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    • 2. 发明申请
    • Plasma-Generating Structures, Display Devices, and Methods of Forming Plasma-Generating Structures
    • 等离子体发生结构,显示装置和形成等离子体发生结构的方法
    • US20120001539A1
    • 2012-01-05
    • US13231806
    • 2011-09-13
    • Neal RuegerStephen J. Kramer
    • Neal RuegerStephen J. Kramer
    • H01J17/49H01J9/02H01J61/09
    • H01J9/02H01J11/10H01J37/32596H05H1/2406H05H1/46H05H2001/466
    • Some embodiments include methods of forming plasma-generating microstructures. Aluminum may be anodized to form an aluminum oxide body having a plurality of openings extending therethrough. Conductive liners may be formed within the openings, and circuitry may be formed to control current flow through the conductive liners. The conductive liners form a plurality of hollow cathodes, and the current flow is configured to generate and maintain plasmas within the hollow cathodes. The plasmas within various hollow cathodes, or sets of hollow cathodes, may be independently controlled. Such independently controlled plasmas may be utilized to create a pattern in a display, or on a substrate. In some embodiments, the plasmas may be utilized for plasma-assisted etching and/or plasma-assisted deposition. Some embodiments include constructions and assemblies containing multiple plasma-generating structures.
    • 一些实施例包括形成等离子体产生微结构的方法。 铝可以被阳极化以形成具有延伸穿过其中的多个开口的氧化铝体。 可以在开口内形成导电衬里,并且可以形成电路以控制通过导电衬套的电流。 导电衬里形成多个中空阴极,并且电流流动被配置为在中空阴极内产生和维持等离子体。 各种空心阴极内的等离子体或一组空心阴极可以独立控制。 这种独立控制的等离子体可用于在显示器或基板上产生图案。 在一些实施例中,等离子体可用于等离子体辅助蚀刻和/或等离子体辅助沉积。 一些实施例包括包含多个等离子体产生结构的构造和组件。
    • 3. 发明申请
    • Methods Of Forming Plasma-Generating Structures; Methods Of Plasma-Assisted Etching, And Methods Of Plasma-Assisted Deposition
    • 形成等离子体发生结构的方法; 等离子体辅助蚀刻的方法和等离子体辅助沉积的方法
    • US20100102031A1
    • 2010-04-29
    • US12633674
    • 2009-12-08
    • Neal RuegerStephen J. Kramer
    • Neal RuegerStephen J. Kramer
    • H01L21/3065H05H1/24H01L21/3205
    • H01J9/02H01J11/10H01J37/32596H05H1/2406H05H1/46H05H2001/466
    • Some embodiments include methods of forming plasma-generating microstructures. Aluminum may be anodized to form an aluminum oxide body having a plurality of openings extending therethrough. Conductive liners may be formed within the openings, and circuitry may be formed to control current flow through the conductive liners. The conductive liners form a plurality of hollow cathodes, and the current flow is configured to generate and maintain plasmas within the hollow cathodes. The plasmas within various hollow cathodes, or sets of hollow cathodes, may be independently controlled. Such independently controlled plasmas may be utilized to create a pattern in a display, or on a substrate. In some embodiments, the plasmas may be utilized for plasma-assisted etching and/or plasma-assisted deposition. Some embodiments include constructions and assemblies containing multiple plasma-generating structures.
    • 一些实施例包括形成等离子体产生微结构的方法。 铝可以被阳极化以形成具有延伸穿过其中的多个开口的氧化铝体。 可以在开口内形成导电衬里,并且可以形成电路以控制通过导电衬套的电流。 导电衬里形成多个中空阴极,并且电流流动被配置为在中空阴极内产生和维持等离子体。 各种空心阴极内的等离子体或一组空心阴极可以独立控制。 这种独立控制的等离子体可用于在显示器或基板上产生图案。 在一些实施例中,等离子体可用于等离子体辅助蚀刻和/或等离子体辅助沉积。 一些实施例包括包含多个等离子体产生结构的构造和组件。
    • 5. 发明授权
    • Process for enhancing solubility and reaction rates in supercritical fluids
    • 提高超临界流体溶解度和反应速率的方法
    • US07598181B2
    • 2009-10-06
    • US11184202
    • 2005-07-19
    • Theodore M. TaylorStephen J. Kramer
    • Theodore M. TaylorStephen J. Kramer
    • H01L21/302
    • H01L21/30604C23C18/00H01L21/02101H01L21/288
    • Processes for enhancing solubility and the reaction rates in supercritical fluids are provided. In preferred embodiments, such processes provide for the uniform and precise deposition of metal-containing films on semiconductor substrates as well as the uniform and precise removal of materials from such substrates. In one embodiment, the process includes, providing a supercritical fluid containing at least one reactant, the supercritical fluid being maintained at above its critical point, exposing at least a portion of the surface of the semiconductor substrate to the supercritical fluid, applying acoustic energy, and reacting the at least one reactant to cause a change in at least a portion of the surface of the semiconductor substrate.
