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1. 发明申请

US20080157298A1 Stress Mitigation in Packaged Microchips 有权
标题翻译：包装微芯片中的应力减轻
公开(公告)号：US20080157298A1
公开(公告)日：2008-07-03
申请号：US11770369
申请日：2007-06-28
申请人： Xin Zhang , Michael Judy , Kevin H.L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人： Xin Zhang , Michael Judy , Kevin H.L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
摘要翻译：包装装置具有与盖连接以形成引线框封装的底座。包装具有第一和第二外表面，其具有相应的第一和第二接触图案。第一和第二接触图案基本上是电气相同的，以允许包装件垂直或水平地安装到下面的设备。

2. 发明申请

US20050056870A1 Stress sensitive microchip with premolded-type package 审中-公开
标题翻译：应力敏感微芯片与预成型封装
公开(公告)号：US20050056870A1
公开(公告)日：2005-03-17
申请号：US10952330
申请日：2004-09-28
申请人： Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton
发明人： Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton
IPC分类号： B81B7/00 , G01P1/02 , H01L23/48
CPC分类号： G01P1/023 , B81B7/0048 , B81B2201/0235 , B81B2207/012 , H01L24/32 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/15747 , H01L2924/351 , H01L2924/00 , H01L2224/45099
摘要： A packaged microchip has a microchip attach region with a lower modulus of elasticity than other portions of the package base. Specifically, the packaged microchip includes a stress sensitive microchip, and a package having a base with a primary region and an attach region. A surface of the microchip is coupled to the attach region of the package. The attach region has a modulus of elasticity that is less than the modulus of elasticity of the primary region.
摘要翻译：封装的微芯片具有微芯片附着区域，其具有比包装基底的其它部分更低的弹性模量。具体地，封装的微芯片包括应力敏感微芯片，以及具有主区域和附着区域的基底的封装。微芯片的表面耦合到封装的附接区域。附着区域的弹性模量小于初级区域的弹性模量。

3. 发明授权

US06615978B1 Endless conveyor belt and splicing member for forming same 失效
标题翻译：无缝输送带和拼接件用于成型
公开(公告)号：US06615978B1
公开(公告)日：2003-09-09
申请号：US10187334
申请日：2002-07-02
申请人： Glenn Peter Farrell
发明人： Glenn Peter Farrell
IPC分类号： B65G1554
CPC分类号： F16G3/00 , B65G15/54 , B65G2201/02
摘要： An endless conveyor belt comprising a plurality of interconnected segments forming a conveying surface to convey at least one article from one point to another. The conveying surface preferably has first and seconds ends and a plurality of openings. A splicing member preferably connects the first end of the conveying surface to the second end of the conveying surface to form an endless conveyor belt. The splicing member preferably includes at least first and second sections, a connecting member and at least one sealing member. The connecting member has first and second ends. A portion of the first section is connected to the first end of the connecting member thereby forming a first exposed area. A portion of the second section is connected to the second end of the connecting member thereby forming a second exposed area. The at least one sealing member is deposed relative to the connecting member and the first and second sections to seal at least one of the first and second exposed areas.
摘要翻译：一种环形输送带，包括形成输送表面的多个互连的段，以将至少一个物品从一个点传送到另一个点。传送表面优选地具有第一和第二端部以及多个开口。接合构件优选地将输送表面的第一端连接到输送表面的第二端以形成环形输送带。接合构件优选地包括至少第一和第二部分，连接构件和至少一个密封构件。连接构件具有第一和第二端。第一部分的一部分连接到连接部件的第一端，从而形成第一暴露区域。第二部分的一部分连接到连接部件的第二端，从而形成第二暴露区域。至少一个密封构件相对于连接构件和第一和第二部分被放置，以密封第一和第二暴露区域中的至少一个。

4. 发明授权

US08344487B2 Stress mitigation in packaged microchips 有权
标题翻译：包装微芯片中的应力减轻
公开(公告)号：US08344487B2
公开(公告)日：2013-01-01
申请号：US11770369
申请日：2007-06-28
申请人： Xin Zhang , Michael Judy , Kevin H. L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人： Xin Zhang , Michael Judy , Kevin H. L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.
摘要翻译：封装的微芯片具有引线框架，其中芯片直接接触引线框架的至少一个连续部分。引线框架的一部分具有形成凹部并与模具接触的顶表面。封装的微芯片还具有基本上封装引线框架部分顶表面的一部分的模制材料。

5. 发明申请

US20090230521A2 Stress Mitigation in Packaged Microchips 有权
标题翻译：包装微芯片中的应力减轻
公开(公告)号：US20090230521A2
公开(公告)日：2009-09-17
申请号：US11770369
申请日：2007-06-28
申请人： Xin Zhang , Michael Judy , Kevin Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人： Xin Zhang , Michael Judy , Kevin Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.
摘要翻译：封装的微芯片具有引线框架，其中芯片直接接触引线框架的至少一个连续部分。引线框架的一部分具有形成凹部并与模具接触的顶表面。封装的微芯片还具有基本上封装引线框架部分顶表面的一部分的模制材料。

