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1. 发明授权

US08120921B2 Device having electronic components mounted therein and method for manufacturing such device 有权
标题翻译：具有安装在其中的电子部件的装置及其制造方法
公开(公告)号：US08120921B2
公开(公告)日：2012-02-21
申请号：US12669423
申请日：2008-07-18
申请人： Takao Yamazaki , Shinji Watanabe , Tomoo Murakami , Yuuki Fujimura , Ryoji Osu , Katsuhiko Suzuki , Shizuaki Masuda , Nobuyuki Sato , Kikuo Wada
发明人： Takao Yamazaki , Shinji Watanabe , Tomoo Murakami , Yuuki Fujimura , Ryoji Osu , Katsuhiko Suzuki , Shizuaki Masuda , Nobuyuki Sato , Kikuo Wada
IPC分类号： H05K7/20 , H01L25/065
CPC分类号： H01L25/165 , H01L23/367 , H01L23/5387 , H01L23/642 , H01L25/0652 , H01L2224/16 , H01L2924/09701 , H05K1/189 , H05K2201/056 , H05K2201/2036 , Y10T29/4913
摘要： A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.
摘要翻译：具有安装在其中的电子部件的装置具有第一电子部件，其在第一表面上具有外部端子，在第二表面上具有散热器，至少一个第二电子部件沿第一电子部件的第二表面的方向，电连接到第一电子部件和至少一个第二电子部件的柔性电路板，并且至少连接有至少一个第二电子部件的部分位于第一电子部件的第二表面侧，以及位于柔性电路板的至少一部分和第一电子部件的第二表面之间的间隔件。间隔件可以防止来自第一电子部件的热直接传递到第二电子部件。

2. 发明申请

US20100188821A1 DEVICE HAVING ELECTRONIC COMPONENTS MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH DEVICE 有权
标题翻译：具有安装的电子部件的装置和用于制造这种装置的方法
公开(公告)号：US20100188821A1
公开(公告)日：2010-07-29
申请号：US12669423
申请日：2008-07-18
申请人： Takao Yamazaki , Shinji Watanabe , Tomoo Murakami , Yuuki Fujimura , Ryoji Osu , Katsuhiko Suzuki , Shizuaki Masuda , Nobuyuki Sato , Kikuo Wada
发明人： Takao Yamazaki , Shinji Watanabe , Tomoo Murakami , Yuuki Fujimura , Ryoji Osu , Katsuhiko Suzuki , Shizuaki Masuda , Nobuyuki Sato , Kikuo Wada
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： H01L25/165 , H01L23/367 , H01L23/5387 , H01L23/642 , H01L25/0652 , H01L2224/16 , H01L2924/09701 , H05K1/189 , H05K2201/056 , H05K2201/2036 , Y10T29/4913
摘要： A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.
摘要翻译：具有安装在其中的电子部件的装置具有第一电子部件，其在第一表面上具有外部端子，在第二表面上具有散热器，至少一个第二电子部件沿第一电子部件的第二表面的方向，电连接到第一电子部件和至少一个第二电子部件的柔性电路板，并且至少连接有至少一个第二电子部件的部分位于第一电子部件的第二表面侧，以及位于柔性电路板的至少一部分和第一电子部件的第二表面之间的间隔件。间隔件可以防止来自第一电子部件的热直接传递到第二电子部件。

3. 发明授权

US08758889B2 Gas barrier film and device 有权
标题翻译：防气膜和装置
公开(公告)号：US08758889B2
公开(公告)日：2014-06-24
申请号：US13070949
申请日：2011-03-24
申请人： Tomoo Murakami
发明人： Tomoo Murakami
IPC分类号： B32B7/02 , B32B9/00 , C08F30/02
CPC分类号： B32B7/02 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/288 , B32B27/302 , B32B27/308 , B32B27/34 , B32B27/36 , B32B27/365 , B32B27/38 , B32B2255/10 , B32B2255/20 , B32B2255/205 , B32B2307/412 , B32B2307/536 , B32B2307/546 , B32B2307/584 , B32B2307/7242 , B32B2307/732 , B32B2457/00 , B32B2457/10 , B32B2457/12 , B32B2457/202 , B32B2457/206 , B32B2457/208 , C08F30/02 , Y02E10/549 , Y10T428/2495 , Y10T428/24983 , Y10T428/31928
摘要： Disclosed is a gas barrier film comprising a substrate film, an organic layer and an inorganic layer provided directly on the surface of the organic layer, wherein the organic layer laid under the inorganic layer has a thickness of from 0.3 μm to 10 μm; the organic layer laid under the inorganic layer has a hardness, measured by the nanoindentation, of 0.03 to 0.5 GPa; and the organic layer laid under the inorganic layer, assumed to have a thickness “a”, and the inorganic layer on the organic layer, assumed to have a thickness “b”, satisfying a relation of a/b>10. The gas barrier film is excellent in the barrier performance, adhesiveness, bending resistance and scratch resistance.
摘要翻译：公开了一种气体阻隔膜，其包括直接设置在有机层的表面上的基材膜，有机层和无机层，其中在无机层下面形成的有机层的厚度为0.3μm〜10μm; 无机层下方的有机层的硬度，通过纳米压痕测定为0.03〜0.5GPa; 假定具有厚度“a”的无机层下面的有机层和有机层上的无机层，假定为厚度“b”，满足a / b> 10的关系。阻气膜的阻隔性，粘合性，耐弯曲性和耐刮擦性优异。