    • 提供了提高超临界流体溶解度和反应速率的方法。 在优选的实施方案中,这样的方法提供了均匀且精确地沉积半导体衬底上的含金属膜以及从这种衬底均匀且精确地去除材料。 在一个实施方案中,该方法包括提供含有至少一种反应物的超临界流体,超临界流体保持在其临界点以上,将半导体衬底的至少一部分表面暴露于超临界流体,施加声能, 并使所述至少一种反应物反应以引起半导体衬底的至少一部分表面的变化。
    • 6. 发明授权
    • Apparatus for conditioning chemical-mechanical polishing pads
    • 化学机械抛光垫调理装置
    • US07563157B2
    • 2009-07-21
    • US11454501
    • 2006-06-16
    • Stephen J. Kramer
    • Stephen J. Kramer
    • B24B21/00
    • B24B53/017B24B53/013B24B53/12
    • An apparatus for conditioning a polishing pad, or conditioner, includes a supporting substrate and abrasive elements. The abrasive elements of the conditioner are used to condition a polishing pad to be used in abrasive, or at least partially mechanical, semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.
    • 用于调理抛光垫或调理剂的设备包括支撑基底和研磨元件。 调理剂的研磨元件用于调节用于磨料或至少部分机械的半导体衬底处理工艺(例如化学机械抛光或化学机械平面化工艺)中使用的抛光垫。 研磨元件由可被至少一种不会使抛光垫的材料降解或溶解的化学物质降解或溶解的材料形成。 通过将抛光垫暴露于至少一种化学物质中,使残留物或颗粒残留物或颗粒从粘附或嵌入抛光垫中的残留物或颗粒中除去,从而使残留物或颗粒不会降解或溶解, 溶解抛光垫的材料。
    • 7. 发明授权
    • Methods of forming pluralities of capacitors
    • 形成多个电容器的方法
    • US07393741B2
    • 2008-07-01
    • US11704512
    • 2007-02-09
    • Gurtej S. SandhuH. Montgomery ManningStephen J. Kramer
    • Gurtej S. SandhuH. Montgomery ManningStephen J. Kramer
    • H01L21/8242
    • H01L28/91H01L27/10817H01L27/10852
    • The invention comprises methods of forming pluralities of capacitors. In one implementation, metal is formed over individual capacitor storage node locations on a substrate. A patterned masking layer is formed over the metal. The patterned masking layer comprises openings therethrough to an outer surface of the metal. Individual of the openings are received over individual of the capacitor storage node locations. A pit is formed in the metal outer surface within individual of the openings. After forming the pits, the metal is anodically oxidized through the openings effective to form a single metal oxide-lined channel in individual of the openings over the individual capacitor storage nodes. Individual capacitor electrodes are formed within the channels in electrical connection with the individual capacitor storage node locations. At least some of the metal oxide is removed from the substrate, and the individual capacitor electrodes are incorporated into a plurality of capacitors. Other aspects and implementations are contemplated.
    • 本发明包括形成多个电容器的方法。 在一个实施方案中,在衬底上的各个电容器存储节点上形成金属。 在金属上形成图案化掩模层。 图案化掩模层包括通过其穿过金属外表面的开口。 各个开口的单独的电容器存储节点位置被接收。 在各开口内的金属外表面上形成凹坑。 在形成凹坑之后,金属通过开口阳极氧化,有效地在各个电容器存储节点上的开口中形成单个金属氧化物衬里的通道。 单独的电容器电极形成在与各个电容器存储节点位置电连接的通道内。 从衬底去除至少一些金属氧化物,并且将各个电容器电极结合到多个电容器中。 考虑了其他方面和实现。