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1. 发明申请

US20060110595A1 Film adhesive and semiconductor package using the same 失效
标题翻译：薄膜粘合剂和半导体封装使用相同
公开(公告)号：US20060110595A1
公开(公告)日：2006-05-25
申请号：US11271943
申请日：2005-11-14
申请人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
发明人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
IPC分类号： C08G69/26 , B32B7/12
CPC分类号： H01L24/83 , C08L2666/02 , C09J7/35 , C09J179/08 , C09J2201/128 , C09J2203/326 , C09J2479/08 , H01L21/6836 , H01L24/29 , H01L2221/68327 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/83191 , H01L2224/8388 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , Y10T428/2848 , Y10T428/2852 , Y10T428/2891 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.
摘要翻译：一种胶粘剂，其具有主要含有玻璃化转变温度不超过100℃的热塑性聚酰亚胺的粘合剂层（C）和具有不大于10 6的储能剪切模量的粘合剂层（D） / SUP> Pa。此外，膜粘合剂还包含基材（A）和粘合剂层（B）。膜粘合剂可以表现出优异的低温粘合性能和覆盖能力，其可用作可用于半导体封装中的芯片粘合粘合剂膜。此外，膜粘合剂可以表现出优异的低温粘合性和覆盖能力，其既用作芯片粘合粘合剂膜又可用作切割带。

2. 发明授权

US07718258B2 Film adhesive and semiconductor package using the same 失效
标题翻译：薄膜粘合剂和半导体封装使用相同
公开(公告)号：US07718258B2
公开(公告)日：2010-05-18
申请号：US11271943
申请日：2005-11-14
申请人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
发明人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
IPC分类号： B32B7/12
CPC分类号： H01L24/83 , C08L2666/02 , C09J7/35 , C09J179/08 , C09J2201/128 , C09J2203/326 , C09J2479/08 , H01L21/6836 , H01L24/29 , H01L2221/68327 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/83191 , H01L2224/8388 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , Y10T428/2848 , Y10T428/2852 , Y10T428/2891 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.
摘要翻译：一种胶粘剂，其具有主要含有玻璃化转变温度不超过100℃的热塑性聚酰亚胺的粘合剂层（C）和在50℃下具有不超过106Pa的储能剪切模量的粘合剂层（D）此外，膜粘合剂还包含基材（A）和粘合剂层（B）。膜粘合剂可以表现出优异的低温粘合性能和覆盖能力，其可用作可用于半导体封装中的芯片粘合粘合剂膜。此外，膜粘合剂可以表现出优异的低温粘合性和覆盖能力，其既用作芯片粘合粘合剂膜又可用作切割带。

3. 发明授权

US5142796A Flameresisting apparatus 失效
标题翻译：易燃设备
公开(公告)号：US5142796A
公开(公告)日：1992-09-01
申请号：US598638
申请日：1990-10-23
申请人： Hisao Anzai , Nobuyuki Yamamoto , Youichi Kodama , Yoshitaka Imai , Tsutomu Daiguuji
发明人： Hisao Anzai , Nobuyuki Yamamoto , Youichi Kodama , Yoshitaka Imai , Tsutomu Daiguuji
IPC分类号： D01F9/145 , D01F9/16 , D01F9/17 , D01F9/22 , D01F9/32
CPC分类号： D01F9/17 , D01F9/145 , D01F9/16 , D01F9/22 , D01F9/32 , D01F9/322
摘要： A flameresisting apparatus in which two sections, referred to as roller compartments, enclosing a series of rollers provided face to face with one another for transferring precursor fiber, are separated from a heat treatment section by two walls facing each other. The walls include apertures for passage of the precursor fiber. Significantly, the two walls facing each other are provided at a distance which enables the precursor fiber to pass from one wall to the other in 5 to 60 seconds. The surface temperature of the rollers and the temperature of the roller compartments are maintained at a temperature of 10.degree. to 80.degree. C. lower than the temperature of the heat treatment compartment, but not lower than 180.degree. C. In addition, heated air is blown against the precursor fiber into the heat treatment compartment. As a result, a flameresisting apparatus is provided which makes it possible to manufacture precursor fiber for carbon fiber at high speed in a short period of time without fusion of the fibers or other uncontrollable reactions.
摘要翻译： PCT No.PCT / JP90 / 00204 Sec。 371 1990年10月23日第 102（e）1990年10月23日PCT PCT 1990年02月21日PCT公布。 WO90 / 10101 PCT出版物日期：1990年9月7日。一种调色装置，其中被称为辊室的两个部分包围彼此面对面地设置用于转移前体纤维的一系列辊，通过面向每个的两个壁与热处理部分分离其他。壁包括用于前体纤维通过的孔。显着地，彼此面对的两个壁设置成使得前体纤维能够在5至60秒内从一个壁传递到另一个壁的距离。辊的表面温度和辊室的温度保持在低于热处理室的温度10℃至80℃的温度，但不低于180℃。此外，加热的空气是将前体纤维吹入热处理室。结果，提供了一种阻燃装置，其可以在短时间内高速地制造碳纤维的前体纤维而不会纤维或其它不可控反应的熔合。