4. 发明授权

US08133577B2 Silicon-nitrogen compound film, and gas-barrier film and thin-film device using the silicon-nitrogen compound film 有权
标题翻译：硅氮复合膜，阻气膜和使用硅氮复合膜的薄膜器件
公开(公告)号：US08133577B2
公开(公告)日：2012-03-13
申请号：US12261727
申请日：2008-10-30
申请人： Teruhiko Kuramachi , Tomoo Murakami , Takeshi Senga , Jiro Tsukahara
发明人： Teruhiko Kuramachi , Tomoo Murakami , Takeshi Senga , Jiro Tsukahara
IPC分类号： B32B9/00
CPC分类号： C23C16/308 , C23C16/345 , H01L51/448 , H01L51/5256 , Y10T428/24388 , Y10T428/26
摘要： A silicon-nitrogen compound film according to the first aspect of the present invention is made of a material expressed by a compositional formula Si3NxOyHz, where 10≦(3x+2y)≦12, 3.4≦x≦4.0, 0≦y, 0≦z
摘要翻译：根据本发明第一方面的硅氮化合物膜由组成式Si 3 N x O y H z表示的材料制成，其中10＆lt; 1;（3x + 2y）＆nlE; 12,3.4＆nlE; x＆lt; e; 4.0,0＆ 0＆nlE; z <2.0，在材料的傅里叶变换红外吸收光谱中出现在2150cm -1附近的第一峰的第一区域的峰面积比，并且对应于Si-H伸缩振动，在傅里叶变换红外吸收光谱中出现在810cm -1附近的对应于Si-N伸缩振动的第二峰的第二区域小于0.2，硅 - 氮化合物膜的厚度t （纳米）和满足不等式的密度d（g / cm3），1.9＆nlE; d＆nlE; 2.5和-700d + 1930＆lt; 6t＆nlE; -700d + 2530。

5. 发明授权

US06449838B2 Method of mounting a semiconductor device to a substrate 失效
标题翻译：将半导体器件安装到衬底的方法
公开(公告)号：US06449838B2
公开(公告)日：2002-09-17
申请号：US09120204
申请日：1998-07-22
申请人： Tomoo Murakami
发明人： Tomoo Murakami
IPC分类号： H05K334
CPC分类号： H01L24/29 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05571 , H01L2224/05572 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81141 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2924/0002 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/18301 , H01L2924/3025 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49169 , Y10T29/53174 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
摘要： This invention mounts a semiconductor device having a plurality of electrodes to a substrate. A bump electrode having a pointed tail is formed on the electrode. The concave mounting pad is formed on the substrate. A sealing resin covers the substrate. And the tail of the bump electrode is buried into the sealing resin by putting the semiconductor device close to the substrate. Further, the semiconductor device is pressed to the substrate. And the sealing resin is hardened by heating.
摘要翻译：本发明将具有多个电极的半导体器件安装到基板上。在电极上形成具有尖头的突起电极。凹形安装垫形成在基板上。密封树脂覆盖基板。并且通过将半导体器件靠近基板将突起电极的尾部埋入密封树脂中。此外，半导体器件被压到衬底上。密封树脂通过加热硬化。

