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1. 发明申请

US20050067663A1 Oxide-nitride stack gate dielectric 有权
标题翻译：氧化氮化物堆叠栅极电介质
公开(公告)号：US20050067663A1
公开(公告)日：2005-03-31
申请号：US10950332
申请日：2004-09-24
申请人： Krishnaswamy Ramkumar , Sundar Narayanan
发明人： Krishnaswamy Ramkumar , Sundar Narayanan
IPC分类号： H01L21/28 , H01L21/314 , H01L29/49 , H01L29/78 , H01L21/20
CPC分类号： H01L21/022 , H01L21/0217 , H01L21/02233 , H01L21/02337 , H01L21/28044 , H01L21/3144 , H01L29/4941 , H01L29/78
摘要： A method of making a semiconductor structure comprises forming an oxide layer on a substrate; forming a silicon nitride layer on the oxide layer; annealing the layers in NO; and annealing the layers in ammonia. The equivalent oxide thickness of the oxide layer and the silicon nitride layer together is at most 25 Angstroms.
摘要翻译：制造半导体结构的方法包括在衬底上形成氧化物层; 在氧化物层上形成氮化硅层; 在NO中退火层; 并在氨中退火层。氧化物层和氮化硅层的等效氧化物厚度在一起为至多25埃。

2. 发明授权

US06803321B1 Nitride spacer formation 有权
标题翻译：氮化物间隔物形成
公开(公告)号：US06803321B1
公开(公告)日：2004-10-12
申请号：US10313049
申请日：2002-12-06
申请人： Alain Blosse , Krishnaswamy Ramkumar , Sundar Narayanan
发明人： Alain Blosse , Krishnaswamy Ramkumar , Sundar Narayanan
IPC分类号： H01I21302
CPC分类号： H01L21/76897 , H01L21/28247 , H01L21/31116 , H01L21/3185
摘要： A method of forming a semiconductor structure comprises forming a nitride layer on a stack, and etching the nitride layer to form spacers in contact with sides of the stack. The stack is on a semiconductor substrate, the stack comprises (i) a gate layer, comprising silicon, (ii) a metallic layer, on the gate layer, and (iii) an etch-stop layer, on the metallic layer. The forming is by CVD with a gas comprising SixL2x, L is an amino group, and X is 1 or 2.
摘要翻译：形成半导体结构的方法包括在叠层上形成氮化物层，并蚀刻氮化物层以形成与堆叠的侧面接触的间隔物。叠层在半导体衬底上，堆叠包括（i）栅极层，包括硅，（ii）栅极层上的金属层，和（iii）金属层上的蚀刻停止层。通过CVD形成气体，其中包含SixL2x的气体，L是氨基，X是1或2。

3. 发明授权

US06773975B1 Formation of a shallow trench isolation structure in integrated circuits 有权
标题翻译：在集成电路中形成浅沟槽隔离结构
公开(公告)号：US06773975B1
公开(公告)日：2004-08-10
申请号：US10326707
申请日：2002-12-20
申请人： Krishnaswamy Ramkumar , Sundar Narayanan , Shahin Sharifzadeh
发明人： Krishnaswamy Ramkumar , Sundar Narayanan , Shahin Sharifzadeh
IPC分类号： H01L218238
CPC分类号： H01L21/823481 , H01L21/76229
摘要： In one embodiment, a transistor is fabricated by forming gate materials, such as a gate oxide layer and a gate polysilicon layer, prior to forming a shallow trench isolation (STI) structure. Forming the gate materials early in the process minimizes exposure of the STI structure to processing steps that may expose its corners. Also, to minimize cross-diffusion of dopants and to help lower gate resistance, a metal stack comprising a barrier layer and a metal layer may be employed as a conductive line between gates. In one embodiment, the metal stack comprises a barrier layer of tungsten-nitride and a metal layer of tungsten.
摘要翻译：在一个实施例中，在形成浅沟槽隔离（STI）结构之前，通过形成栅极材料，例如栅极氧化物层和栅极多晶硅层来制造晶体管。在此过程早期形成栅极材料可最大限度地减少STI结构暴露其角落的处理步骤。此外，为了最小化掺杂剂的交叉扩散并有助于降低栅极电阻，可以使用包括阻挡层和金属层的金属堆叠作为栅极之间的导电线。在一个实施例中，金属堆叠包括氮化钨的阻挡层和钨的金属层。

