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1. 发明授权

US08409784B2 Photosensitive resin composition, dry film, and processed product made using the same 有权
标题翻译：感光树脂组合物，干膜和使用其制成的加工产品
公开(公告)号：US08409784B2
公开(公告)日：2013-04-02
申请号：US12596952
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： G03C1/00 , G03F7/037 , G03F7/027 , G03F7/00
CPC分类号： C08F283/04 , C08F283/00 , G03F7/027 , G03F7/037 , H05K3/287 , Y10T428/24917
摘要： Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].
摘要翻译：公开了一种感光性树脂组合物，其不含有对环境施加负担高的任何卤化物或任何锑化合物，其在固化后具有良好的阻燃性，并且特别符合最近的严格要求抗弯性和绝缘可靠性。具体公开了一种光敏树脂组合物，其包含：（A）由通式（1）表示的（甲基）丙烯酸酯化合物; （B）聚酰亚胺前体; 和（C）光聚合引发剂[式中，R1表示氢原子或甲基; R2表示氢原子或一价有机基团; n和m独立地表示1〜5的整数。 p表示0〜6的整数， q和r独立地表示0〜4的整数。 s表示0〜6的整数，条件是p，q，r和s的和为6，p和s的总和可以为3〜6，优选为6〜6。

2. 发明申请

US20100116532A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME 失效
标题翻译：光敏树脂组合物，干膜和使用其的加工产品
公开(公告)号：US20100116532A1
公开(公告)日：2010-05-13
申请号：US12596948
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： H05K1/00 , C08F2/46
CPC分类号： G03F7/037 , G03F7/085 , H05K3/287 , Y10T428/24917
摘要： A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.
摘要翻译：一种感光性树脂组合物，其能够有效地避免在印刷线路板制造中的各种金属的镀覆步骤，例如膜下金属沉积和膜剥离，并且形成粘附性，柔性，绝缘性优异的布线保护膜可靠性和耐热性。感光性树脂组合物包含（A）羧化聚合物，（B）具有至少两个光聚合性不饱和双键的化合物，（C）光聚合引发剂，（D）由特定特征表示的氮化合物。

3. 发明授权

US08361605B2 Photosensitive resin composition, dry film, and processed product made using the same 失效
标题翻译：感光树脂组合物，干膜和使用其制成的加工产品
公开(公告)号：US08361605B2
公开(公告)日：2013-01-29
申请号：US12596948
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： G03F7/004 , G03F7/037 , H05K3/28 , B32B27/16 , B32B27/18
CPC分类号： G03F7/037 , G03F7/085 , H05K3/287 , Y10T428/24917
摘要： A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.
摘要翻译：一种感光性树脂组合物，其能够有效地避免在印刷线路板制造中的各种金属的镀覆步骤，例如膜下金属沉积和膜剥离，并且形成粘附性，柔性，绝缘性优异的布线保护膜可靠性和耐热性。感光性树脂组合物包含（A）羧化聚合物，（B）具有至少两个光聚合性不饱和双键的化合物，（C）光聚合引发剂，（D）由特定特征表示的氮化合物。

4. 发明申请

US20100084172A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME 有权
标题翻译：光敏树脂组合物，干膜和使用其的加工产品
公开(公告)号：US20100084172A1
公开(公告)日：2010-04-08
申请号：US12596952
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： H05K1/00 , C08F2/46
CPC分类号： C08F283/04 , C08F283/00 , G03F7/027 , G03F7/037 , H05K3/287 , Y10T428/24917
摘要： Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].
摘要翻译：公开了一种感光性树脂组合物，其不含有对环境施加负担高的任何卤化物或任何锑化合物，其在固化后具有良好的阻燃性，并且特别符合最近的严格要求抗弯性和绝缘可靠性。具体公开了一种光敏树脂组合物，其包含：（A）由通式（1）表示的（甲基）丙烯酸酯化合物; （B）聚酰亚胺前体; 和（C）光聚合引发剂[式中，R1表示氢原子或甲基; R2表示氢原子或一价有机基团; n和m独立地表示1〜5的整数。 p表示0〜6的整数， q和r独立地表示0〜4的整数。 s表示0〜6的整数，条件是p，q，r和s的和为6，p和s的总和可以为3〜6，优选为6〜6。

5. 发明授权

US08362103B2 Resin composition, dry film, and processed product made using the same 失效
标题翻译：树脂组合物，干膜和使用其制成的加工产品
公开(公告)号：US08362103B2
公开(公告)日：2013-01-29
申请号：US12597676
申请日：2008-04-30
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： C08F2/42 , C08J3/28 , G03C1/00 , G03C1/72
CPC分类号： G03F7/037 , C08K5/53 , G03F7/027 , Y10T428/31721 , C08L79/04
摘要： The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.
摘要翻译：本发明提供了一种树脂组合物，尽管它不含有易于引起环境负荷的含卤素化合物和锑化合物，但其固化后具有优异的阻燃性，并且可以得到满足近来对高屈服要求的膜电阻和绝缘可靠性。具体地说，本发明提供一种树脂组合物，其包含（A）聚酰亚胺前体和（B）由式（1）表示的有机磷化合物与具有四个以上（甲基）丙烯酸酯基团的化合物的加合物。优选树脂组合物还含有（C）磷腈化合物。