6. 发明授权

US5499447A Method for manufacturing a printed circuit board having electrodes on end surface of substrate 失效
标题翻译：制造在基板的端面上具有电极的印刷电路板的制造方法
公开(公告)号：US5499447A
公开(公告)日：1996-03-19
申请号：US358370
申请日：1994-12-19
申请人： Tomoo Murakami
发明人： Tomoo Murakami
IPC分类号： H05K1/09 , H05K3/00 , H05K3/40 , H05K3/46 , H01K3/10
CPC分类号： H05K3/403 , H05K3/002 , H05K1/095 , H05K2201/09563 , H05K2203/0554 , H05K3/4069 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： The method for manufacturing a printed circuit board having an electrode on an end surface of a substrate has the steps of forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated, filling in the hole with copper paste, forming a circuit pattern such that a copper foil portion remains only in one half of the hole, and etching an exposed region of the substrate. No mechanical process is used in the formation of the end face through-hole so that it is free from the development of burrs in or peeling off of a conductive layer.
摘要翻译：制造在基板的端面上具有电极的印刷电路板的方法具有以下步骤：在其两个表面镀铜的层叠板的预定位置处形成孔，并用铜浆填充孔，形成电路图形，使得铜箔部分仅保留在孔的一半中，并且蚀刻基板的暴露区域。在形成端面通孔时不使用机械工艺，使得其不会导致导电层的毛刺或剥离。

7. 发明授权

US5464662A Fabrication method of printed wiring board 失效
标题翻译：印刷电路板的制造方法
公开(公告)号：US5464662A
公开(公告)日：1995-11-07
申请号：US300131
申请日：1994-09-02
申请人： Tomoo Murakami , Takanori Tsunoda
发明人： Tomoo Murakami , Takanori Tsunoda
IPC分类号： H05K3/24 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/28 , H05K3/38 , B05D5/12
CPC分类号： H05K3/0094 , H05K1/111 , H05K3/28 , H05K2201/09745 , H05K2201/09881 , H05K2203/0353 , H05K2203/0369 , H05K2203/0508 , H05K2203/0574 , H05K2203/0759 , H05K2203/1394 , H05K3/0082 , H05K3/061 , H05K3/383 , Y02P70/611
摘要： A fabrication method of a printed wiring board in which the halation effect of light irradiated to a solder resist film is utilized in a process of selectively removing the solder resist film. After a conductive layer is patterned to a given circuit pattern including soldering pads, the solder resist film is formed on the base material to cover the patterned conductive layer. The solder resist film is selectively exposed to light utilizing reflection of the irradiated light from the insulating base material and developed so that the solder resist film is selectively left in areas adjacent to the respective soldering pads. Then, an etching resist film is formed to cover the patterned conductive layer except for the soldering pads, and surface areas of the respective soldering pads are selectively etched using the etching resist film as a mask to produce solder resist dams made of the solder resist film left on the base material. Solder films are formed on the respective soldering pads thus selectively etched. Electronic components can be soldered on the soldering pads with satisfactory reliability even if the soldering pads have narrow pitches such as 500 .mu.m or less.
摘要翻译：在选择性去除阻焊膜的工序中，利用照射到阻焊膜的光的晕影效果的印刷电路板的制造方法。在将导电层图案化为包括焊盘的给定电路图案之后，在基底材料上形成阻焊膜以覆盖图案化的导电层。利用来自绝缘基材的照射光的反射来选择性地将阻焊膜暴露于光，并显影，使得阻焊膜选择性地留在与各个焊盘相邻的区域中。然后，形成抗蚀剂膜以覆盖除了焊盘之外的图案化导电层，并且使用抗蚀剂膜作为掩模来选择性地蚀刻各个焊盘的表面积，以形成由阻焊膜制成的阻焊堤留在基材上。在相应的焊盘上形成焊接膜，从而选择性地蚀刻。即使焊盘具有500μm以下的窄间距，也可以将电子部件焊接在焊盘上，其可靠性良好。

8. 发明申请

US20130005085A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20130005085A1
公开(公告)日：2013-01-03
申请号：US13549001
申请日：2012-07-13
申请人： Akinobu SHIBUYA , Koichi Takemura , Akira Ouchi , Tomoo Murakami
发明人： Akinobu SHIBUYA , Koichi Takemura , Akira Ouchi , Tomoo Murakami
IPC分类号： H01L21/60 , H01L21/56
CPC分类号： H01L21/563 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/6835 , H01L23/295 , H01L23/3121 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/97 , H01L2221/68377 , H01L2224/05147 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05655 , H01L2224/16225 , H01L2224/16235 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83385 , H01L2224/97 , H01L2924/01004 , H01L2924/01006 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15788 , H01L2924/18165 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2224/81 , H01L2924/00 , H01L2924/01031 , H01L2924/3512 , H01L2924/00014
摘要： A substrate and a semiconductor chip are connected by means of flip-chip interconnection. Around connecting pads of the substrate and input/output terminals of the semiconductor chip, an underfill material is injected. The underfill material is a composite material of filler and resin. Also, a first main surface of the substrate, which is not covered with the underfill material, and the side surfaces of the semiconductor chip are encapsulated with a molding material. The molding material is a composite material of filler and resin. An integrated body of the substrate and the semiconductor chip, which are covered with the molding material, is thinned from above and below.
摘要翻译：衬底和半导体芯片通过倒装芯片互连连接。在衬底的连接焊盘和半导体芯片的输入/输出端子之间，注入底部填充材料。底部填充材料是填料和树脂的复合材料。此外，未被底部填充材料覆盖的基板的第一主表面和半导体芯片的侧表面被模制材料封装。成型材料是填料和树脂的复合材料。由模制材料覆盖的衬底和半导体芯片的集成体从上方和下方变薄。

