请号：US11266480
申请日：2005-11-04
申请人： Takashi Shuto , Kenji Takano , Kenji IIda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
发明人： Takashi Shuto , Kenji Takano , Kenji IIda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
IPC分类号： H05K3/20 , H01R43/00
CPC分类号： H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.
摘要翻译：本发明涉及一种制造布线板的方法，包括：堆叠层，其中布线图案用绝缘层堆叠; 以及与所述堆积层分开形成的芯基板，所述方法包括以下步骤：在板状支撑体上可分离地形成所述堆积层; 将芯基板电连接到支撑体上的堆积层的布线图案; 并且从堆积层移除支撑体以形成其中堆积层连接到芯基板的布线板。通过可分离地形成积层和芯基板，可以制造有效显示其特性的布线板。

4. 发明授权

US07377030B2 Wiring board manufacturing method 有权
标题翻译：接线板制造方法
公开(公告)号：US07377030B2
公开(公告)日：2008-05-27
申请号：US11266480
申请日：2005-11-04
申请人： Takashi Shuto , Kenji Takano , Kenji Ilda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
发明人： Takashi Shuto , Kenji Takano , Kenji Ilda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
IPC分类号： H05K3/36
CPC分类号： H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.
摘要翻译：本发明涉及一种制造布线板的方法，包括：堆叠层，其中布线图案用绝缘层堆叠; 以及与所述堆积层分开形成的芯基板，所述方法包括以下步骤：在板状支撑体上可分离地形成所述堆积层; 将芯基板电连接到支撑体上的堆积层的布线图案; 并且从堆积层移除支撑体以形成其中堆积层连接到芯基板的布线板。通过可分离地形成积层和芯基板，可以制造有效显示其特性的布线板。

5. 发明授权

US5538616A Process for copper plating a wiring board 失效
标题翻译：镀铜布线板的工艺
公开(公告)号：US5538616A
公开(公告)日：1996-07-23
申请号：US457785
申请日：1995-06-01
申请人： Keiji Arai
发明人： Keiji Arai
IPC分类号： H05K3/24 , C23C18/32 , H05K1/09 , H05K3/26 , H05K3/42 , H05K3/46 , C25D5/00
CPC分类号： H05K3/429 , H05K3/4641 , H05K1/09 , H05K2201/0344 , H05K3/422 , H05K3/427
摘要： An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.
摘要翻译：使用化学镀镍作为电镀铜的底漆。优选地，在强酸性条件（pH：1以下）下，用镍盐对铝的表面进行镍取代之后进行无电镀镍。更优选地，在铝的表面上的氧化物膜被去除之后进行镍取代。

6. 外观设计

USD333641S Motorcycle 失效
公开(公告)号：USD333641S
公开(公告)日：1993-03-02
申请号：US648429
申请日：1991-01-24
申请人： Shigeki Sakaguchi , Nobuyuki Shiwa , Keiji Arai
设计人： Shigeki Sakaguchi , Nobuyuki Shiwa , Keiji Arai

7. 发明申请

US20130062800A1 Method for Producing Wafer Lens 审中-公开
标题翻译：生产晶圆透镜的方法
公开(公告)号：US20130062800A1
公开(公告)日：2013-03-14
申请号：US13700423
申请日：2011-04-28
申请人： Keiji Arai
发明人： Keiji Arai
IPC分类号： B29D11/00
CPC分类号： B29D11/00326 , B29C31/042 , B29C35/0888 , B29C2035/0822 , B29C2035/0827 , G02B3/0031 , G02B3/0056
摘要： A method for producing a wafer lens provided with a lens portion made of a photo-curable resin on one face of a substrate. The method includes a dispensing step, a curing step and a releasing step. In the dispensing step, a photo-curable resin material is dispensed on at least one of (i) a mold having a molding surface in a shape corresponding to an optical surface shape of the lens portion and (ii) the one face of the substrate. The photo-curable resin material has a viscosity of 10000 cP or more at 25° C. In the dispensing step, the photo-curable resin material is heated so that the viscosity of the photo-curable resin material becomes between 1000 cP and 10000 cP, and dispensed.
摘要翻译：一种晶片透镜的制造方法，其在基板的一个面上设置有由光固化树脂制成的透镜部。该方法包括分配步骤，固化步骤和释放步骤。在分配步骤中，光可固化树脂材料分配在（i）具有与透镜部分的光学表面形状相对应的形状的模制表面的模具中的至少一个和（ii）基板的一个面。光固化性树脂材料在25℃下的粘度为10000cP以上。在分注工序中，对光固化树脂材料进行加热，使得光固化树脂材料的粘度为1000cP〜10000cP 并分配。

