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1. 发明申请

US20090041990A1 METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD AND SOLDERED ELECTRONIC CIRCUIT BOARD 审中-公开
标题翻译：焊接粉末焊接到电子电路板和焊接电子电路板的方法
公开(公告)号：US20090041990A1
公开(公告)日：2009-02-12
申请号：US12066369
申请日：2006-09-06
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： H05K3/34 , H05K3/24 , B23K3/06
CPC分类号： H05K3/3484 , B23K1/20 , B23K3/0607 , B23K2101/42 , H05K2203/0126 , H05K2203/0292 , H05K2203/0425 , H05K2203/043 , H05K2203/124 , Y10T428/24802
摘要： A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, and supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder. A method for the production of a soldered electronic circuit board, includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part; supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder, and thermally fusing the attached solder powder, thereby forming a circuit. A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder and, on the occurrence of a part devoid of attachment of solder powder in the consequently formed electronic circuit board, supplying the part with a solder powder slurry, thereby inducing attachment of solder powder thereto.
摘要翻译：用于焊接粉末的附着方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，从而赋予金属表面粘性以形成粘性部分，并向粘性部分供给焊料粉末浆料悬浮在液体中，从而引起焊料粉末的附着。制造焊接电子电路板的方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，从而赋予金属表面粘性以形成粘性部分; 向粘性部分提供悬浮在液体中的焊料粉末浆料，从而引起焊料粉末的附着，并热粘合附着的焊料粉末，从而形成电路。用于焊接粉末的附着方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，从而赋予金属表面粘性以形成粘性部分，向粘性部分供应悬浮的焊料粉末浆料在液体中，从而引起焊料粉末的附着，并且在发生焊接粉末附着在所形成的电子电路板上的部分时，向该部分供给焊料粉末浆料，从而引起焊料粉末附着。

2. 发明授权

US09078382B2 Method of producing circuit board 有权
标题翻译：电路板生产方法
公开(公告)号：US09078382B2
公开(公告)日：2015-07-07
申请号：US13266310
申请日：2010-04-27
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： H05K3/00 , H01R9/00 , H05K3/34 , H05K3/28
CPC分类号： H05K3/3436 , H05K3/282 , H05K3/3452 , H05K3/3484 , H05K3/3489 , H05K2201/10234 , H05K2201/10674 , H05K2203/0425 , H05K2203/043 , H05K2203/124 , Y02P70/613 , Y10T29/49146
摘要： The present invention has been made in consideration of the above-described situation, and provides a method of producing a circuit board that can bond a component to be mounted without slanting the component, and simplify the steps. The method of producing a circuit board includes forming a first adhesive layer by applying a first adhesiveness-imparting compound on the surface of terminal portions of a circuit board; attaching a core body on the first adhesive layer of the terminal portions; forming a second adhesive layer by applying a second adhesiveness-imparting compound on the surface of the core body; attaching first solder particles on the second adhesive layer of the surface of the core body; and forming a solder layer on the surface of the core body by melting the first solder particles.
摘要翻译：本发明是考虑到上述情况而做出的，并且提供了一种制造电路板的方法，该电路板可以在不倾斜部件的情况下将待安装的部件结合，并且简化步骤。制造电路板的方法包括通过在电路板的端子部分的表面上施加第一粘附性化合物来形成第一粘合剂层; 将芯体附接在端子部分的第一粘合剂层上; 通过在芯体的表面上施加第二粘合性化合物来形成第二粘合剂层; 将第一焊料颗粒附着在芯体的表面的第二粘合剂层上; 以及通过熔化所述第一焊料颗粒在所述芯体的表面上形成焊料层。

3. 发明申请

US20120292377A1 APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD 有权
标题翻译：用于焊接粉末的装置和将焊剂粉末加入电子电路板的方法
公开(公告)号：US20120292377A1
公开(公告)日：2012-11-22
申请号：US13522547
申请日：2011-01-18
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： B23K3/06 , B23K1/20
CPC分类号： H05K3/3478 , B23K1/0016 , B23K1/203 , B23K3/06 , B23K2101/42 , H05K2203/0292 , H05K2203/0425 , H05K2203/1527 , H05K2203/1554
摘要： Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.
摘要翻译：公开了一种用于粘附焊料粉末以将焊料粉末细微地附着到电子电路板的装置以及将焊料粉末粘附到电子电路板的方法。用于粘附焊料粉末的装置包括容纳电子电路板和焊料粉末的容器; 设置在所述容器中的用于保持所述电子电路板的板保持部，使得其表面大致面向上下方向; 倾斜装置，其将容器的初始位置设定为容器沿第一方向倾斜的倾斜位置，并且使容器沿与第一方向相反的第二方向从初始位置倾斜，并使容器倾斜回到第一个方向; 以及设置有偏心马达的振动装置，所述偏心马达设置在容器的底部的中心，通过旋转轴的旋转而向容器的底部提供振动;以及控制装置，用于将偏心马达的旋转轴设置在与容器的倾斜方向相同的方向。

