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1. 发明申请

US20050170609A1 Conductive bond for through-wafer interconnect 审中-公开
标题翻译：晶圆互连的导电键
公开(公告)号：US20050170609A1
公开(公告)日：2005-08-04
申请号：US11050469
申请日：2005-02-03
申请人： Susan Alie , Bruce Wachtmann , Lawrence Felton , Changhan Yun
发明人： Susan Alie , Bruce Wachtmann , Lawrence Felton , Changhan Yun
IPC分类号： B81B7/00 , H01L21/30 , H01L21/46 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： B81C1/00301 , B81B7/0006 , B81B2203/0353 , B81B2207/093 , B81B2207/095 , B81C2203/019 , H01L21/76898 , H01L24/81 , H01L25/50 , H01L2224/05001 , H01L2224/05009 , H01L2224/05023 , H01L2224/05166 , H01L2224/05184 , H01L2224/05568 , H01L2224/05624 , H01L2224/05647 , H01L2224/13025 , H01L2224/8182 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/00014
摘要： A conductive bond for through-wafer interconnect is produced by forming an electrode through a first wafer from a component on a front side of the first wafer to a back side of the first wafer, forming a first electrically conductive interface in contact with an exposed portion of the electrode on the back side of the first wafer, and conductively bonding the first electrically conductive interface with a second electrically conductive interface on a second wafer under pressure at a temperature below the thermal budget of the stacked wafer device. The process temperature is generally well below the melting points of the electrically conductive interfaces. In some embodiments, the conductive bonding may be facilitated or enabled by performing the conductive bonding in a vacuum.
摘要翻译：通过从第一晶片的前侧的部件到第一晶片的后侧形成电极通过第一晶片形成电极，形成用于晶片间互连的导电接合，形成与暴露部分接触的第一导电界面并且在低于所述堆叠晶片装置的热量预算的温度的压力下，在第二晶片上将所述第一导电界面与第二导电界面导电地接合。工艺温度通常远低于导电界面的熔点。在一些实施例中，可以通过在真空中执行导电接合来促进或实现导电接合。

2. 发明申请

US20050127499A1 MEMS DEVICE WITH CONDUCTIVE PATH THROUGH SUBSTRATE 有权
标题翻译：具有通过基板的导电路径的MEMS器件
公开(公告)号：US20050127499A1
公开(公告)日：2005-06-16
申请号：US10827680
申请日：2004-04-19
申请人： Kieran Harney , Lawrence Felton , Thomas Kieran Nunan , Susan Alie , Bruce Wachtmann
发明人： Kieran Harney , Lawrence Felton , Thomas Kieran Nunan , Susan Alie , Bruce Wachtmann
IPC分类号： B81B7/00 , B81B7/02 , H01L23/12
CPC分类号： B81B7/007 , B81B2201/0235 , B81C2203/019 , H01L2224/16225 , H01L2924/1461
摘要： A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.
摘要翻译： MEMS器件具有从其衬底（具有MEMS结构）的顶面侧延伸到所述衬底的底侧的至少一个导电路径。所述至少一个导电路径延伸穿过衬底，如将所述底面朝向侧面与MEMS结构电连接。

3. 发明申请

US20070040231A1 Partially etched leadframe packages having different top and bottom topologies 审中-公开
标题翻译：部分蚀刻的引线框封装具有不同的顶部和底部拓扑
公开(公告)号：US20070040231A1
公开(公告)日：2007-02-22
申请号：US11338439
申请日：2006-01-24
申请人： Kieran Harney , John Martin , Lawrence Felton
发明人： Kieran Harney , John Martin , Lawrence Felton
IPC分类号： H01L29/84
CPC分类号： B81B7/007 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.
摘要翻译：描述了用于微机电（MEMS）装置的封装。预制的引线框架底座具有相对的顶部和底部表面。每个表面由具有至少一个导电部分和至少一个非导电部分的拓扑结构限定，并且顶表面的拓扑与底表面的拓扑不同。

