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    • 2. 发明授权
    • EEPROM cell
    • EEPROM单元
    • US08383475B2
    • 2013-02-26
    • US12888431
    • 2010-09-23
    • Sung Mun JungKian Hong LimJianbo YangSwee Tuck WooSanford Chu
    • Sung Mun JungKian Hong LimJianbo YangSwee Tuck WooSanford Chu
    • H01L21/8238
    • H01L21/28273H01L27/11521H01L27/11524H01L29/66825H01L29/7881
    • A method of forming a device is disclosed. The method includes providing a substrate prepared with a cell area separated by other active areas by isolation regions. First and second gates of first and second transistors in the cell area are formed. The first gate includes first and second sub-gates separated by a first intergate dielectric layer. The second gate includes a second sub-gate surrounding a first sub-gate. The first and second sub-gates of the second gate are separated by a second intergate dielectric layer. First and second junctions of the first and second transistors are formed. The method also includes forming a first gate terminal coupled to the second sub-gate of the first transistor and a second gate terminal coupled to at least the first sub-gate of the second transistor.
    • 公开了一种形成装置的方法。 该方法包括提供制备有由其它活性区域隔离的细胞区域的基底。 在单元区域中形成第一和第二晶体管的第一和第二栅极。 第一栅极包括由第一隔间栅极介电层隔开的第一和第二子栅极。 第二栅极包括围绕第一子栅极的第二子栅极。 第二栅极的第一和第二子栅极由第二栅极间介电层分开。 形成第一和第二晶体管的第一和第二结。 该方法还包括形成耦合到第一晶体管的第二子栅极的第一栅极端子和耦合到第二晶体管的至少第一子栅极的第二栅极端子。
    • 3. 发明授权
    • EEPROM cell
    • EEPROM单元
    • US08383476B2
    • 2013-02-26
    • US12888437
    • 2010-09-23
    • Sung Mun JungKian Hong LimJianbo YangSwee Tuck WooSanford Chu
    • Sung Mun JungKian Hong LimJianbo YangSwee Tuck WooSanford Chu
    • H01L21/8238
    • H01L29/7881G11C16/0433H01L21/28273H01L27/11521H01L27/11524H01L29/66825
    • A method of forming a device is disclosed. The method includes providing a substrate prepared with a cell area and forming first and second gates of first and second transistors in the cell area. The first gate includes a second sub-gate surrounding a first sub-gate. The first and second sub-gates of the first gate are separated by a first intergate dielectric layer. The second gate includes a second sub-gate surrounding a first sub-gate. The first and second sub-gates of the second gate are separated by a second intergate dielectric layer. The method also includes forming first and second junctions of the first and second transistors. A first gate terminal is formed and coupled to the second sub-gate of the first transistor. A second gate terminal is formed and coupled to at least the first sub-gate of the second transistor.
    • 公开了一种形成装置的方法。 该方法包括提供准备有单元区域的基板,并在单元区域中形成第一和第二晶体管的第一和第二栅极。 第一栅极包括围绕第一子栅极的第二子栅极。 第一栅极的第一和第二子栅极由第一栅极介电层分开。 第二栅极包括围绕第一子栅极的第二子栅极。 第二栅极的第一和第二子栅极由第二栅极间介电层分开。 该方法还包括形成第一和第二晶体管的第一和第二结。 第一栅极端子形成并耦合到第一晶体管的第二子栅极。 第二栅极端子形成并耦合到至少第二晶体管的第一子栅极。
    • 8. 发明授权
    • Non-volatile memory device and fabricating method thereof
    • 非易失性存储器件及其制造方法
    • US07439603B2
    • 2008-10-21
    • US11701484
    • 2007-02-02
    • Sung Mun JungJum Soo Kim
    • Sung Mun JungJum Soo Kim
    • H01L23/58
    • H01L27/11568H01L27/115H01L29/66833H01L29/792
    • The present invention provides a non-volatile memory device and fabricating method thereof, by which a cell size can be lowered despite high degree of cell integration and by which the device fabrication is facilitated. The present invention includes at least two trench isolation layers arranged in a device isolation area of a semiconductor substrate, each having a first depth, a first conductive type well arranged between the at least two trench isolation layers to have a second depth smaller than the first depth, a second conductive type source region and a second conductive type drain region arranged in a prescribed upper part of the first conductive type well to be separated from each other by a channel region in-between, an ONO layer on the channel region of the semiconductor substrate, the ONO layer comprising a lower oxide layer, a nitride layer, and an upper oxide layer, and a wordline conductor layer on the ONO layer.
    • 本发明提供了一种非易失性存储器件及其制造方法,通过该非易失性存储器件可以降低电池尺寸,尽管电池集成度高,并且器件制造方便。 本发明包括布置在半导体衬底的器件隔离区域中的至少两个沟槽隔离层,每个具有第一深度,第一导电类型阱布置在所述至少两个沟槽隔离层之间,以具有小于第一深度的第二深度 第二导电型源极区域和第二导电型漏极区域,布置在第一导电类型阱的规定的上部中,通过其间的沟道区域彼此分离,在该沟道区域上的ONO层 半导体衬底,ONO层包括低氧化物层,氮化物层和上部氧化物层,以及ONO层上的字线导体层。
    • 10. 发明授权
    • Non-volatile memory device and fabricating method thereof
    • 非易失性存储器件及其制造方法
    • US07183155B2
    • 2007-02-27
    • US11019299
    • 2004-12-23
    • Sung Mun JungJum Soo Kim
    • Sung Mun JungJum Soo Kim
    • H01L21/8238
    • H01L27/11568H01L27/115H01L29/66833H01L29/792
    • The present invention provides a non-volatile memory device and fabricating method thereof, by which a cell size can be lowered despite high degree of cell integration and by which the device fabrication is facilitated. The present invention includes at least two trench isolation layers arranged in a device isolation area of a semiconductor substrate, each having a first depth, a first conductive type well arranged between the at least two trench isolation layers to have a second depth smaller than the first depth, a second conductive type source region and a second conductive type drain region arranged in a prescribed upper part of the first conductive type well to be separated from each other by a channel region in-between, an ONO layer on the channel region of the semiconductor substrate, the ONO layer comprising a lower oxide layer, a nitride layer, and an upper oxide layer, and a wordline conductor layer on the ONO layer.
    • 本发明提供了一种非易失性存储器件及其制造方法,通过该非易失性存储器件可以降低电池尺寸,尽管电池集成度高,并且器件制造方便。 本发明包括布置在半导体衬底的器件隔离区域中的至少两个沟槽隔离层,每个具有第一深度,第一导电类型阱布置在所述至少两个沟槽隔离层之间,以具有小于第一深度的第二深度 第二导电型源极区域和第二导电型漏极区域,布置在第一导电类型阱的规定的上部中,通过其间的沟道区域彼此分离,在该沟道区域上的ONO层 半导体衬底,ONO层包括低氧化物层,氮化物层和上部氧化物层,以及ONO层上的字线导体层。