专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4559216A Method for purification of sulfuric acid solution 失效
标题翻译：硫酸溶液的纯化方法
公开(公告)号：US4559216A
公开(公告)日：1985-12-17
申请号：US586488
申请日：1984-03-05
申请人： Tadao Nagai , Yoshiaki Echigo
发明人： Tadao Nagai , Yoshiaki Echigo
IPC分类号： B01D15/00 , B01J45/00 , C01B17/90 , C02F1/28 , G05D3/12
CPC分类号： B01D15/00 , B01J45/00 , C01B17/901 , C01B17/904 , C01B17/908 , C02F1/285 , G05D3/12 , Y10S204/13
摘要： A method for purification of a sulfuric acid solution such as, for example, a copper electrolyte which entrains at least one metal ion species selected from the group consisting of antimony ions, bismuth ions, and iron ions and having a sulfuric acid concentration of at least 50 g/liter is disclosed. The method comprises exposing the sulfuric acid solution to a chelating resin possessing aminomethylenephosphonic acid group as a chelate forming group thereby effecting adsorptive separation of the aforementioned at least one metal ion species from the solution. By the method described above, the antimony ions, bismuth ions, and/or iron ions contained as impurities in the copper electrolyte can be easily and efficiently separated out of the system without entailing any ecological problem.
摘要翻译：一种硫酸溶液的纯化方法，例如铜电解质，其夹带至少一种选自锑离子，铋离子和铁离子的金属离子种类，其硫酸浓度至少为公开了50克/升。该方法包括将硫酸溶液暴露于具有氨基亚甲基膦酸基团的螯合树脂作为螯合形成基团，从而进行上述至少一种金属离子物质与溶液的吸附分离。通过上述方法，铜电解液中作为杂质含有的锑离子，铋离子和/或铁离子可以容易且有效地从体系中分离出来，而不会引起生态问题。

2. 发明授权

US08492506B2 Polyimide resin composition, polyimide precursor resin composition for the same, production method thereof, and polyimide film and production method thereof 有权
标题翻译：聚酰亚胺树脂组合物，聚酰亚胺前体树脂组合物及其制备方法及其制备方法
公开(公告)号：US08492506B2
公开(公告)日：2013-07-23
申请号：US12310288
申请日：2008-08-07
申请人： Takeshi Yoshida , Akira Shigeta , Yoshiaki Echigo
发明人： Takeshi Yoshida , Akira Shigeta , Yoshiaki Echigo
IPC分类号： C08G73/10 , C08G73/00 , C08G6/00 , B29D7/00
CPC分类号： C08G73/10 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/14 , C08J5/18 , C08J2379/08 , C08L79/08 , H05K1/0346
摘要： An object of the present invention, which was made to solve the problems above, is to provide a polyimide precursor resin composition superior in transparency allowing reduction of the residual volatile material rate during molding and giving a polyimide resin composition (e.g., polyimide film) superior in mechanical properties and transparency even when a cheaper polyamide-imide is used. The present invention relates to a polyimide precursor resin composition, comprising a polyamide-imide (A) containing a diamine monomer unit represented by the following formula (1) and a polyamic acid (B) containing at least one kind of monomer unit selected tetracarboxylic acid monomer units represented by the following formulae (2p) to (2r), wherein the haze of the film having a thickness of 40 μm obtained by imidation of the polyimide precursor resin composition is 4% or less: (wherein, R represents an alkylene group having 1 to 5 carbon atoms);
摘要翻译：为了解决上述问题而提出的本发明的目的在于提供一种透明性优异的聚酰亚胺前体树脂组合物，其能够降低成型时的残留挥发物的比率，并提供聚酰亚胺树脂组合物（例如聚酰亚胺膜）优异即使使用较便宜的聚酰胺 - 酰亚胺也具有机械性能和透明度。本发明涉及一种聚酰亚胺前体树脂组合物，其包含含有由下式（1）表示的二胺单体单元的聚酰胺 - 酰亚胺（A）和含有至少一种单体单元选择的四羧酸的聚酰胺酸（B）由下式（2p）至（2r）表示的单体单元，其中通过酰亚胺化聚酰亚胺前体树脂组合物获得的厚度为40μm的膜的雾度为4％以下：（其中，R表示亚烷基具有1至5个碳原子）;