4. 发明申请

US20090061224A1 Ribbon Crystal String with Extruded Refractory Material 审中-公开
$Ribbon Crystal String with Extruded Refractory Material$
标题翻译：丝带水晶线条与挤压耐火材料
公开(公告)号：US20090061224A1
公开(公告)日：2009-03-05
申请号：US12201180
申请日：2008-08-29
申请人： Christine Richardson , Lawrence Felton
发明人： Christine Richardson , Lawrence Felton
IPC分类号： B32B18/00 , B05D3/02 , B05D1/00 , B32B1/00
CPC分类号： C30B15/34 , C04B35/62849 , C04B35/62852 , C04B35/62863 , C04B35/62868 , C04B35/62871 , C04B35/62873 , C04B35/62894 , C04B2235/5248 , C30B15/36 , C30B35/00 , Y10T117/1032 , Y10T428/24479 , Y10T428/24628 , Y10T428/2918 , Y10T428/2929 , Y10T428/2942 , Y10T428/2962 , Y10T428/30
摘要： A method of making string for string ribbon crystal provides a substrate having an outer surface, and extrudes refractory material over the substrate. The refractory material substantially covers the outer surface of the substrate. The method then cures the refractory material.
摘要翻译：制造弦带晶体的串的方法提供了具有外表面的基底，并在基底上挤出耐火材料。耐火材料基本上覆盖基板的外表面。然后该方法固化耐火材料。

5. 发明申请

US20050205959A1 Capped sensor 有权
标题翻译：覆盖传感器
公开(公告)号：US20050205959A1
公开(公告)日：2005-09-22
申请号：US11039368
申请日：2005-01-20
申请人： Kevin Chau , Lawrence Felton , John Geen , Michael Judy , John Martin
发明人： Kevin Chau , Lawrence Felton , John Geen , Michael Judy , John Martin
IPC分类号： B81B7/00 , G01K1/00 , G01K1/08 , G01P1/02 , G01P15/00 , G01P15/08 , H01L31/058
CPC分类号： B81B7/0041 , B81B2201/0235 , B81C2203/0109 , B81C2203/0136 , B81C2203/019 , G01K1/08 , G01P1/023 , G01P15/008 , G01P15/0802
摘要： A sensor element is capped by bonding or otherwise forming a cap on a sensor element. The sensor may be hermetically sealed by using a hermetic cap and hermetic bonding material or by applying a hermetic coating. The sensor may be filled with a gas at an elevated pressure. The sensor may alternatively or additionally be filled with a special gas, such as a gas having a density-to-viscosity ratio above approximately 0.2.
摘要翻译：传感器元件通过在传感器元件上接合或以其他方式形成盖而被盖住。传感器可以通过使用密封盖和密封接合材料或通过施加气密涂层而气密密封。传感器可以在升高的压力下填充气体。传感器可以替代地或另外填充特殊气体，例如密度 - 粘度比高于约0.2的气体。

6. 发明申请

US20100055412A1 String With Refractory Metal Core For String Ribbon Crystal Growth 审中-公开
$String With Refractory Metal Core For String Ribbon Crystal Growth$
标题翻译：用钢丝绳晶圆生长的耐火金属芯线
公开(公告)号：US20100055412A1
公开(公告)日：2010-03-04
申请号：US12553252
申请日：2009-09-03
申请人： Christine Richardson , Lawrence Felton
发明人： Christine Richardson , Lawrence Felton
IPC分类号： C01B31/36 , C23C16/22 , B32B3/02 , C30B15/00 , C01B33/00
CPC分类号： C30B15/005 , C30B15/002 , C30B15/007 , C30B29/06 , C30B29/607 , C30B29/66 , H01L31/182 , Y02E10/546 , Y02P70/521 , Y10T428/24777
摘要： A method of forming a string for use in a string ribbon crystal provides a refractory metal as a core for the string and forms a first layer of material on the core. A method of growing a ribbon crystal provides a pair of strings. Each string has a refractory metal core. The method further passes the strings through a molten material to grow the ribbon crystal between the pair of strings.A ribbon crystal wafer includes a ribbon crystal material and a pair of strings in the ribbon crystal material. Each string defines an outer edge of the wafer, and each string includes a refractory metal core.
摘要翻译：形成用于弦带状晶体的弦的方法提供作为弦的核心的难熔金属，并在芯上形成第一层材料。生长带状晶体的方法提供一对串。每根绳子都有耐火金属芯。该方法进一步使绳子通过熔融材料，以使该条带之间的带状晶体生长。带状晶片包括带状晶体材料和带状晶体材料中的一对线。每个串限定晶片的外边缘，并且每个串包括难熔金属芯。

