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1. 发明授权

US07826229B2 Component retention with distributed compression 有权
标题翻译：组件保留与分布式压缩
公开(公告)号：US07826229B2
公开(公告)日：2010-11-02
申请号：US11588817
申请日：2006-10-27
申请人： Stephen Daniel Cromwell , Stephan Karl Barsun
发明人： Stephen Daniel Cromwell , Stephan Karl Barsun
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34 , H01R13/62
CPC分类号： H05K7/2049 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.
摘要翻译：保持组件包括铰链式负载板，其被配置为在部件上旋转闭合并压缩预压缩弹簧，其以无工具的部件保持力将弹簧的力分布在部件上。

2. 发明申请

US20080101033A1 Component retention with distributed compression 有权
标题翻译：组件保留与分布式压缩
公开(公告)号：US20080101033A1
公开(公告)日：2008-05-01
申请号：US11588817
申请日：2006-10-27
申请人： Stephen Daniel Cromwell , Stephan Karl Barsun
发明人： Stephen Daniel Cromwell , Stephan Karl Barsun
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.
摘要翻译：保持组件包括铰链式负载板，其被配置为在部件上旋转闭合并压缩预压缩弹簧，其以无工具的部件保持力将弹簧的力分布在部件上。

3. 发明授权

US07385824B2 Processor module with rigidly coupled processor and voltage-regulator heat sinks 有权
标题翻译：具有刚性耦合处理器和电压调节器散热器的处理器模块
公开(公告)号：US07385824B2
公开(公告)日：2008-06-10
申请号：US11192736
申请日：2005-07-29
申请人： Stephan K. Barsun , Brent Allen Boudreaux , Brandon Rubenstein , Stephen Daniel Cromwell , Eric C. Peterson
发明人： Stephan K. Barsun , Brent Allen Boudreaux , Brandon Rubenstein , Stephen Daniel Cromwell , Eric C. Peterson
IPC分类号： H05K7/20
CPC分类号： H05K7/1092
摘要： A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the processor and the voltage regulator are rigidly coupled to each other to provide rigidity to the module and thus maintain the desired compression of the voltage regulator contacts.
摘要翻译：处理器模块包括处理器和安装在载体上的电压调节器。电压调节器的触点安装在压缩下，以确保与载体上的焊盘良好的电接触。分别安装在处理器上的散热片和电压调节器彼此刚性地耦合，以向模块提供刚性，从而保持电压调节器触点的期望的压缩。

4. 发明授权

US5901040A Heat sink and Faraday Cage assembly for a semiconductor module and a power converter 失效
标题翻译：散热器和法拉第笼式组件，用于半导体模块和电源转换器
公开(公告)号：US5901040A
公开(公告)日：1999-05-04
申请号：US902770
申请日：1997-07-30
申请人： Stephen Daniel Cromwell , Christian Belady
发明人： Stephen Daniel Cromwell , Christian Belady
IPC分类号： H01L23/36 , H01L23/60 , H01L25/07 , H01L25/18 , H05K7/20 , H05K9/00
CPC分类号： H01L23/427 , H01L2924/0002
摘要： The invention is a heat sink assembly for the removal of heat from semiconductor and power converter modules. The packaging design for semiconductor modules and power converter modules provides efficient heat removal and a tight Faraday Cage. There is a heat transfer layer sandwiched between a CPU module and a power converter module. The heat sink assembly includes a heat transfer layer, a fin stack, and a series of heat pipes. The heat transfer layer has a slot for passage of power cables and sense lines which connects both the CPU module and the power converter module, and the power converter module and the printed circuit board. The heat sink chamber also serves as a Faraday Cage and thus attenuates EMI from the semiconductor module, the power converter module, the power cables, and the sense lines.
摘要翻译：本发明是一种用于从半导体和功率转换器模块移除热量的散热器组件。半导体模块和电源转换器模块的封装设计提供了有效的散热和紧凑的法拉第笼。夹在CPU模块和功率转换器模块之间的传热层。散热器组件包括传热层，散热片堆叠和一系列热管。传热层具有用于连接CPU模块和功率转换器模块以及功率转换器模块和印刷电路板的电力电缆和感测线路通过的槽。散热室还用作法拉第笼，从而衰减来自半导体模块，功率转换器模块，电力电缆和感测线的EMI。

