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1. 发明授权

US5206679A Method of and apparatus for cutting sheet-material 失效
标题翻译：切片材料的方法和设备
公开(公告)号：US5206679A
公开(公告)日：1993-04-27
申请号：US747485
申请日：1991-08-19
申请人： Syuji Tahara , Hiroyuki Satou , Norio Ookawa
发明人： Syuji Tahara , Hiroyuki Satou , Norio Ookawa
IPC分类号： B26D1/08 , B26D5/16
CPC分类号： B26D5/16 , B26D1/085 , Y10T83/217 , Y10T83/4534 , Y10T83/4564 , Y10T83/8843
摘要： A method of cutting a fed sheet-material into a cut segment and a remaining portion by engaging a movable cutting edge with a fixed cutting edge is disclosed, wherein the remaining portion after being cut off is fed in a spacing with a predetermined amount of insertion between the fixed and movable cutting edges. The top of remaining portion can therefore be prevented from being curled down forward in the moving direction of the movable and fixed cutting edges. An apparatus for cutting a fed sheet-material into a cut segment and a remaining portion by engaging a movable cutting edge with a fixed cutting edge is also disclosed, wherein a plate member incorporated therein hinders the movement of the top of remaining portion after being cut off together with the movable cutting edge. Hence, the top of remaining portion can be prevented from being turned up by the movable cutting edge.
摘要翻译：公开了一种通过将可移动切割刃与固定切割刃接合而将送入的片状材料切割成切割部分和剩余部分的方法，其中在切断之后的剩余部分以预定量的插入物间隔进给在固定切削刃和可动切削刃之间。因此，可以防止剩余部分的顶部在可移动和固定的切割边缘的移动方向上向前卷曲。还公开了一种通过将可移动切割刃与固定切割刃接合而将送入的片状材料切割成切割段和剩余部分的装置，其中并入的板构件在切割后阻碍剩余部分的顶部的移动与可动切割边缘一起关闭。因此，可以防止剩余部分的顶部被可动切割刃向上翻转。

2. 发明授权

US5121663A Method of and apparatus for cutting sheet-material 失效
标题翻译：切片材料的方法和设备
公开(公告)号：US5121663A
公开(公告)日：1992-06-16
申请号：US595640
申请日：1990-10-01
申请人： Syuji Tahara , Hiroyuki Satou , Norio Ookawa
发明人： Syuji Tahara , Hiroyuki Satou , Norio Ookawa
IPC分类号： B26D1/08 , B26D5/16
CPC分类号： B26D1/085 , B26D5/16 , Y10T83/0538 , Y10T83/217 , Y10T83/4443 , Y10T83/4534 , Y10T83/4564
摘要： A method of cutting a fed sheet-material into a cut segment and a remaining portion by engaging a movable cutting edge with a fixed cutting edge is disclosed, wherein the remaining portion after being cut off is fed in a spacing with a predetermined amount of insertion between the fixed and movable cutting edges. The top of remaining portion can therefore be prevented from being curled down forward in the moving direction of the movable and fixed cutting edges. An apparatus for cutting a fed sheet-material into a cut segment and a remaining portion by engaging a movable cutting edge with a fixed cutting edge is also disclosed, wherein a plate member incorporated therein hinders the movement of the top of remaining portion after being cut off together with the movable cutting edge. Hence, the top of remaining portion can be prevented from being turned up by the movable cutting edge.
摘要翻译：公开了一种通过将可移动切割刃与固定切割刃接合而将送入的片状材料切割成切割部分和剩余部分的方法，其中在切断之后的剩余部分以预定量的插入物间隔进给在固定切削刃和可动切削刃之间。因此，可以防止剩余部分的顶部在可移动和固定的切割边缘的移动方向上向前卷曲。还公开了一种用于通过将可动切割刃与固定的切割刃接合而将送入的片状材料切割成切割段和剩余部分的装置，其中并入的板构件在切割后阻碍了剩余部分的顶部的移动与可动切割边缘一起关闭。因此，可以防止剩余部分的顶部被可动切割刃向上翻转。

3. 发明申请

US20100084172A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME 有权
标题翻译：光敏树脂组合物，干膜和使用其的加工产品
公开(公告)号：US20100084172A1
公开(公告)日：2010-04-08
申请号：US12596952
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： H05K1/00 , C08F2/46
CPC分类号： C08F283/04 , C08F283/00 , G03F7/027 , G03F7/037 , H05K3/287 , Y10T428/24917
摘要： Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].
摘要翻译：公开了一种感光性树脂组合物，其不含有对环境施加负担高的任何卤化物或任何锑化合物，其在固化后具有良好的阻燃性，并且特别符合最近的严格要求抗弯性和绝缘可靠性。具体公开了一种光敏树脂组合物，其包含：（A）由通式（1）表示的（甲基）丙烯酸酯化合物; （B）聚酰亚胺前体; 和（C）光聚合引发剂[式中，R1表示氢原子或甲基; R2表示氢原子或一价有机基团; n和m独立地表示1〜5的整数。 p表示0〜6的整数， q和r独立地表示0〜4的整数。 s表示0〜6的整数，条件是p，q，r和s的和为6，p和s的总和可以为3〜6，优选为6〜6。