4. 发明授权

US07488532B2 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same 失效
标题翻译：粘合剂树脂组合物和胶粘剂的形式，以及使用其的半导体器件
公开(公告)号：US07488532B2
公开(公告)日：2009-02-10
申请号：US10551957
申请日：2004-04-13
申请人： Youichi Kodama , Hiroshi Maruyama , Isao Naruse
发明人： Youichi Kodama , Hiroshi Maruyama , Isao Naruse
IPC分类号： C09J163/00 , C09J179/08 , C08G59/02 , H01L21/00
CPC分类号： H01L24/29 , C08L63/00 , C08L2666/22 , C09J7/10 , C09J7/22 , C09J7/35 , C09J179/08 , C09J2479/08 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/8319 , H01L2224/83885 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , Y10S428/901 , Y10T428/2852 , Y10T428/287 , Y10T428/2896 , H01L2924/00 , H01L2924/00015 , H01L2924/0695 , H01L2924/00014 , H01L2924/05432 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention is to provide an adhesive resin composition for use in preparing an adhesive in the form of a film which is excellent in the adhesiveness at a low temperature and in the heat resistance, an adhesive in the form of a film comprising the adhesive resin composition, and a semiconductor device using the adhesive in the form of a film.
摘要翻译：本发明提供一种用于制备薄膜形式的粘合剂的粘合剂树脂组合物，其在低温和耐热性下的粘合性优异，包括粘合剂树脂的膜形式的粘合剂组合物和使用胶片形式的粘合剂的半导体器件。

5. 发明申请

US20060281872A1 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same 失效
公开(公告)号：US20060281872A1
公开(公告)日：2006-12-14
申请号：US10551957
申请日：2004-04-13
申请人： Youichi Kodama , Hiroshi Maruyama , Isao Naruse
发明人： Youichi Kodama , Hiroshi Maruyama , Isao Naruse
IPC分类号： C08L77/00
CPC分类号： H01L24/29 , C08L63/00 , C08L2666/22 , C09J7/10 , C09J7/22 , C09J7/35 , C09J179/08 , C09J2479/08 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/8319 , H01L2224/83885 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , Y10S428/901 , Y10T428/2852 , Y10T428/287 , Y10T428/2896 , H01L2924/00 , H01L2924/00015 , H01L2924/0695 , H01L2924/00014 , H01L2924/05432 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention is to provide an adhesive resin composition for use in preparing an adhesive in the form of a film which is excellent in the adhesiveness at a low temperature and in the heat resistance, an adhesive in the form of a film comprising the adhesive resin composition, and a semiconductor device using the adhesive in the form of a film.

6. 发明申请

US20060127685A1 Layered polyimide/metal product 审中-公开
标题翻译：分层聚酰亚胺/金属制品
公开(公告)号：US20060127685A1
公开(公告)日：2006-06-15
申请号：US10544185
申请日：2004-02-09
申请人： Koji Hirota , Naoki Nakazawa , Youichi Kodama
发明人： Koji Hirota , Naoki Nakazawa , Youichi Kodama
IPC分类号： B32B15/08
CPC分类号： B32B27/281 , B32B15/08 , B32B15/18 , B32B15/20 , B32B2250/03 , B32B2274/00 , B32B2307/306 , B32B2307/584 , B32B2307/734 , B32B2457/00 , G11B5/4833 , H05K1/056 , H05K3/002 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide metal laminate comprising a polyimide resin formed on a metal foil, wherein the polyimide resin does not cause the peeling of not less than 100 μm in the polyimide resin and/or at an interface between the polyimide resin and the metal foil when the polyimide resin is heated in an oven at an atmospheric temperature of from 340 to 360° C. for 5 to 10 minutes, the coefficient of humidity expansion at 320 is from 1 to 20 ppm/% RH, and an average value of the etching rate by a 50 wt % aqueous solution of potassium hydroxide at 80° C. is not less than 1.0 μm/min. The polyimide metal laminate can provide good heat resistance, superior dimensional stability and can be etching processed by an aqueous alkaline solution.
摘要翻译：一种聚酰亚胺金属层压体，其包含在金属箔上形成的聚酰亚胺树脂，其中，当聚酰亚胺树脂和/或聚酰亚胺树脂与金属箔之间的界面处，聚酰亚胺树脂不会在聚酰亚胺树脂中和/ 树脂在340〜360℃的大气温度的烘箱中加热5〜10分钟，320℃的湿度膨胀系数为1〜20ppm /％RH，蚀刻速度的平均值为在80℃下氢氧化钾的50重量％水溶液不小于1.0毫姆/分钟。聚酰亚胺金属层压体可以提供良好的耐热性，优异的尺寸稳定性，并且可以通过碱性水溶液进行蚀刻加工。

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