6. 发明申请

US20100059263A1 RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME 失效
标题翻译：树脂组合物，干膜和使用其的加工产品
公开(公告)号：US20100059263A1
公开(公告)日：2010-03-11
申请号：US12597676
申请日：2008-04-30
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
IPC分类号： H05K1/00 , C08K5/53 , H01B1/00
CPC分类号： G03F7/037 , C08K5/53 , G03F7/027 , Y10T428/31721 , C08L79/04
摘要： The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.
摘要翻译：本发明提供了一种树脂组合物，尽管它不含有易于引起环境负荷的含卤素化合物和锑化合物，但其固化后具有优异的阻燃性，并且可以得到满足近来对高屈服要求的膜电阻和绝缘可靠性。具体地说，本发明提供一种树脂组合物，其包含（A）聚酰亚胺前体和（B）由式（1）表示的有机磷化合物与具有四个以上（甲基）丙烯酸酯基团的化合物的加合物。优选树脂组合物还含有（C）磷腈化合物。

7. 发明申请

US20050170270A1 Composition for forming wiring protective film and uses thereof 有权
标题翻译：用于形成布线保护膜的组合物及其用途
公开(公告)号：US20050170270A1
公开(公告)日：2005-08-04
申请号：US11068890
申请日：2005-03-02
申请人： Katsuhiko Funaki , Shuji Tahara , Kazuhito Fujita , Takeshi Tsuda , Etsuo Ohkawado
发明人： Katsuhiko Funaki , Shuji Tahara , Kazuhito Fujita , Takeshi Tsuda , Etsuo Ohkawado
IPC分类号： C08G73/10 , C08G73/16 , G03F7/037 , H01L21/00 , H01L21/44 , H05K1/02 , H05K3/28
CPC分类号： G03F7/037 , C08G73/1025 , C08G73/16 , H05K1/0254 , H05K3/287 , H05K2201/0154 , Y10S430/106 , Y10S430/117
摘要： A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.
摘要翻译：一种形成用于保护布线的膜的组合物，其一方面包括聚酰亚胺前体，具有至少两个可光聚合基团的化合物和光聚合引发剂，其中所述聚酰亚胺前体包括由二胺组分得到的聚酰亚胺前体，所述二胺组分包含限定的二胺化合物。在其它方面，提供了使用该组合物形成布线保护膜的干膜和具有通过干膜保护的布线的基板。

8. 发明授权

US07851124B2 Composition for forming wiring protective film and uses thereof 有权
标题翻译：用于形成布线保护膜的组合物及其用途
公开(公告)号：US07851124B2
公开(公告)日：2010-12-14
申请号：US11068890
申请日：2005-03-02
申请人： Katsuhiko Funaki , Shuji Tahara , Kazuhito Fujita , Takeshi Tsuda , Etsuo Ohkawado
发明人： Katsuhiko Funaki , Shuji Tahara , Kazuhito Fujita , Takeshi Tsuda , Etsuo Ohkawado
IPC分类号： G03F7/028 , G03F7/095 , G03F7/09
CPC分类号： G03F7/037 , C08G73/1025 , C08G73/16 , H05K1/0254 , H05K3/287 , H05K2201/0154 , Y10S430/106 , Y10S430/117
摘要： A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.
摘要翻译：一种形成用于保护布线的膜的组合物，其一方面包括聚酰亚胺前体，具有至少两个可光聚合基团的化合物和光聚合引发剂，其中所述聚酰亚胺前体包括由二胺组分获得的聚酰亚胺前体，所述二胺组分包含限定的二胺化合物。在其它方面，提供了使用该组合物形成布线保护膜的干膜和具有通过干膜保护的布线的基板。