4. 发明授权

US5122645A Method and apparatus for reading bar codes on photographic film and determining setting conditions of photographic film 失效
标题翻译：用于读取照相胶片上的条形码的方法和装置，并确定摄影胶片的设置条件
公开(公告)号：US5122645A
公开(公告)日：1992-06-16
申请号：US315673
申请日：1989-02-27
申请人： Yoshihiko Saeki , Yoichi Ujiie , Syuji Tahara , Kanji Tokuda
发明人： Yoshihiko Saeki , Yoichi Ujiie , Syuji Tahara , Kanji Tokuda
IPC分类号： G03B27/46 , G03B27/62
CPC分类号： G03B27/462 , G03B27/6285
摘要： Two bar code sensors are disposed at opposite sides of a passage of a photographic film, each bar code sensor having two photosensors disposed along a line perpendicular to the transportation direction of the photographic film. Each time a photographic film is fed by a predetermined distance, signals outputted from the two bar code sensor units are sampled and are compared with the signals obtained at the second preceding sampling timing to convert them into binary signals. Based on the data configuration of binary signals, i.e., based on the discrimination between the start code and end code, or the presence or absence of a clock track, automatic discrimination is performed between DX bar code data and frame number bar code data which then are decoded into a film type and frame number, respectively. The setting conditions of a photographic film also can be determined based on the bar code data configuration. An alarm is output if the setting conditions are not normal. The feed amount of a read-out frame number code is measured to calculate the number of a frame set at the print stage. Reading a frame number bar code may be performed synchronously with reading the DX bar code clock track.

5. 发明授权

US08361605B2 Photosensitive resin composition, dry film, and processed product made using the same 失效
标题翻译：感光树脂组合物，干膜和使用其制成的加工产品
公开(公告)号：US08361605B2
公开(公告)日：2013-01-29
申请号：US12596948
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： G03F7/004 , G03F7/037 , H05K3/28 , B32B27/16 , B32B27/18
CPC分类号： G03F7/037 , G03F7/085 , H05K3/287 , Y10T428/24917
摘要： A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.
摘要翻译：一种感光性树脂组合物，其能够有效地避免在印刷线路板制造中的各种金属的镀覆步骤，例如膜下金属沉积和膜剥离，并且形成粘附性，柔性，绝缘性优异的布线保护膜可靠性和耐热性。感光性树脂组合物包含（A）羧化聚合物，（B）具有至少两个光聚合性不饱和双键的化合物，（C）光聚合引发剂，（D）由特定特征表示的氮化合物。

6. 发明授权

US07718258B2 Film adhesive and semiconductor package using the same 失效
标题翻译：薄膜粘合剂和半导体封装使用相同
公开(公告)号：US07718258B2
公开(公告)日：2010-05-18
申请号：US11271943
申请日：2005-11-14
申请人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
发明人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
IPC分类号： B32B7/12
CPC分类号： H01L24/83 , C08L2666/02 , C09J7/35 , C09J179/08 , C09J2201/128 , C09J2203/326 , C09J2479/08 , H01L21/6836 , H01L24/29 , H01L2221/68327 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/83191 , H01L2224/8388 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , Y10T428/2848 , Y10T428/2852 , Y10T428/2891 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.
摘要翻译：一种胶粘剂，其具有主要含有玻璃化转变温度不超过100℃的热塑性聚酰亚胺的粘合剂层（C）和在50℃下具有不超过106Pa的储能剪切模量的粘合剂层（D）此外，膜粘合剂还包含基材（A）和粘合剂层（B）。膜粘合剂可以表现出优异的低温粘合性能和覆盖能力，其可用作可用于半导体封装中的芯片粘合粘合剂膜。此外，膜粘合剂可以表现出优异的低温粘合性和覆盖能力，其既用作芯片粘合粘合剂膜又可用作切割带。

