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    • 10. 发明授权
    • Pressure sensor
    • 压力传感器
    • US08272256B2
    • 2012-09-25
    • US12569939
    • 2009-09-30
    • Takashi MoriTakuya MizunoToshiyuki MatsuokaYoshinori TsujimuraTakio KojimaYuzo Higuchi
    • Takashi MoriTakuya MizunoToshiyuki MatsuokaYoshinori TsujimuraTakio KojimaYuzo Higuchi
    • G01M15/08
    • G01L23/22G01L19/143G01L23/18
    • A pressure sensor has a Si device having a first main surface that has a bonded area, a second main surface parallel to the first main surface, a pressure-sensitive resistor formed on the first main surface, and a joining assist pattern formed on the first main surface, and a pressing member bonded to the bonded area on the first main surface and compressing the Si device in a thickness direction. The pressure-sensitive resistor has a first bonded section which is placed within the bonded area of the first main surface and is bonded to the pressing member. The joining assist pattern has a second bonded section which is made of the same material as the first bonded section of the pressure-sensitive resistor and is placed within the bonded area of the first main surface and is bonded to the pressing member.
    • 压力传感器具有Si器件,其具有第一主表面,具有接合区域,平行于第一主表面的第二主表面,形成在第一主表面上的压敏电阻器,以及形成在第一主表面上的接合辅助图案 主表面和与第一主表面上的接合区域接合并且沿厚度方向压缩Si器件的按压部件。 压敏电阻器具有第一接合部,该第一接合部位于第一主面的接合区域内并且接合到按压部件。 接合辅助图案具有第二接合部,该第二接合部由与压敏电阻器的第一接合部相同的材料制成,并且被放置在第一主表面的接合区域内并且接合到按压部件。