4. 发明授权

US06774012B1 Furnace system and method for selectively oxidizing a sidewall surface of a gate conductor by oxidizing a silicon sidewall in lieu of a refractory metal sidewall 有权
$Furnace system and method for selectively oxidizing a sidewall surface of a gate conductor by oxidizing a silicon sidewall in lieu of a refractory metal sidewall$
标题翻译：炉系统和方法，用于通过氧化硅侧壁代替难熔金属侧壁来选择性地氧化栅极导体的侧壁表面
公开(公告)号：US06774012B1
公开(公告)日：2004-08-10
申请号：US10290841
申请日：2002-11-08
申请人： Sundar Narayanan
发明人： Sundar Narayanan
IPC分类号： H01L21322
CPC分类号： H01L21/67109 , H01L21/28247
摘要： An improved furnace system and method is provided to substantially minimize, if not eliminate, ambient air from entering a heated chamber of the furnace system during a critical processing step. The furnace system can be used in, for example, an oxidation step where ambient air containing oxygen is prevented from entering an atmospheric pressure tube by essentially purging potential leak areas with an inert gas, such as nitrogen, at the critical moment during temperature ramp up and ramp down, and prior to temperature stabilization and the introduction of an oxidizing gas. If oxygen is not present within the tube, then a tungsten sidewall surface of a gate conductor, for example, will not inadvertently oxidize at the critical pre- and post-oxidation moments. However, if steam is present where hydrogen is available with oxygen, the underlying polysilicon sidewall surface will selectively oxidize instead of the overlying tungsten. The inert gas-filled containers are retrofitted to potential leak areas of not only the tube, but also a torch that is used to forward heated gas into the tube.
摘要翻译：提供了一种改进的炉系统和方法，以在临界处理步骤中大致最小化（如果不消除）环境空气进入炉系统的加热室。炉系统可用于例如氧化步骤，其中通过在温度升高期间的关键时刻基本上用惰性气体（例如氮气）清除潜在的泄漏区域，防止含有氧的环境空气进入大气压力管并降温，并在温度稳定和引入氧化气体之前。如果管内不存在氧气，则栅极导体的钨侧壁表面例如在临界氧化前和氧化后的时刻不会无意中氧化。然而，如果存在氢气可用于氧气的蒸汽，则下游的多晶硅侧壁表面将选择性地氧化而不是上覆的钨。惰性气体填充的容器不仅被改装到潜在的泄漏区域，而且还被用于将加热气体送入管中的火炬。

5. 发明申请

US20080093680A1 OXIDE-NITRIDE STACK GATE DIELECTRIC 有权
标题翻译：氧化物 - 氮化物堆积电介质
公开(公告)号：US20080093680A1
公开(公告)日：2008-04-24
申请号：US11961750
申请日：2007-12-20
申请人： Krishnaswamy Ramkumar , Sundar Narayanan
发明人： Krishnaswamy Ramkumar , Sundar Narayanan
IPC分类号： H01L29/78 , H01L21/31
CPC分类号： H01L21/022 , H01L21/0217 , H01L21/02233 , H01L21/02337 , H01L21/28044 , H01L21/3144 , H01L29/4941 , H01L29/78
摘要： A method of making a semiconductor structure comprises forming an oxide layer on a substrate; forming a silicon nitride layer on the oxide layer; annealing the layers in NO; and annealing the layers in ammonia. The equivalent oxide thickness of the oxide layer and the silicon nitride layer together is at most 25 Angstroms.
摘要翻译：制造半导体结构的方法包括在衬底上形成氧化物层; 在氧化物层上形成氮化硅层; 在NO中退火层; 并在氨中退火层。氧化物层和氮化硅层的等效氧化物厚度在一起为至多25埃。

