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1. 发明授权

US5908899A Resin composition for sealing liquid crystal cells 失效
标题翻译：液晶盒密封用树脂组合物
公开(公告)号：US5908899A
公开(公告)日：1999-06-01
申请号：US767882
申请日：1996-12-17
申请人： Shuji Tahara , Shigeo Makino , Kenji Ito , Seiji Itami , Hiromi Shitakoji
发明人： Shuji Tahara , Shigeo Makino , Kenji Ito , Seiji Itami , Hiromi Shitakoji
IPC分类号： C08F291/02 , G02F1/1341 , C08F265/02
CPC分类号： G02F1/1341 , C08F291/02
摘要： A resin composition for sealing liquid crystal cells which contains as essential components a rubber-modified unsaturated compound obtained by grafting a monomer having at least one polymerizable ethylenically unsaturated bond in a molecule with at least one rubber selected from acrylic rubber, silicone rubber, urethane rubber and conjugated diene rubber, and a coupling agent, a filler and a photopolymerization initiator. The rubber contained in the rubber modified unsaturated compound has a particle diameter of 0.2-5 .mu.m and a number average molecular weight of 1000-100,000, and the rubber content in the compound is 0.5-45% by weight based on the rubber modified unsaturated compound.
摘要翻译：一种用于密封液晶单元的树脂组合物，其包含作为主要组分的橡胶改性的不饱和化合物，其通过将分子中具有至少一个可聚合烯属不饱和键的单体与选自丙烯酸橡胶，硅橡胶，聚氨酯橡胶中的至少一种橡胶和共轭二烯橡胶，偶联剂，填料和光聚合引发剂。包含在橡胶改性不饱和化合物中的橡胶的粒径为0.2-5μm，数均分子量为1000-10000，化合物中的橡胶含量为橡胶改性不饱和化合物的0.5〜45重量％复合。

2. 发明授权

US07718258B2 Film adhesive and semiconductor package using the same 失效
标题翻译：薄膜粘合剂和半导体封装使用相同
公开(公告)号：US07718258B2
公开(公告)日：2010-05-18
申请号：US11271943
申请日：2005-11-14
申请人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
发明人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
IPC分类号： B32B7/12
CPC分类号： H01L24/83 , C08L2666/02 , C09J7/35 , C09J179/08 , C09J2201/128 , C09J2203/326 , C09J2479/08 , H01L21/6836 , H01L24/29 , H01L2221/68327 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/83191 , H01L2224/8388 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , Y10T428/2848 , Y10T428/2852 , Y10T428/2891 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.
摘要翻译：一种胶粘剂，其具有主要含有玻璃化转变温度不超过100℃的热塑性聚酰亚胺的粘合剂层（C）和在50℃下具有不超过106Pa的储能剪切模量的粘合剂层（D）此外，膜粘合剂还包含基材（A）和粘合剂层（B）。膜粘合剂可以表现出优异的低温粘合性能和覆盖能力，其可用作可用于半导体封装中的芯片粘合粘合剂膜。此外，膜粘合剂可以表现出优异的低温粘合性和覆盖能力，其既用作芯片粘合粘合剂膜又可用作切割带。

