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    • 2. 发明申请
    • Structure and method to fabricate a protective sidewall liner for an optical mask
    • 用于制造光学掩模的保护侧壁衬里的结构和方法
    • US20060105520A1
    • 2006-05-18
    • US10992447
    • 2004-11-18
    • Sia TanQun LinLiang Hsia
    • Sia TanQun LinLiang Hsia
    • H01L21/8242
    • G03F1/30
    • Methods and structures for optical masks that have a liner on the trench sidewalls. An example embodiment comprises a mask structure for use with light at a wavelength comprising: a substrate having a first region, a second region and a third region; a first trench in the first region; a first region having a first thickness of a first material, the first material having a first amount of transmission of light at the wavelength, the second region having a second thickness of the first material, such that the second thickness is greater than the first thickness by a first difference, the first difference being equivalent to a phase shift of 180 degrees at the wavelength, and a third region located on the substrate, the third region having a third thickness of the first material, such that the third thickness is equal to or greater than the second thickness; a liner on the sidewalls of the trench. The liner reduces the reflections from the trench sidewall. The embodiments can be used with single and double phase shift masks and with chromeless phase lithography masks.
    • 在沟槽侧壁上具有衬垫的光学掩模的方法和结构。 示例性实施例包括用于波长为的光的掩模结构,包括:具有第一区域,第二区域和第三区域的衬底; 第一个区域的第一个沟槽; 具有第一材料的第一厚度的第一区域,所述第一材料具有在所述波长处的第一光透射量,所述第二区域具有所述第一材料的第二厚度,使得所述第二厚度大于所述第一厚度 通过第一差异,第一差异等于在波长处180度的相移,以及位于基板上的第三区域,第三区域具有第一材料的第三厚度,使得第三厚度等于 或大于第二厚度; 在沟槽的侧壁上的衬垫。 衬垫减少了从沟槽侧壁的反射。 这些实施例可以用于单相和双相位掩模和无铬相光刻掩模。
    • 4. 发明申请
    • Method for dual damascene patterning with single exposure using tri-tone phase shift mask
    • 使用三色相移掩模的单次曝光的双镶嵌图案化方法
    • US20050089763A1
    • 2005-04-28
    • US10693202
    • 2003-10-24
    • Sia TanQun LinSoon TanHuey Chong
    • Sia TanQun LinSoon TanHuey Chong
    • G03F1/00G03F1/14G03F7/00G03F9/00
    • G03F1/32
    • A reticle structure and a method of forming a photoresist profile on a substrate using the reticle having a multi-level profile. The reticle comprises (1) a transparent substrate, (2) a partially transmitting 180 degree phase shift film overlying predetermined areas of the transparent substrate to transmit approximately 20 to 70% of incident light, and (3) an opaque film overlying the predetermined areas of the partially transmitting 180 degree phase shift film. The method comprises the following steps: a) depositing a photoresist film over the substrate; b) directing light to the photoresist film through the reticle, and c) developing the photoresist film to form an opening in the resist layer where light only passed thru the substrate, and to remove intermediate thickness of the photoresist film, in the areas where the light passed through the partially transmitting 180 degree phase shift film. In an aspect, the photoresist film is comprised of a lower photoresist layer and an upper photoresist layer. The lower photoresist layer is less sensitive to light than the upper photoresist layer. In an aspect, the resist profile is used to form a dual damascene shaped opening.
    • 掩模版结构和使用具有多层轮廓的掩模版在基板上形成光刻胶轮廓的方法。 掩模版包括(1)透明基板,(2)覆盖透明基板的预定区域的部分透射的180度相移膜,以透射大约20至70%的入射光,以及(3)覆盖预定区域的不透明膜 的部分透射180度相移膜。 该方法包括以下步骤:a)在衬底上沉积光致抗蚀剂膜; b)通过掩模版将光引导到光致抗蚀剂膜,以及c)使光致抗蚀剂膜显影,以在抗蚀剂层中形成光,其中只有光通过基底,并且除去光致抗蚀剂膜的中间厚度, 光通过部分透射的180度相移膜。 在一个方面,光致抗蚀剂膜由下光致抗蚀剂层和上光致抗蚀剂层组成。 下部光致抗蚀剂层比上部光致抗蚀剂层对光敏感性差。 在一方面,抗蚀剂轮廓用于形成双镶嵌形状的开口。