6. 发明授权

US07189652B1 Selective oxidation of gate stack 有权
标题翻译：选择性氧化栅极叠层
公开(公告)号：US07189652B1
公开(公告)日：2007-03-13
申请号：US10313048
申请日：2002-12-06
申请人： Alain Blosse , Sundar Narayanan , Krishnaswamy Ramkumar
发明人： Alain Blosse , Sundar Narayanan , Krishnaswamy Ramkumar
IPC分类号： H01L21/302
CPC分类号： H01L21/28247 , H01L21/28061
摘要： A method of forming a semiconductor structure comprises oxidizing a stack, to form sidewall oxide in contact with sides of the stack. The stack is on a semiconductor substrate, the stack includes a gate layer, comprising silicon; a metallic layer, on the gate layer; and an etch-stop layer, on the metallic layer. The sidewall oxide in contact with the metallic layer is thinner than the sidewall oxide in contact with the gate layer.
摘要翻译：形成半导体结构的方法包括氧化堆叠，以形成与堆叠的侧面接触的侧壁氧化物。堆叠在半导体衬底上，堆叠包括包含硅的栅极层; 栅极层上的金属层; 和金属层上的蚀刻停止层。与金属层接触的侧壁氧化物比与栅极层接触的侧壁氧化物薄。

7. 发明授权

US07094707B1 Method of forming nitrided oxide in a hot wall single wafer furnace 有权
标题翻译：在热壁单晶圆炉中形成氮化氧化物的方法
公开(公告)号：US07094707B1
公开(公告)日：2006-08-22
申请号：US10142963
申请日：2002-05-13
申请人： Krishnaswamy Ramkumar , Sundar Narayanan
发明人： Krishnaswamy Ramkumar , Sundar Narayanan
IPC分类号： H01L23/58
CPC分类号： H01L21/28202 , H01L21/28035 , H01L29/518
摘要： A method of nitriding a gate oxide layer by annealing a preformed oxide layer with nitric oxide (NO) gas in a hot wall, single wafer furnace is provided. The nitridation process can be carried out rapidly (i.e., at nitridation times of 30 seconds to 2 minutes) while providing acceptable levels of nitridation (i.e., up to 6 at. %) and desirable nitrogen/depth profiles. The nitrided gate oxide layer can optionally be reoxidized in a second oxidation step after the nitridation step. A gate electrode layer (e.g., boron doped polysilicon) can then be deposited on top of the nitrided gate oxide layer or on top of the reoxidized and nitrided gate oxide layer.
摘要翻译：提供了一种通过在热壁中的一氧化氮（NO）气体退火预形成的氧化物层来对栅极氧化物层进行氮化的方法。氮化处理可以快速进行（即，在30秒至2分钟的氮化时间），同时提供可接受的氮化水平（即高达6原子％）和所需的氮/深度分布。氮化栅氧化层可以在氮化步骤后的第二氧化步骤中任选地再氧化。然后可以在氮化栅极氧化物层的顶部上或在再氧化和氮化的栅极氧化物层的顶部上沉积栅极电极层（例如，硼掺杂的多晶硅）。