9. 发明授权

US08237292B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08237292B2
公开(公告)日：2012-08-07
申请号：US12526236
申请日：2008-02-29
申请人： Akinobu Shibuya , Koichi Takemura , Akira Ouchi , Tomoo Murakami
发明人： Akinobu Shibuya , Koichi Takemura , Akira Ouchi , Tomoo Murakami
IPC分类号： H01L23/488
CPC分类号： H01L21/563 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/6835 , H01L23/295 , H01L23/3121 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/97 , H01L2221/68377 , H01L2224/05147 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05655 , H01L2224/16225 , H01L2224/16235 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83385 , H01L2224/97 , H01L2924/01004 , H01L2924/01006 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15788 , H01L2924/18165 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2224/81 , H01L2924/00 , H01L2924/01031 , H01L2924/3512 , H01L2924/00014
摘要： A substrate (1) and a semiconductor chip (5) are connected by means of flip-chip interconnection. Around connecting pads (3) of the substrate (1) and input/output terminals (10) of the semiconductor chip (5), an underfill material (7) is injected. The underfill material (7) is a composite material of filler and resin in which the maximum particle diameter of the filler is 5 μm or below and whose filler content is 40 to 60 wt %. Also, a first main surface of the substrate (1), which is not covered with the underfill material (7), and the side surfaces of the semiconductor chip (5) are encapsulated with a molding material (8). The molding material (8) is a composite material of filler and resin whose filler content is over 75 wt % and in which the glass transition temperature of the resin is over 180° C. An integrated body of the substrate (1) and the semiconductor chip (5), which are covered with the molding material (8), is thinned from above and below.
摘要翻译：基板（1）和半导体芯片（5）通过倒装芯片互连连接。在衬底（1）的连接焊盘（3）和半导体芯片（5）的输入/输出端子（10）之间，注入底部填充材料（7）。底部填充材料（7）是填料和树脂的复合材料，其中填料的最大粒径为5μm以下，填料含量为40〜60重量％。此外，未被底部填充材料（7）覆盖的基板（1）的第一主表面和半导体芯片（5）的侧表面被模制材料（8）封装。成型材料（8）是填料和树脂的复合材料，其填料含量超过75重量％，树脂的玻璃化转变温度超过180℃。基板（1）和半导体由模制材料（8）覆盖的芯片（5）从上方和下方变薄。

10. 发明申请

US20090095345A1 GAS-BARRIER FILM AND ENVIRONMENT-SENSITIVE DEVICE 有权
标题翻译：气体阻隔膜和环境敏感装置
公开(公告)号：US20090095345A1
公开(公告)日：2009-04-16
申请号：US12251248
申请日：2008-10-14
申请人： Tomoo Murakami , Yuya Agata
发明人： Tomoo Murakami , Yuya Agata
IPC分类号： B32B27/08 , B32B27/00 , H01L31/042
CPC分类号： H01L31/0481 , H01L51/0097 , H01L51/5253 , Y02E10/50 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/31786
摘要： Provided is a gas-barrier film having a high barrier property when it is folded. The gas barrier film is characterized in that an organic layer comprises a resin obtained by curing a monomer as a polymerizing ingredient and the monomer has a structure of pentahydric alcohol or more polyhydric alcohol having a molecular weight of from 200 to 800 in which at least 5 hydroxyl groups are substituted with an aliphatic carbonyloxy group of the following general formula (1): wherein R represents a hydrogen atom or a methyl group; L represents a linking group having a chain length of at least 4 atoms; n indicates 0 or 1; provided that at least 3 hydroxyl groups of the polyhydric alcohol are substituted with the aliphatic carbonyloxy group of formula (1), where n=1.
摘要翻译：提供折叠时具有高阻隔性的阻气膜。阻气膜的特征在于，有机层包含通过固化作为聚合成分的单体获得的树脂，并且单体具有分子量为200至800的五元醇或更多元醇的结构，其中至少5 羟基被以下通式（1）的脂族羰氧基取代：其中R表示氢原子或甲基; L表示链长为至少4个原子的连接基团; n表示0或1; 条件是多元醇的至少3个羟基被式（1）的脂族羰氧基取代，其中n = 1。

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