3. 发明授权

US07384683B2 Substrate for flexible printed wiring board and method for manufacturing the same 失效
标题翻译：柔性印刷电路板用基板及其制造方法
公开(公告)号：US07384683B2
公开(公告)日：2008-06-10
申请号：US10571084
申请日：2004-09-10
申请人： Yoshiaki Echigo , Jusirou Eguchi , Akira Shigeta , Makoto Uchida , Shigeru Moteki
发明人： Yoshiaki Echigo , Jusirou Eguchi , Akira Shigeta , Makoto Uchida , Shigeru Moteki
IPC分类号： B32B3/00 , H05K1/00 , C09J5/10
CPC分类号： H05K1/036 , H05K1/0346 , H05K1/0393 , H05K2201/0195 , H05K2201/043 , Y10T428/24917 , Y10T428/31511 , Y10T428/31515 , Y10T428/31681 , Y10T428/31721
摘要： The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 μm and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.
摘要翻译：本发明提供一种柔性印刷电路板用基板，其具有包含环氧树脂组合物的粘合剂层，分别层叠在粘合剂层的两面上的绝缘层，分别形成有一对含有非热塑性聚酰亚胺树脂的膜和导体层设置在膜的外表面上。分别层叠在粘合剂层的两面上的绝缘层的总厚度为10〜100μm，粘合剂层的厚度的2〜10倍。通过粘合剂层中间的绝缘层之间的相互粘附强度为7.0N / cm以上。

4. 发明授权

US5994418A Hollow polyimide microspheres 有权
标题翻译：中空聚酰亚胺微球
公开(公告)号：US5994418A
公开(公告)日：1999-11-30
申请号：US316865
申请日：1999-05-21
申请人： Erik S. Weiser , Terry L. St. Clair , Yoshiaki Echigo , Hisayasu Kaneshiro
发明人： Erik S. Weiser , Terry L. St. Clair , Yoshiaki Echigo , Hisayasu Kaneshiro
IPC分类号： B01J13/04 , C08J9/02 , C08J9/32 , B01J13/02
CPC分类号： C08J9/32 , B01J13/04 , C08J2379/08 , Y10S264/06
摘要： A shaped article composed of an aromatic polyimide has a hollow, essentially spherical structure and a particle size of about 100 to about 1500 .mu.m, a density of about 1 to about 6 pounds/ft.sup.3 and a volume change of 1 to about 20% by a pressure treatment of 30 psi for 10 minutes at room temperature. A syntactic foam, made of a multiplicity of the shaped articles which are bounded together by a matrix resin to form an integral composite structure, has a density of about 3 to about 30 pounds/ft.sup.3 and a compression strength of about 100 to about 1400 pounds/in.sup.2.
摘要翻译：由芳族聚酰亚胺组成的成形制品具有中空的，基本上为球形的结构，并且具有约100至约1500μm的粒度，约1至约6磅/ ft 3的密度和1至约20％的体积变化，由在室温下压力处理30psi 10分钟。由多个成形制品制成的复合泡沫体，其通过基质树脂结合以形成整体复合结构，其密度为约3至约30磅/英3 3，压缩强度为约100至约1400磅 / in2。