4. 发明申请

US20120042511A1 METHOD OF PRODUCING CIRCUIT BOARD 有权
标题翻译：生产电路板的方法
公开(公告)号：US20120042511A1
公开(公告)日：2012-02-23
申请号：US13266379
申请日：2010-04-12
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： H05K3/00
CPC分类号： H05K3/3478 , H05K3/3489 , H05K2203/041 , H05K2203/043 , H05K2203/124 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.
摘要翻译：提供一种制造电路板的方法，其可以通过防止在形成焊料凸块期间的焊料剥离和针状晶体的产生来稳定地提供正常的电路板。制造电路板的方法包括以下步骤：通过向电路板的端子的表面施加粘附性赋予化合物来形成粘合剂层; 将焊料颗粒附着到粘合剂层上; 将包括有机碱的氢卤酸盐的活化剂施加到焊料颗粒上，并通过在等于或低于焊料熔点的温度下加热焊料颗粒所附着的电路板来固定焊料颗粒; 将焊剂施加到已经固定有焊料颗粒的电路板上; 并通过加热电路板来熔化焊料颗粒。

5. 发明申请

US20100065615A1 METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD 有权
标题翻译：生产导电电路板的方法
公开(公告)号：US20100065615A1
公开(公告)日：2010-03-18
申请号：US12517320
申请日：2007-12-17
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： B23K1/20
CPC分类号： H05K3/3484 , H05K3/282 , H05K2203/0425 , H05K2203/043 , H05K2203/124
摘要： A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder.
摘要翻译：一种制造导电电路板的方法，包括通过使用赋予粘着性的化合物在印刷电路板上的导电电路的表面赋予粘性，将焊料粉末附着在粘性区域上，然后加热印刷线路板以熔化焊料形成焊锡电路。该方法的特征在于，在附着焊料粉末之前，将粘性赋予印刷线路板保持在不超过10℃的液体等中。

6. 发明申请

US20080173699A1 Method for Attachment of Solder Powder to Electronic Circuit Board and Solder-Attached Electronic Circuit Board 有权
标题翻译：将焊粉附着到电子电路板和焊接电子电路板上的方法
公开(公告)号：US20080173699A1
公开(公告)日：2008-07-24
申请号：US12013246
申请日：2008-01-11
申请人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
发明人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
IPC分类号： B23K1/20 , B23K31/00
CPC分类号： H05K3/3478 , H05K3/282 , H05K2203/0285 , H05K2203/0425 , H05K2203/0786 , H05K2203/124
摘要： A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.
摘要翻译：用于焊接粉末的附着方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，由此赋予粘合性以形成增粘部分，通过干法或湿法将焊料粉末附着到增粘部分，然后除去添加有防锈剂的水，脱氧水或脱氧水的液体中过度粘附的焊料粉末。

7. 发明授权

US06221692B1 Method of fabricating solder-bearing silicon semiconductor device and circuit board mounted therewith 有权
标题翻译：制造含硅硅半导体器件的方法和与其一起安装的电路板
公开(公告)号：US06221692B1
公开(公告)日：2001-04-24
申请号：US09382673
申请日：1999-08-25
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： H01L2144
CPC分类号： H01L24/13 , H01L21/4853 , H01L24/11 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/1191 , H01L2224/13022 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/3025 , H01L2224/13099 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A circuit board mounted with a semiconductor device is fabricated by forming on a silicon substrate at least one first metal layer, overlaying a second metal layer to completely cover the first metal layer, covering the whole surface of the second metal layer with an insulating material, etching the insulating material to open a window at a prescribed region of the surface of the second metal layer, selectively imparting adhesiveness to the portion at the window, adhering solder powder to the adhesive portion, melting the solder powder by heating to form a solder bump, selectively imparting adhesiveness to at least one electrode portion of a wiring board, adhering solder powder to the adhesive portion, melting the adhered solder powder by heating to form a solder bump on the electrode portion, and contacting and fusing the solder bump of the silicon substrate and the solder bump of the wiring board so as to form and maintain a prescribed gap between the silicon substrate and the wiring board.
摘要翻译：通过在硅衬底上形成至少一个第一金属层，覆盖第二金属层以完全覆盖第一金属层，用绝缘材料覆盖第二金属层的整个表面来制造安装有半导体器件的电路板，蚀刻绝缘材料以在第二金属层的表面的规定区域打开窗口，选择性地赋予窗口部分的粘合性，将焊料粉末附着到粘合剂部分，通过加热熔化焊料粉末以形成焊料凸块选择性地赋予布线板的至少一个电极部分的粘附性，将焊料粉末粘合到粘合剂部分，通过加热熔化粘附的焊料粉末，以在电极部分上形成焊料凸块，以及使硅的焊料凸块接触和熔合基板和焊料凸点，以在硅基板和布线之间形成并保持规定的间隙董事会