7. 发明申请

US20050035446A1 Packaged microchip with premolded-type package 有权
标题翻译：封装式微芯片采用预制型封装
公开(公告)号：US20050035446A1
公开(公告)日：2005-02-17
申请号：US10952424
申请日：2004-09-28
申请人： Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton , Lewis Long
发明人： Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton , Lewis Long
IPC分类号： B81B7/00 , H01L23/06
CPC分类号： B81B7/0048 , H01L2224/32014 , H01L2924/1461 , H01L2924/16195 , H01L2924/00
摘要： A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.
摘要翻译： MEMS惯性传感器固定在至少部分由低透湿成型材料形成的预成型包装中。因此，这种运动检测器应该能够比使用陶瓷封装的那些更经济地生产。为了达到这些目的，包装件具有从引线框架延伸以形成空腔的至少一个壁（具有低的透湿性），并且在该空腔内具有隔离器（具有顶部表面）。 MEMS惯性传感器具有悬挂在具有底表面的基底上方的可移动结构。衬底底表面在接触区域处固定到隔离器顶表面。在说明性实施例中，接触面积小于衬底的底表面的表面积。因此，隔离器在底部基板表面的至少一部分和封装之间形成空间。因此，这个空间没有隔离器。此外，由于封装的透湿性低，可以避免进一步的生产步骤，同时确保水分不会对空腔内的MEMS惯性传感器产生不利影响。

8. 发明申请

US20060027522A1 Method of producing a MEMS device 有权
公开(公告)号：US20060027522A1
公开(公告)日：2006-02-09
申请号：US10914576
申请日：2004-08-09
申请人： John Martin , Manolo Mena , Elmer Lacsamana , Michael Duffy , William Webster , Lawrence Felton , Maurice Karpman
发明人： John Martin , Manolo Mena , Elmer Lacsamana , Michael Duffy , William Webster , Lawrence Felton , Maurice Karpman
IPC分类号： C23F1/00 , H01L21/302
CPC分类号： B81C1/00896
摘要： A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

9. 发明申请

US20050056870A1 Stress sensitive microchip with premolded-type package 审中-公开
标题翻译：应力敏感微芯片与预成型封装
公开(公告)号：US20050056870A1
公开(公告)日：2005-03-17
申请号：US10952330
申请日：2004-09-28
申请人： Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton
发明人： Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton
IPC分类号： B81B7/00 , G01P1/02 , H01L23/48
CPC分类号： G01P1/023 , B81B7/0048 , B81B2201/0235 , B81B2207/012 , H01L24/32 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/15747 , H01L2924/351 , H01L2924/00 , H01L2224/45099
摘要： A packaged microchip has a microchip attach region with a lower modulus of elasticity than other portions of the package base. Specifically, the packaged microchip includes a stress sensitive microchip, and a package having a base with a primary region and an attach region. A surface of the microchip is coupled to the attach region of the package. The attach region has a modulus of elasticity that is less than the modulus of elasticity of the primary region.
摘要翻译：封装的微芯片具有微芯片附着区域，其具有比包装基底的其它部分更低的弹性模量。具体地，封装的微芯片包括应力敏感微芯片，以及具有主区域和附着区域的基底的封装。微芯片的表面耦合到封装的附接区域。附着区域的弹性模量小于初级区域的弹性模量。

10. 发明申请

US20050054133A1 Wafer level capped sensor 审中-公开
标题翻译：晶圆级封面传感器
公开(公告)号：US20050054133A1
公开(公告)日：2005-03-10
申请号：US10657741
申请日：2003-09-08
申请人： Lawrence Felton , Kieran Harney , Carl Roberts
发明人： Lawrence Felton , Kieran Harney , Carl Roberts
IPC分类号： B81B7/00 , G01P1/02 , G01P15/08 , H01L21/64
CPC分类号： B81B7/007 , B81B2201/0235 , G01P1/023 , G01P15/0802 , Y10T29/49007
摘要： A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.
摘要翻译：传感器具有模具（具有工作部分），与模具耦合以至少部分地覆盖工作部分的帽以及延伸穿过帽部到工作部分的导电通路。该通道为工作部分提供电接口。

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