5. 发明授权

US5463016A Granular material of polyimide precursor, mixture comprising the material and process for producing the material 失效
标题翻译：聚酰亚胺前体的颗粒材料，包含该材料的混合物和用于生产该材料的方法
公开(公告)号：US5463016A
公开(公告)日：1995-10-31
申请号：US193887
申请日：1994-02-09
申请人： Isao Tomioka , Takeshi Nakano , Mikio Furukawa , Yoshiaki Echigo
发明人： Isao Tomioka , Takeshi Nakano , Mikio Furukawa , Yoshiaki Echigo
IPC分类号： B29C55/02 , B29K79/00 , C08G73/10 , C08J3/12 , C08J3/14 , C08L79/08 , C09D179/08 , H01B3/30 , C08G77/10 , C08G69/26
CPC分类号： C08G73/1032 , C08J3/12 , C08J3/14 , C08J2379/08
摘要： This invention provides (1) a granular material of a polyimide precursor, which has excellent solubility in solvents and excellent moldability and from which a polyimide molding having excellent mechanical properties can be produced, (2) a mixture of a granular material of a polyimide precursor with a solvent, in which the polyimide precursor shows excellent storage stability and (3) a process for the production of a granular material of a polyimide precursor, in which a solvent can be easily removed. Particularly provided are a polyimide precursor granular material having an intrinsic viscosity of 0.7 or higher and a polyimide precursor mixture which consists of a polyimide precursor granular polyimide having an intrinsic viscosity of 0.7 or higher and a solvent that does not exhibit a strong-mutual interaction with the polyimide precursor, as well as a process for the production of the polyimide precursor granular material. The granular material of a polyimide precursor can be obtained by allowing a tetracarboxylic dianhydride to undergo polymerization reaction with a diamine in a solvent that does not exhibit a strong mutual interaction with the polyimide precursor.
摘要翻译：本发明提供（1）聚酰亚胺前体的粒状材料，其在溶剂中的溶解性优异，成型性优异，可以制造出具有优异的机械性能的聚酰亚胺成型体，（2）聚酰亚胺前体的粒状材料与聚酰亚胺前体显示优异的储存稳定性的溶剂和（3）可以容易地除去溶剂的聚酰亚胺前体的粒状材料的制造方法。特别提供特性粘度为0.7以上的聚酰亚胺前体粒状材料和由特性粘度为0.7以上的聚酰亚胺前体粒状聚酰亚胺构成的聚酰亚胺前体混合物和不显示与聚酰亚胺前体，以及聚酰亚胺前体粒状材料的制造方法。聚酰亚胺前体的粒状材料可以通过使四羧酸二酐与不与聚酰亚胺前体表现出强相互作用的溶剂中的二胺进行聚合反应来获得。

6. 发明授权

US5348818A Carbonaceous material and a cell using the same 失效
标题翻译：碳质材料和使用其的电池
公开(公告)号：US5348818A
公开(公告)日：1994-09-20
申请号：US006498
申请日：1993-01-21
申请人： Keiichi Asami , Hideki Takahashi , Katsuo Inoue , Yoshiaki Echigo , Toshiyuki Ohsawa , Toshiyuki Kabata
发明人： Keiichi Asami , Hideki Takahashi , Katsuo Inoue , Yoshiaki Echigo , Toshiyuki Ohsawa , Toshiyuki Kabata
IPC分类号： D01F9/28 , H01M4/02 , H01M4/137 , H01M4/58 , H01M4/587 , H01M4/60 , H01M4/62 , H01M10/0525 , H01M10/0562 , H01M10/36 , C01B31/02
CPC分类号： H01M4/587 , D01F9/28 , H01M10/0525 , H01M4/02 , H01M4/60 , H01M4/624 , H01M10/0562 , H01M4/137 , H01M4/625
摘要： The present invention provides a carbonaceous material suitable for an electrode of a secondary cell. The carbonaceous material has a specific surface area by BET method of at least 10 m.sup.2 /g and a nitrogen/carbon atom weight ratio of 0.15 to 0.01, and is obtained by heat-treating a polyimide polymer having repeating units represented by: ##STR1## wherein R represents a 4 valent aromatic residue having at least one aromatic ring, of which each 2 valences are bonded with an adjacent carbon atom in the aromatic ring, R' represents a divalent aromatic residue having 1 to 4 aromatic rings and n is an integer of at least 2. The present invention also provides a secondary cell using the above mentioned carbonaceous material as electrode.
摘要翻译：本发明提供适用于二次电池电极的碳质材料。碳质材料的比表面积通过BET法为至少10m 2 / g，氮/碳原子重量比为0.15〜0.01，通过热处理具有以下的重复单元的聚酰亚胺聚合物得到：＆lt; IMAGE＆gt; （1）其中R表示具有至少一个芳环的4价芳族残基，其中每个2价与芳环中的相邻碳原子键合，R'表示具有1至4个芳环的二价芳族残基和n 是至少为2的整数。本发明还提供了使用上述碳质材料作为电极的二次电池。

