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    • 4. 发明授权
    • Vacuum processing apparatus
    • 真空加工设备
    • US07780790B2
    • 2010-08-24
    • US12566205
    • 2009-09-24
    • Hiroshi Nogami
    • Hiroshi Nogami
    • C23C16/00C23C16/455C23C16/50C23C16/505H01L21/3065
    • H01J37/32422C23C16/45565C23C16/509H01J37/32091H01J37/32587
    • Disclosed is a vacuum processing apparatus in which a conducive partition having a plurality of through holes is formed inside a vacuum processing vessel, and an internal space of the vacuum processing vessel is partitioned into a plasma generating space in which a high-frequency electrode is installed to function as a counter electrode with respect to the partition, and a substrate processing space in which a substrate is set. This vacuum processing apparatus includes a gas reservoir formed on a sidewall of the vacuum processing vessel and communicating with the plasma generating space, and a gas supply system connected to the gas reservoir to supply a gas to the gas reservoir.
    • 公开了一种真空处理装置,其中在真空处理容器内部形成具有多个通孔的导通隔板,并且将真空处理容器的内部空间分隔成其中安装有高频电极的等离子体产生空间 作为相对于隔板的对电极,以及设置有基板的基板处理空间。 该真空处理装置包括形成在真空处理容器的侧壁上并与等离子体产生空间连通的气体储存器,以及连接到气体储存器以向气体储存器供应气体的气体供应系统。
    • 5. 发明授权
    • Remote plasma apparatus for processing substrate with two types of gases
    • 用于处理具有两种类型气体的基板的远程等离子体装置
    • US07709063B2
    • 2010-05-04
    • US11620518
    • 2007-01-05
    • Katsuhisa YudaHiroshi Nogami
    • Katsuhisa YudaHiroshi Nogami
    • H05H1/24C23C16/00
    • C23C16/45565C23C16/402C23C16/452C23C16/45574H01J37/32357H01J37/32422
    • In a plasma CVD apparatus, a plate formed with a plurality of perforated holes is arranged to separate a plasma generation region and a processing region. The aperture ratio of the perforated holes to the plate is not greater than five percent. Plasma including radicals and excited species is generated from an oxygen (O2) gas in the plasma generation region, then the radicals and excited species flow into the processing region through the perforated holes. A monosilane (SiH4) gas is also supplied into the processing region, but the backward flow of the monosilane gas into the plasma generation region is suppressed by the plate. In the processing region, the radicals and the excited species and the monosilane gas result in a gas phase reaction that yields the silicon dioxide film formed on the substrate or the wafer with high quality.
    • 在等离子体CVD装置中,形成有多个穿孔的板被布置成分离等离子体产生区域和处理区域。 穿孔孔与孔板的孔径比不大于百分之五。 从等离子体产生区域中的氧(O 2)气体产生包括自由基和激发物质的等离子体,然后自由基和激发物质通过穿孔穿过处理区域。 也可以在处理区域内供给单硅烷(SiH 4)气体,但通过该板抑制了甲硅烷气体向等离子体产生区域的逆流。 在处理区域中,自由基和被激发的物质和单硅烷气体导致气相反应,其产生在基板或晶片上形成的高质量的二氧化硅膜。
    • 6. 发明申请
    • Method for Thin Film Formation
    • 薄膜形成方法
    • US20090202721A1
    • 2009-08-13
    • US11886317
    • 2006-03-14
    • Hiroshi NogamiKatsuhisa YudaHiroshi Tanabe
    • Hiroshi NogamiKatsuhisa YudaHiroshi Tanabe
    • C23C16/00C23C16/54
    • C23C16/401C23C16/402C23C16/452H01L21/02164H01L21/02211H01L21/02274H01L21/31612
    • A method for thin film formation that can form, at a low temperature, a good thin film having a good interfacial property between a silicon substrate and a silicon oxide film and having a low interfacial trap density is provided.The method for thin film formation comprises generating plasma within a vacuum vessel to generate an active species (radical) and forming a silicon oxide film on a silicon substrate using this active species and a material gas, wherein, in addition to the material gas, a nitrogen atom-containing gas is introduced into the vacuum vessel in its film forming space where the active species (radical) and the material gas come into contact with each other for the first time and are reacted with each other to form a silicon film on the silicon substrate, and wherein the flow rate of the nitrogen atom-containing gas during the formation of the silicon oxide film on the silicon substrate is regulated so as to be the maximum value at least at the time of the start of formation of the silicon film on the silicon substrate.