9. 发明授权

US06762259B2 Process for the production of living (co)polymers and use of the (co)polymers 有权
标题翻译：生产（共）聚合物的方法和（共）聚合物的使用
公开(公告)号：US06762259B2
公开(公告)日：2004-07-13
申请号：US10149381
申请日：2002-06-12
申请人： Tadahito Nobori , Katsuhiko Funaki , Atsushi Shibahara , Makoto Suzuki , Kazumi Mizutani , Hiromi Jouyama , Isao Hara , Takaomi Hayashi , Shinji Kiyono , Setsuko Fujiyoshi , Hiroyuki Sakayama , Mitsuyuki Mizoguchi , Tsuyoshi Matsumoto , Yoshiharu Hirose
发明人： Tadahito Nobori , Katsuhiko Funaki , Atsushi Shibahara , Makoto Suzuki , Kazumi Mizutani , Hiromi Jouyama , Isao Hara , Takaomi Hayashi , Shinji Kiyono , Setsuko Fujiyoshi , Hiroyuki Sakayama , Mitsuyuki Mizoguchi , Tsuyoshi Matsumoto , Yoshiharu Hirose
IPC分类号： C08F446
CPC分类号： C09D129/12 , C08F2/38 , C08F4/00 , C09D125/00 , C09D133/04 , C09D135/06 , C09D139/00
摘要： The purpose of the present invention is to provide polymerization catalyst which can produce quite efficiently (co)polymer having number average molecular weight and number of molecules which are accurately controlled in producing method of (co)polymer by the polymerization of polar unsaturated compound, and provide living polymerized (co)polymer obtained according to the producing method. For the purpose, polymerization catalyst composition which comprises the composition comprising organic oxysalt compound and hydroxycarbonyl compound having at least both an alcoholic hydroxyl group and a carbonyl group in the same molecule is provided and the polar unsaturated compound is polymerized by using the polymerization catalyst composition. The composition containing the obtained (co)polymer were able to provide thermosetting powder coating composition having particularly excellent characteristics.
摘要翻译：本发明的目的是提供聚合催化剂，其可以产生具有数均分子量和分子数的非常有效的（共）聚合物，其通过极性不饱和化合物的聚合制备（共）聚合物的方法被精确控制，以及提供根据制造方法获得的活性聚合（共）聚合物。为此，提供了包含含有有机氧化锡化合物和在同一分子中至少具有醇羟基和羰基两者的羟基羰基化合物的组合物的聚合催化剂组合物，并且通过使用聚合催化剂组合物聚合极性不饱和化合物。含有所得（共）聚合物的组合物能够提供具有特别优异特性的热固性粉末涂料组合物。

10. 发明授权

US06469224B1 Process for preparation of substituted aromatic compound 有权
标题翻译：取代芳族化合物的制备方法
公开(公告)号：US06469224B1
公开(公告)日：2002-10-22
申请号：US10018424
申请日：2001-12-20
申请人： Tadahito Nobori , Setsuko Fujiyoshi , Isao Hara , Takaomi Hayashi , Atsushi Shibahara , Katsuhiko Funaki , Kazumi Mizutani , Shinji Kiyono
发明人： Tadahito Nobori , Setsuko Fujiyoshi , Isao Hara , Takaomi Hayashi , Atsushi Shibahara , Katsuhiko Funaki , Kazumi Mizutani , Shinji Kiyono
IPC分类号： C07B3900
CPC分类号： B01J31/0265 , B01J2531/98 , C07B39/00 , C07B41/00 , C07C17/202 , C07C17/208 , C07C41/16 , C07C45/63 , C07C67/11 , C07C201/12 , C07C209/10 , C07C253/14 , C07C319/14 , C07D209/08 , C07D213/61 , C07C25/13 , C07C49/813 , C07C321/28 , C07C321/30 , C07C255/50 , C07C211/50 , C07C205/12 , C07C205/38 , C07C43/205 , C07C43/225 , C07C69/78
摘要： A substituted aromatic compound substituted with Q is obtained by reacting a phosphazenium compound represented by formula (1) (in the formula, Q− represents an anion in a form derived by elimination of a proton from an inorganic acid, or an active hydrogen compound having an active hydrogen on an oxygen atom, a nitrogen atom or a sulfur atom; a, b, c and d, each independently, is 0 or 1, but all of them are not 0 simultaneously; and R groups represent the same or different hydrocarbon groups having 1 to 10 carbon atoms, or two Rs on each common nitrogen atom may be bonded together to form a ring structure) with a halogenated aromatic compound having halogen atoms; whereby, at least one halogen atom in the halogenated aromatic compound is substituted with Q (where, Q represents an inorganic group or an organic group in a form derived by elimination of one electron from Q− in formula (1)).
摘要翻译：被Q取代的取代芳香族化合物是通过使式（1）表示的磷氮烯基鏻化合物（式中的Q表示以无机酸除去质子衍生的阴离子，或具有式氧原子，氮原子或硫原子上的活性氢; a，b，c和d各自独立地为0或1，但它们全部不同时为0; R基表示相同或不同的烃具有1至10个碳原子的基团，或每个常见氮原子上的两个R可以结合在一起形成环结构）与具有卤素原子的卤代芳族化合物; 由此，卤代芳香族化合物中的至少一个卤素原子被Q取代（其中，Q表示通过在式（1）中从Q-中除去一个电子而得到的无机基团或有机基团）。

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