7. 发明授权

US5635259A Resin composition for sealing film-made liquid crystal cells 失效
标题翻译：用于密封薄膜制造的液晶单元的树脂组合物
公开(公告)号：US5635259A
公开(公告)日：1997-06-03
申请号：US487889
申请日：1995-06-07
申请人： Syuji Tahara , Koichi Machida , Seiji Itami , Masayuki Horiuchi
发明人： Syuji Tahara , Koichi Machida , Seiji Itami , Masayuki Horiuchi
IPC分类号： C08G59/30 , C08G59/40 , C08G59/68 , C08L63/00 , C09J151/08 , G02F1/1339 , C08L63/10 , C09K19/00
CPC分类号： G02F1/1339 , C08G59/302 , C08G59/4035 , C08G59/686 , C08L63/00 , C09J151/08 , Y10T428/1073 , Y10T428/31511 , Y10T428/31525
摘要： A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed by the general formula (1) in an amount of 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000. Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sup.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.
摘要翻译：一种用于密封液晶单元的树脂组合物，其包含含有多硫化物改性环氧树脂，酰肼化合物和填料的作为主要成分的环氧树脂。所述环氧树脂在整个环氧树脂中含有由通式（1）表示的多硫化物改性环氧树脂，其量为20〜100重量％，整个环氧树脂的平均分子量为300-3000。式（1）定义如下：其中R1和R3各自表示选自双酚结构，脂族氧醚结构和脂族硫醚结构中的至少一种有机基团，R 2表示由下式表示的多硫结构： - （C 2 H 4 OCH 2 OC 2 H 4 Sm）n - ，其中m表示多硫化物结构中所含的硫原子数，其为1或2，n表示上式中所含的多硫化物结构的平均数，介于1和50之间。通过使用该树脂组合物制成的薄膜液晶单元具有优异的粘合性，柔韧性，电性能，并具有高可靠性。

8. 发明授权

US08362103B2 Resin composition, dry film, and processed product made using the same 失效
标题翻译：树脂组合物，干膜和使用其制成的加工产品
公开(公告)号：US08362103B2
公开(公告)日：2013-01-29
申请号：US12597676
申请日：2008-04-30
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： C08F2/42 , C08J3/28 , G03C1/00 , G03C1/72
CPC分类号： G03F7/037 , C08K5/53 , G03F7/027 , Y10T428/31721 , C08L79/04
摘要： The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.
摘要翻译：本发明提供了一种树脂组合物，尽管它不含有易于引起环境负荷的含卤素化合物和锑化合物，但其固化后具有优异的阻燃性，并且可以得到满足近来对高屈服要求的膜电阻和绝缘可靠性。具体地说，本发明提供一种树脂组合物，其包含（A）聚酰亚胺前体和（B）由式（1）表示的有机磷化合物与具有四个以上（甲基）丙烯酸酯基团的化合物的加合物。优选树脂组合物还含有（C）磷腈化合物。

9. 发明申请

US20100059263A1 RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME 失效
标题翻译：树脂组合物，干膜和使用其的加工产品
公开(公告)号：US20100059263A1
公开(公告)日：2010-03-11
申请号：US12597676
申请日：2008-04-30
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： H05K1/00 , C08K5/53 , H01B1/00
CPC分类号： G03F7/037 , C08K5/53 , G03F7/027 , Y10T428/31721 , C08L79/04
摘要： The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.
摘要翻译：本发明提供了一种树脂组合物，尽管它不含有易于引起环境负荷的含卤素化合物和锑化合物，但其固化后具有优异的阻燃性，并且可以得到满足近来对高屈服要求的膜电阻和绝缘可靠性。具体地说，本发明提供一种树脂组合物，其包含（A）聚酰亚胺前体和（B）由式（1）表示的有机磷化合物与具有四个以上（甲基）丙烯酸酯基团的化合物的加合物。优选树脂组合物还含有（C）磷腈化合物。

10. 发明申请

US20060110595A1 Film adhesive and semiconductor package using the same 失效
标题翻译：薄膜粘合剂和半导体封装使用相同
公开(公告)号：US20060110595A1
公开(公告)日：2006-05-25
申请号：US11271943
申请日：2005-11-14
申请人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
发明人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
IPC分类号： C08G69/26 , B32B7/12
CPC分类号： H01L24/83 , C08L2666/02 , C09J7/35 , C09J179/08 , C09J2201/128 , C09J2203/326 , C09J2479/08 , H01L21/6836 , H01L24/29 , H01L2221/68327 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/83191 , H01L2224/8388 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , Y10T428/2848 , Y10T428/2852 , Y10T428/2891 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.
摘要翻译：一种胶粘剂，其具有主要含有玻璃化转变温度不超过100℃的热塑性聚酰亚胺的粘合剂层（C）和具有不大于10 6的储能剪切模量的粘合剂层（D） / SUP> Pa。此外，膜粘合剂还包含基材（A）和粘合剂层（B）。膜粘合剂可以表现出优异的低温粘合性能和覆盖能力，其可用作可用于半导体封装中的芯片粘合粘合剂膜。此外，膜粘合剂可以表现出优异的低温粘合性和覆盖能力，其既用作芯片粘合粘合剂膜又可用作切割带。

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