7. 发明授权

US5225296A Electrode and method of producing the same 失效
标题翻译：电极及其制造方法
公开(公告)号：US5225296A
公开(公告)日：1993-07-06
申请号：US616564
申请日：1990-11-21
申请人： Toshiyuki Ohsawa , Toshiyuki Kabata , Yoshiaki Echigo , Tutomu Sakaida , Keiichi Asami
发明人： Toshiyuki Ohsawa , Toshiyuki Kabata , Yoshiaki Echigo , Tutomu Sakaida , Keiichi Asami
IPC分类号： C25B11/03 , C25B11/12 , D01F11/16 , H01M4/133 , H01M4/1393 , H01M4/66 , H01M4/96 , H01M10/05
CPC分类号： H01M4/137 , C25B11/035 , C25B11/12 , D01F11/16 , H01M4/663 , H01M4/96
摘要： An electrode comprises a porous carbon sheet comprising (a) carbon fibers and (b) a carbon matrix which comprises carbon particles and is integrally combined with the carbon fibers, having continuous through-holes. This electrode can be used as a cathode or anode for a battery. This type of electrode is prepared by depositing a phenolic resin on a phenolic resin sheet comprising phenolic resin fibers, and carbonizing the phenolic resin and the phenolic resin sheet in an oxygen-free atmosphere at temperatures in the range of 500.degree. C. to 3000.degree. C.
摘要翻译：电极包括多孔碳片，其包含（a）碳纤维和（b）包含碳颗粒并与碳纤维整体结合的具有连续通孔的碳基体。该电极可用作电池的阴极或阳极。这种类型的电极通过将酚醛树脂沉积在包含酚醛树脂纤维的酚醛树脂片上并在酚醛树脂和酚醛树脂片中在500℃至3000℃的温度范围内的无氧气氛中进行碳化来制备。 C。

8. 发明授权

US4576969A Spherical ion exchange resin having matrix-bound metal hydroxide, method for producing the same and method for adsorption treatment using the same 失效
标题翻译：具有基质结合金属氢氧化物的球形离子交换树脂，其制造方法以及使用其的吸附处理方法
公开(公告)号：US4576969A
公开(公告)日：1986-03-18
申请号：US541646
申请日：1983-10-13
申请人： Yoshiaki Echigo , Yoshiyuki Suematsu , Tadashi Ishikura
发明人： Yoshiaki Echigo , Yoshiyuki Suematsu , Tadashi Ishikura
IPC分类号： C08L61/00 , B01J39/08 , B01J39/16 , B01J39/18 , B01J41/08 , B01J41/12 , B01J43/00 , B01J45/00 , B01J47/00 , C02F1/28 , C02F1/42 , C08G8/00 , C08L61/04 , C08F8/10
CPC分类号： C02F1/288 , B01J39/165 , B01J39/185 , B01J41/12 , B01J47/007 , C02F1/42 , C02F2101/103
摘要： A spherical ion exchange resin composed of a phenolic resin and a metal hydroxide is disclosed. The metal hydroxide is enclosed and bound with the phenolic resin. A method for producing such an ion exchange resin and a method for selectively adsorbing ions using the same is also disclosed. The ion exchange resin is capable of efficiently recovering ions contained or dissolved in water in trace amounts and, hence, can be applied to any aqueous solution containing ions. For example, it can be used to recover useful substances from sea water and to purify waste waters from nonferrous refineries and nuclear power plants.
摘要翻译：公开了一种由酚醛树脂和金属氢氧化物组成的球形离子交换树脂。金属氢氧化物被封闭并与酚醛树脂结合。还公开了这种离子交换树脂的制造方法和使用该离子交换树脂选择性吸附离子的方法。离子交换树脂能够有效地回收微量含有或溶解在水中的离子，因此可以应用于任何含有离子的水溶液。例如，它可用于从海水中回收有用物质，并从有色炼油厂和核电厂净化废水。