8. 发明授权

US5928440A Method of forming solder film 失效
标题翻译：形成焊锡膜的方法
公开(公告)号：US5928440A
公开(公告)日：1999-07-27
申请号：US513397
申请日：1995-08-10
申请人： Takeo Kuramoto , Masataka Watabe , Satoshi Noda , Takashi Shoji , Takekazu Sakai
发明人： Takeo Kuramoto , Masataka Watabe , Satoshi Noda , Takashi Shoji , Takekazu Sakai
IPC分类号： B23K3/06 , B23K35/02 , B23K35/36 , H01L23/495 , H05K3/28 , H05K3/34 , B23K35/24
CPC分类号： H05K3/282 , B23K3/0607 , B23K3/0623 , B23K35/0244 , B23K35/3613 , B23K35/3615 , H01L23/49582 , H05K3/3484 , B23K2201/40 , B23K2201/42 , H01L2924/0002 , H05K2201/10984 , H05K2203/0425 , H05K2203/043 , H05K2203/0522 , H05K2203/0557 , H05K2203/0591 , H05K2203/124 , Y10T428/12556
摘要： A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
摘要翻译：在诸如印刷电路板的金属电路板的焊盘和电子部件的引线框架的金属表面上形成焊料膜的方法，其能够形成精确和精细的图案，并且包括仅选择性地赋予粘合性通过粘性层形成溶液将金属表面的预定部分粘附到所得粘性部分上，然后通过加热熔化焊料从而形成焊料膜。

9. 发明授权

US08752754B2 Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board 有权
标题翻译：用于粘附焊料粉末的装置和将焊料粉末粘附到电子电路板上的方法
公开(公告)号：US08752754B2
公开(公告)日：2014-06-17
申请号：US13522547
申请日：2011-01-18
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： B23K31/02 , B23K1/06
CPC分类号： H05K3/3478 , B23K1/0016 , B23K1/203 , B23K3/06 , B23K2101/42 , H05K2203/0292 , H05K2203/0425 , H05K2203/1527 , H05K2203/1554
摘要： Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.
摘要翻译：公开了一种用于粘附焊料粉末以将焊料粉末细微地附着到电子电路板的装置以及将焊料粉末粘附到电子电路板的方法。用于粘附焊料粉末的装置包括容纳电子电路板和焊料粉末的容器; 设置在所述容器中的用于保持所述电子电路板的板保持部，使得其表面大致面向上下方向; 倾斜装置，其将容器的初始位置设定为容器沿第一方向倾斜的倾斜位置，并且使容器沿与第一方向相反的第二方向从初始位置倾斜，并使容器倾斜回到第一个方向; 以及设置有偏心马达的振动装置，所述偏心马达设置在容器的底部的中心，通过旋转轴的旋转而向容器的底部提供振动;以及控制装置，用于将偏心马达的旋转轴设置在与容器的倾斜方向相同的方向。

10. 发明授权

US08661659B2 Method of producing circuit board 有权
标题翻译：电路板生产方法
公开(公告)号：US08661659B2
公开(公告)日：2014-03-04
申请号：US13266379
申请日：2010-04-12
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： H05K3/36
CPC分类号： H05K3/3478 , H05K3/3489 , H05K2203/041 , H05K2203/043 , H05K2203/124 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.
摘要翻译：提供一种制造电路板的方法，其可以通过防止在形成焊料凸块期间的焊料剥离和针状晶体的产生来稳定地提供正常的电路板。制造电路板的方法包括以下步骤：通过向电路板的端子的表面施加粘附性赋予化合物来形成粘合剂层; 将焊料颗粒附着到粘合剂层上; 将包括有机碱的氢卤酸盐的活化剂施加到焊料颗粒上，并通过在等于或低于焊料熔点的温度下加热焊料颗粒所附着的电路板来固定焊料颗粒; 将焊剂施加到已经固定有焊料颗粒的电路板上; 并通过加热电路板来熔化焊料颗粒。

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