8. 发明授权

US06531661B2 Multilayer printed circuit board and method of making the same 失效
公开(公告)号：US06531661B2
公开(公告)日：2003-03-11
申请号：US09880037
申请日：2001-06-14
申请人： Katsumi Uchikawa , Keiji Arai , Kazuhiko Iijima , Naoto Maezawa
发明人： Katsumi Uchikawa , Keiji Arai , Kazuhiko Iijima , Naoto Maezawa
IPC分类号： H05K103
CPC分类号： H05K3/4688 , H05K1/0366 , H05K3/0035 , H05K3/4602 , H05K3/4652 , H05K3/4655 , H05K2201/09509 , H05K2201/09518 , H05K2201/09536
摘要： A multilayer printed circuit board is provided which includes a base member having a surface provided with a base wiring pattern, an inner buildup layer laminated on the base member and having a surface formed with an inner buildup wiring pattern, and an outer buildup layer laminated on the surface of the inner buildup layer and having a surface formed with an outer buildup wiring pattern. The wiring patterns are electrically connected to each other through vias. The inner buildup layer is formed of a resin material which is not reinforced by glass fibers, whereas the outer buildup layer is formed of a resin material reinforced by glass fibers.

9. 发明授权

US5448021A Copper plating process and wiring board 失效
标题翻译：镀铜工艺及接线板
公开(公告)号：US5448021A
公开(公告)日：1995-09-05
申请号：US234877
申请日：1994-04-28
申请人： Keiji Arai
发明人： Keiji Arai
IPC分类号： H05K3/24 , C23C18/32 , H05K1/09 , H05K3/26 , H05K3/42 , H05K3/46 , H05K1/00
CPC分类号： H05K3/429 , H05K3/4641 , H05K1/09 , H05K2201/0344 , H05K3/422 , H05K3/427
摘要： An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.
摘要翻译：使用化学镀镍作为电镀铜的底漆。优选地，在强酸性条件（pH：1以下）下，用镍盐对铝的表面进行镍取代之后进行无电镀镍。更优选地，在铝的表面上的氧化物膜被去除之后进行镍取代。

10. 发明授权

US4777396A Rotor of induction motor 失效
标题翻译：感应电机转子
公开(公告)号：US4777396A
公开(公告)日：1988-10-11
申请号：US111804
申请日：1987-10-23
申请人： Motoya Ito , Keiji Arai , Noriyoshi Takahashi , Noboru Fujimoto , Yoshitaka Kojima
发明人： Motoya Ito , Keiji Arai , Noriyoshi Takahashi , Noboru Fujimoto , Yoshitaka Kojima
IPC分类号： H02K17/16 , H02K21/12
CPC分类号： H02K17/16
摘要： A rotor of induction motor comprises a rotary shaft, a cylindrical rotor core fixedly secured on the rotary shaft, a conductive cover fixed on the outer circumferential surface of the rotor core, the conductive cover being formed of a composite material of magnetic material and electrically highly conductive material to have a circumferential permeability smaller than a radial permeability, and a magnetic skin made of a magnetic material and provided on the outer circumferential surface of the conductive cover, the magnetic skin having a circumferential permeability and an electrical conductivity which are set to be larger than the circumferential permeability and an electrical resistivity of the conductive cover, respectively, whereby a loss due to a spatial higher harmonics magnetic flux of higher order generated by a pulsating magnetic flux of slots in a stator of induction motor can be prevented.
摘要翻译：感应电动机的转子包括旋转轴，固定在旋转轴上的圆柱形转子芯，固定在转子芯的外圆周表面上的导电盖，导电盖由磁性材料和电高度的复合材料形成导电材料具有小于径向磁导率的圆周磁导率，以及由磁性材料制成并设置在导电盖的外圆周表面上的磁性表皮，具有圆周磁导率和导电性的磁性表皮设置为分别大于圆周导磁率和导电盖的电阻率，由此可以防止由感应电动机的定子中的脉动磁通量产生的高阶空间高次谐波磁通的损耗。

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