9. 发明申请

US20150147584A1 FIBROUS COPPER MICROPARTICLES AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：纤维铜微生物及其制造方法
公开(公告)号：US20150147584A1
公开(公告)日：2015-05-28
申请号：US14405166
申请日：2013-06-11
申请人： Munenori Yamada , Kou Takeuchi , Mutsumi Matsushita , Akira Shigeta , Masahiro Hosoda , Yoshiaki Echigo
发明人： Munenori Yamada , Kou Takeuchi , Mutsumi Matsushita , Akira Shigeta , Masahiro Hosoda , Yoshiaki Echigo
IPC分类号： B22F1/00 , B22F9/24 , C22C9/00 , H01B1/02
CPC分类号： B22F1/004 , B22F9/24 , C22C9/00 , H01B1/026 , H01B1/16 , Y10T428/12 , Y10T428/256
摘要： Fibrous copper microparticles having a minor axis of 1 μm or less and an aspect ratio of 10 or more, wherein the content of the copper particles having a minor axis of 0.3 μm or more and an aspect ratio of 1.5 or less is 0.1 or less copper particle per one fibrous copper microparticle.
摘要翻译：短轴为1μm以下，纵横比为10以上的纤维铜微粒，其中短轴为0.3μm以上，长宽比为1.5以下的铜颗粒的含量为0.1以下，铜每个纤维铜微粒的颗粒。

10. 发明授权

US06962726B2 Method for preparing substrate for flexible print wiring board, and substrate for flexible print wiring board 失效
标题翻译：柔性印刷线路板用基板的制造方法以及柔性印刷电路板用基板
公开(公告)号：US06962726B2
公开(公告)日：2005-11-08
申请号：US10258057
申请日：2001-06-11
申请人： Akira Shigeta , Takeshi Yoshida , Jun-ichi Mori , Yoshiaki Echigo , Ryoichi Hasegawa , Minoru Noji , Seiichi Hayashi , Makoto Uchida
发明人： Akira Shigeta , Takeshi Yoshida , Jun-ichi Mori , Yoshiaki Echigo , Ryoichi Hasegawa , Minoru Noji , Seiichi Hayashi , Makoto Uchida
IPC分类号： C08J5/24 , H05K1/03 , B05D5/12
CPC分类号： H05K1/0346 , C08G73/1007 , C08L79/08 , H05K1/036 , Y10T428/31551 , Y10T428/31605
摘要： A method for preparing a substrate for a flexible print wiring board having a polyimide based resin layer wherein a solution of a polyimide based resin precursor is directly applied on an electrically conducting material to form a polyimide based resin precursor layer and then the precursor layer is cured by heating to prepare a polyimide based resin layer, characterized in that a solution of a polyimide based resin precursor B, which is one of solutions of two types of polyimide based resin precursors, is directly applied on an electrically conducting material and then, on the resultant layer is applied a solution of a polyimide based resin precursor A which allows resolving the residual strain generated in the polyimide based resin formed by the curing of the above polyimide based resin precursor B.
摘要翻译：一种用于制备具有聚酰亚胺基树脂层的柔性印刷布线板的基板的方法，其中将聚酰亚胺基树脂前体的溶液直接涂覆在导电材料上以形成聚酰亚胺基树脂前体层，然后将前体层固化通过加热制备聚酰亚胺基树脂层，其特征在于将作为两种类型的聚酰亚胺基树脂前体的溶液之一的聚酰亚胺树脂前体B的溶液直接施加到导电材料上，然后在施加聚酰亚胺基树脂前体A的溶液，其可以分解通过上述聚酰亚胺基树脂前体B的固化形成的聚酰亚胺基树脂中产生的残余应变。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式