3. 发明授权

US5635259A Resin composition for sealing film-made liquid crystal cells 失效
标题翻译：用于密封薄膜制造的液晶单元的树脂组合物
公开(公告)号：US5635259A
公开(公告)日：1997-06-03
申请号：US487889
申请日：1995-06-07
申请人： Syuji Tahara , Koichi Machida , Seiji Itami , Masayuki Horiuchi
发明人： Syuji Tahara , Koichi Machida , Seiji Itami , Masayuki Horiuchi
IPC分类号： C08G59/30 , C08G59/40 , C08G59/68 , C08L63/00 , C09J151/08 , G02F1/1339 , C08L63/10 , C09K19/00
CPC分类号： G02F1/1339 , C08G59/302 , C08G59/4035 , C08G59/686 , C08L63/00 , C09J151/08 , Y10T428/1073 , Y10T428/31511 , Y10T428/31525
摘要： A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed by the general formula (1) in an amount of 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000. Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sup.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.
摘要翻译：一种用于密封液晶单元的树脂组合物，其包含含有多硫化物改性环氧树脂，酰肼化合物和填料的作为主要成分的环氧树脂。所述环氧树脂在整个环氧树脂中含有由通式（1）表示的多硫化物改性环氧树脂，其量为20〜100重量％，整个环氧树脂的平均分子量为300-3000。式（1）定义如下：其中R1和R3各自表示选自双酚结构，脂族氧醚结构和脂族硫醚结构中的至少一种有机基团，R 2表示由下式表示的多硫结构： - （C 2 H 4 OCH 2 OC 2 H 4 Sm）n - ，其中m表示多硫化物结构中所含的硫原子数，其为1或2，n表示上式中所含的多硫化物结构的平均数，介于1和50之间。通过使用该树脂组合物制成的薄膜液晶单元具有优异的粘合性，柔韧性，电性能，并具有高可靠性。

4. 发明授权

US5665797A Resin composition for sealing film-made liquid crystal cells 失效
标题翻译：用于密封薄膜制造的液晶单元的树脂组合物
公开(公告)号：US5665797A
公开(公告)日：1997-09-09
申请号：US586479
申请日：1996-01-16
申请人： Syuji Tahara , Koichi Machida , Seiji Itami , Masayuki Horiuchi
发明人： Syuji Tahara , Koichi Machida , Seiji Itami , Masayuki Horiuchi
IPC分类号： C08G59/30 , C08G59/40 , C08G59/68 , C08L63/00 , C09J151/08 , G02F1/1339
CPC分类号： G02F1/1339 , C08G59/302 , C08G59/4035 , C08G59/686 , C08L63/00 , C09J151/08 , Y10T428/1073 , Y10T428/31511 , Y10T428/31525
摘要： A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed in an amount of the general formula (1) by 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000 Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sub.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.
摘要翻译：一种用于密封液晶单元的树脂组合物，其包含含有多硫化物改性环氧树脂，酰肼化合物和填料的作为主要成分的环氧树脂。所述环氧树脂包含在整个环氧树脂中以通式（1）的量表示20至100重量％的多硫化物改性环氧树脂，并且整个环氧树脂的平均分子量为300至3000（式 1）定义如下：其中R1和R3各自表示选自双酚结构，脂族氧醚结构和脂族硫醚结构中的至少一种有机基团，并且R 2表示由下式表示的多硫结构：（C2H4OCH2OC2H4Sm）n-，其中m表示多硫化物结构中所含的硫原子数，为1或2，n表示上式中所含的多硫化物结构的平均数，介于1和50之间。通过使用该树脂组合物制成的液晶单元具有优异的粘合性，柔韧性，电性能，并具有高可靠性。

5. 发明申请

US20060110595A1 Film adhesive and semiconductor package using the same 失效
标题翻译：薄膜粘合剂和半导体封装使用相同
公开(公告)号：US20060110595A1
公开(公告)日：2006-05-25
申请号：US11271943
申请日：2005-11-14
申请人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
发明人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
IPC分类号： C08G69/26 , B32B7/12
CPC分类号： H01L24/83 , C08L2666/02 , C09J7/35 , C09J179/08 , C09J2201/128 , C09J2203/326 , C09J2479/08 , H01L21/6836 , H01L24/29 , H01L2221/68327 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/83191 , H01L2224/8388 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , Y10T428/2848 , Y10T428/2852 , Y10T428/2891 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.
摘要翻译：一种胶粘剂，其具有主要含有玻璃化转变温度不超过100℃的热塑性聚酰亚胺的粘合剂层（C）和具有不大于10 6的储能剪切模量的粘合剂层（D） / SUP> Pa。此外，膜粘合剂还包含基材（A）和粘合剂层（B）。膜粘合剂可以表现出优异的低温粘合性能和覆盖能力，其可用作可用于半导体封装中的芯片粘合粘合剂膜。此外，膜粘合剂可以表现出优异的低温粘合性和覆盖能力，其既用作芯片粘合粘合剂膜又可用作切割带。

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