6. 发明申请

US20100013067A9 Stress Mitigation in Packaged Microchips 有权
标题翻译：包装微芯片中的应力减轻
公开(公告)号：US20100013067A9
公开(公告)日：2010-01-21
申请号：US11770369
申请日：2007-06-28
申请人： Xin Zhang , Michael Judy , Kevin H.L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人： Xin Zhang , Michael Judy , Kevin H.L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
摘要翻译：包装装置具有与盖连接以形成引线框封装的底座。包装具有第一和第二外表面，其具有相应的第一和第二接触图案。第一和第二接触图案基本上是电气相同的，以允许包装件垂直或水平地安装到下面的设备。

7. 发明授权

US07246698B2 Endless conveyor belt and splicing member for forming same 有权
标题翻译：无缝输送带和拼接件用于成型
公开(公告)号：US07246698B2
公开(公告)日：2007-07-24
申请号：US11135273
申请日：2005-05-24
申请人： Glenn Peter Farrell
发明人： Glenn Peter Farrell
IPC分类号： B65G15/54
CPC分类号： B65G15/54
摘要： A conveyor belt including a plurality of interconnected wire segments forming a conveying surface to convey at least one article from one point to another. The conveying surface has first and second outermost edges. Preferably, each of the plurality of wire segments has open end regions permitting interlocking of adjacent wire elements without subsequent forming or reforming of the end regions. The outermost edges of the conveyor belt are formed to reduce the likelihood of snagging and/or injury.
摘要翻译：传送带，其包括多个互连的线段，其形成传送表面以将至少一个物品从一个点传送到另一个点。输送表面具有第一和第二最外边缘。优选地，多个线段中的每一个具有允许相邻线元件互锁的开放端区域，而不后续的端部区域的形成或改造。形成输送带的最外边缘，以减少阻碍和/或损伤的可能性。

8. 发明申请

US20050114039A1 Interruption of batch processing for high priority processing 审中-公开
标题翻译：批处理中断高优先级处理
公开(公告)号：US20050114039A1
公开(公告)日：2005-05-26
申请号：US10993190
申请日：2004-11-19
申请人： Craig Kennedy , Thomas Fister , Telford Berkey , Daniel Corwin-Renner , Peter Farrell
发明人： Craig Kennedy , Thomas Fister , Telford Berkey , Daniel Corwin-Renner , Peter Farrell
IPC分类号： G06F15/00 , G06F19/00 , G06K1/00
CPC分类号： G06F9/4818 , G06F9/485 , G16H40/63
摘要： Computer-aided detection (CAD) systems are now commonly used in both screening and diagnostic mammography. As the number of cases processed by CAD systems increase, new functionality must be added to provide efficient processing. This invention provides the capability to interrupt a batch processing run allowing a high priority case to be processed before the expected completion of the batch run. Upon completion of the high priority case, the batch processing continues from the point of interruption with minimal user intervention.
摘要翻译：计算机辅助检测（CAD）系统现在被普遍用于筛查和诊断乳腺X线照相术。随着CAD系统处理的案例数量的增加，必须添加新的功能以提供有效的处理。本发明提供了中断批处理运行的能力，允许在批次运行的预期完成之前处理高优先级的情况。完成高优先级的情况后，批处理从中断点继续，用户干预最少。

9. 发明申请

US20050035446A1 Packaged microchip with premolded-type package 有权
标题翻译：封装式微芯片采用预制型封装
公开(公告)号：US20050035446A1
公开(公告)日：2005-02-17
申请号：US10952424
申请日：2004-09-28
申请人： Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton , Lewis Long
发明人： Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton , Lewis Long
IPC分类号： B81B7/00 , H01L23/06
CPC分类号： B81B7/0048 , H01L2224/32014 , H01L2924/1461 , H01L2924/16195 , H01L2924/00
摘要： A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.
摘要翻译： MEMS惯性传感器固定在至少部分由低透湿成型材料形成的预成型包装中。因此，这种运动检测器应该能够比使用陶瓷封装的那些更经济地生产。为了达到这些目的，包装件具有从引线框架延伸以形成空腔的至少一个壁（具有低的透湿性），并且在该空腔内具有隔离器（具有顶部表面）。 MEMS惯性传感器具有悬挂在具有底表面的基底上方的可移动结构。衬底底表面在接触区域处固定到隔离器顶表面。在说明性实施例中，接触面积小于衬底的底表面的表面积。因此，隔离器在底部基板表面的至少一部分和封装之间形成空间。因此，这个空间没有隔离器。此外，由于封装的透湿性低，可以避免进一步的生产步骤，同时确保水分不会对空腔内的MEMS惯性传感器产生不利影响。

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