8. 发明授权

US06943126B1 Deuterium incorporated nitride 有权
标题翻译：氘掺杂氮化物
公开(公告)号：US06943126B1
公开(公告)日：2005-09-13
申请号：US10314381
申请日：2002-12-06
申请人： Sundar Narayanan , Krishnaswamy Ramkumar
发明人： Sundar Narayanan , Krishnaswamy Ramkumar
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L21/0217 , H01L21/02063 , H01L21/02071 , H01L21/02219 , H01L21/02271 , H01L21/28176 , H01L21/31116 , H01L21/31138 , H01L21/32139 , H01L21/76834 , H01L29/518
摘要： A method of forming a semiconductor structure comprises forming an etch-stop layer comprising nitride, on a stack. The stack is on a semiconductor substrate, and the stack comprises (i) a gate layer. The forming is by CVD with a gas comprising a first compound which is SixL2x, and a second compound comprising nitrogen and deuterium, L is an amino group, and X is 1 or 2.
摘要翻译：形成半导体结构的方法包括在叠层上形成包含氮化物的蚀刻停止层。堆叠在半导体衬底上，堆叠包括（i）栅极层。通过CVD形成是用包含第二化合物的气体，该第一化合物是Si x L 2 x X 2，以及包含氮和氘的第二化合物，L是氨基，X是是1或2。

9. 发明授权

US06794269B1 Method for and structure formed from fabricating a relatively deep isolation structure 有权
标题翻译：通过制造相对较深的隔离结构形成的方法和结构
公开(公告)号：US06794269B1
公开(公告)日：2004-09-21
申请号：US10324989
申请日：2002-12-20
申请人： Prabhuram Gopalan , Biju Parameshwaran , Krishnaswamy Ramkumar , Hanna Bamnolker , Sundar Narayanan
发明人： Prabhuram Gopalan , Biju Parameshwaran , Krishnaswamy Ramkumar , Hanna Bamnolker , Sundar Narayanan
IPC分类号： H01L2176
CPC分类号： H01L21/763 , H01L21/76202
摘要： A method is provided which includes forming a deep isolation structure within a semiconductor topography. In some cases, the method may include forming a first isolation structure within a semiconductor layer and etching an opening within the isolation structure to expose the semiconductor layer. In addition, the method may include etching the semiconductor layer to form a trench extending through the isolation structure and at least part of the semiconductor layer. In some cases, the method may include removing part of a first fill layer deposited within the trench such that an upper surface of the fill layer is below an upper portion of the trench. In such an embodiment, the vacant portion of the trench may be filled with a second fill layer. In yet other embodiments, the method may include planarizing the first fill layer within the trench and subsequently oxidizing an upper portion of the fill layer.
摘要翻译：提供了一种方法，其包括在半导体形貌内形成深度隔离结构。在一些情况下，该方法可以包括在半导体层内形成第一隔离结构并蚀刻隔离结构内的开口以暴露半导体层。此外，该方法可以包括蚀刻半导体层以形成延伸穿过隔离结构和半导体层的至少一部分的沟槽。在一些情况下，该方法可以包括去除沉积在沟槽内的第一填充层的部分，使得填充层的上表面在沟槽的上部下方。在这样的实施例中，沟槽的空缺部分可以填充第二填充层。在其他实施例中，该方法可以包括平坦化沟槽内的第一填充层，随后氧化填充层的上部。

10. 发明授权

US07371637B2 Oxide-nitride stack gate dielectric 有权
标题翻译：氧化氮化物堆叠栅极电介质
公开(公告)号：US07371637B2
公开(公告)日：2008-05-13
申请号：US10950332
申请日：2004-09-24
申请人： Krishnaswamy Ramkumar , Sundar Narayanan
发明人： Krishnaswamy Ramkumar , Sundar Narayanan
IPC分类号： H01L21/20
CPC分类号： H01L21/022 , H01L21/0217 , H01L21/02233 , H01L21/02337 , H01L21/28044 , H01L21/3144 , H01L29/4941 , H01L29/78
摘要： A method of making a semiconductor structure comprises forming an oxide layer on a substrate; forming a silicon nitride layer on the oxide layer; annealing the layers in NO; and annealing the layers in ammonia. The equivalent oxide thickness of the oxide layer and the silicon nitride layer together is at most 25 Angstroms.
摘要翻译：制造半导体结构的方法包括在衬底上形成氧化物层; 在氧化物层上形成氮化硅层; 在NO中退火层; 并在氨中退火层。氧化物层和氮化硅层的等效氧化物厚度在一起为至多25埃。

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