    • 提供了一种薄膜形成方法,其可以在低温下形成在硅衬底和氧化硅膜之间具有良好界面性能并具有低界面陷阱密度的良好薄膜。 用于薄膜形成的方法包括在真空容器内产生等离子体以产生活性物质(自由基),并使用该活性物质和材料气体在硅衬底上形成氧化硅膜,其中,除了材料气体之外, 含氮原子气体在其成膜空间中被引入真空容器中,其中活性物质(自由基)和原料气体首次相互接触并且彼此反应以形成硅膜 硅衬底,并且其中在硅衬底上形成氧化硅膜期间含氮原子气体的流速被调节为至少在开始形成硅膜时为最大值 在硅衬底上。
    • 8. 发明申请
    • REMOTE PLASMA APPARATUS FOR PROCESSING SUBSTRATE WITH TWO TYPES OF GASES
    • 用于加工具有两种类型气体的基板的远程等离子体设备
    • US20070110918A1
    • 2007-05-17
    • US11620518
    • 2007-01-05
    • Katsuhisa YudaHiroshi Nogami
    • Katsuhisa YudaHiroshi Nogami
    • B05D3/00H05H1/24C23C16/00
    • C23C16/45565C23C16/402C23C16/452C23C16/45574H01J37/32357H01J37/32422
    • In a plasma CVD apparatus, a plate formed with a plurality of perforated holes is arranged to separate a plasma generation region and a processing region. The aperture ratio of the perforated holes to the plate is not greater than five percent. Plasma including radicals and excited species is generated from an oxygen (O2) gas in the plasma generation region, then the radicals and excited species flow into the processing region through the perforated holes. A monosilane (SiH4) gas is also supplied into the processing region, but the backward flow of the monosilane gas into the plasma generation region is suppressed by the plate. In the processing region, the radicals and the excited species and the monosilane gas result in a gas phase reaction that yields the silicon dioxide film formed on the substrate or the wafer with high quality.
    • 在等离子体CVD装置中,形成有多个穿孔的板被布置成分离等离子体产生区域和处理区域。 穿孔孔与孔板的孔径比不大于百分之五。 等离子体产生区域中的氧(O 2 O 2)气体产生包括自由基和激发物质的等离子体,然后自由基和激发物质通过穿孔穿过处理区域。 也可以在处理区域中供给单硅烷(SiH 4 S)气体,但通过该板抑制甲硅烷气体向等离子体产生区域的逆流。 在处理区域中,自由基和被激发的物质和单硅烷气体导致气相反应,其产生在基板或晶片上形成的高质量的二氧化硅膜。
    • 10. 发明授权
    • Remote plasma apparatus for processing substrate with two types of gases
    • 用于处理具有两种类型气体的基板的远程等离子体装置
    • US06851384B2
    • 2005-02-08
    • US09820149
    • 2001-03-28
    • Katsuhisa YudaHiroshi Nogami
    • Katsuhisa YudaHiroshi Nogami
    • H01L21/31C23C16/44C23C16/452C23C16/455H01L21/205H01L21/00
    • C23C16/45565C23C16/402C23C16/452C23C16/45574H01J37/32357H01J37/32422
    • In a plasma CVD apparatus, a plate formed with a plurality of perforated holes is arranged to separate a plasma generation region and a processing region. The aperture ratio of the perforated holes to the plate is not greater than five percent. Plasma including radicals and excited species is generated from an oxygen (O2) gas in the plasma generation region, then the radicals and excited species flow into the processing region through the perforated holes. A monosilane (SiH4) gas is also supplied into the processing region, but the backward flow of the monosilane gas into the plasma generation region is suppressed by the plate. In the processing region, the radicals and the excited species and the monosilane gas result in a gas phase reaction that yields the silicon dioxide film formed on the substrate or the wafer with high quality.
    • 在等离子体CVD装置中,形成有多个穿孔的板被布置成分离等离子体产生区域和处理区域。 穿孔孔与孔板的孔径比不大于百分之五。 从等离子体产生区域中的氧(O 2)气体产生包括自由基和激发物质的等离子体,然后自由基和激发物质通过穿孔穿过处理区域。 也可以在处理区域内供给单硅烷(SiH 4)气体,但通过该板抑制了甲硅烷气体向等离子体产生区域的逆流。 在处理区域中,自由基和被激发的物质和单硅烷气体导致气相反应,其产生在基板或晶片上形成的高质量的二氧化硅膜。