5. 发明授权

US06667885B2 Attachment of a single heat dissipation device to multiple components with vibration isolation 有权
标题翻译：将单个散热装置连接到具有隔振的多个部件上
公开(公告)号：US06667885B2
公开(公告)日：2003-12-23
申请号：US09909512
申请日：2001-07-20
申请人： Christopher Gregory Malone , Stephen Daniel Cromwell , Christian Laszlo Belady , Eric Clarence Peterson
发明人： Christopher Gregory Malone , Stephen Daniel Cromwell , Christian Laszlo Belady , Eric Clarence Peterson
IPC分类号： H05K720
CPC分类号： H01L23/427 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.
摘要翻译：一种将多个部件连接到公共散热装置的方法和装置。本发明的一个实施例涉及一种将基板上的多个部件组装到散热装置上的方法。本发明的第二实施例涉及将衬底上的多个部件组装到包含一个或多个热管的散热装置的另一种方法。本发明的第三实施例涉及一种组装的基板，其具有连接到公共散热装置的多个电气部件。

6. 发明授权

US07536781B2 Method of assembling an application specific integrated circuit (ASIC) assembly with attach hardware 有权
标题翻译：组装具有连接硬件的专用集成电路（ASIC）组件的方法
公开(公告)号：US07536781B2
公开(公告)日：2009-05-26
申请号：US10455862
申请日：2003-06-06
申请人： Stephen Daniel Cromwell
发明人： Stephen Daniel Cromwell
IPC分类号： H05K3/30
CPC分类号： H05K7/12 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , Y10T29/49126 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , H01L2924/00
摘要： A method of assembling an Application Specific Integrated Circuit (ASIC) assembly with attach hardware includes selecting a thickness of a load washer based on a target load to be applied by said attach hardware.
摘要翻译：组装具有连接硬件的专用集成电路（ASIC）组件的方法包括基于由所述附接硬件施加的目标负载来选择负载清洗器的厚度。

7. 发明授权

US07128602B1 Make first break last connection assembly 失效
标题翻译：先断开连接装配
公开(公告)号：US07128602B1
公开(公告)日：2006-10-31
申请号：US10741719
申请日：2003-12-18
申请人： Stephen Daniel Cromwell , Michael Alan Brooks
发明人： Stephen Daniel Cromwell , Michael Alan Brooks
IPC分类号： H01R13/66 , H01R13/60
CPC分类号： H01R13/2421 , Y10S439/926
摘要： A connection assembly permits a make first and break last connection for primary power. The assembly includes a first pair of connectors, a second pair of connectors, and a compliance element associated with one of the first pair of connectors. The compliance element enables the first pair of connectors to mate prior to the mating of the second pair of connectors and to enable the first pair of connectors to disengage after the disengagement of the second pair of connectors.
摘要翻译：连接组件允许第一次断开和断开连接用于主电源。组件包括第一对连接器，第二对连接器和与第一对连接器之一相关联的柔性元件。顺应元件使得第一对连接器能够在第二对连接器配合之前配合，并且使得第一对连接器能够在第二对连接器脱离之后脱离接合。

8. 发明授权

US06635513B2 Pre-curved spring bolster plate 失效
公开(公告)号：US06635513B2
公开(公告)日：2003-10-21
申请号：US09870044
申请日：2001-05-29
申请人： James David Hensley , Stephen Daniel Cromwell
发明人： James David Hensley , Stephen Daniel Cromwell
IPC分类号： H01L2144
CPC分类号： H05K7/1007 , H05K3/325
摘要： A method and apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a pre-curved bolster plate. A third embodiment of the invention involves an assembled substrate with a pre-curved bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

9. 发明授权

US07323358B1 Method and system for sizing a load plate 有权
标题翻译：装载板尺寸的方法和系统
公开(公告)号：US07323358B1
公开(公告)日：2008-01-29
申请号：US10639853
申请日：2003-08-13
申请人： Stephen Daniel Cromwell
发明人： Stephen Daniel Cromwell
IPC分类号： H01L23/02 , H01L23/12 , H01L23/34 , H01L21/00
CPC分类号： H01L23/4093 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed in the ASIC assembly.
摘要翻译：用于专用集成电路（ASIC）组件的负载板的尺寸的方法包括在安装到ASIC组件之前压缩负载板。当安装在ASIC组件中时，压缩被调整以使负载板提供目标负载。

10. 发明授权

US06430050B1 Mechanical loading of a land grid array component using a wave spring 失效
标题翻译：使用波形弹簧对地面阵列部件进行机械加载
公开(公告)号：US06430050B1
公开(公告)日：2002-08-06
申请号：US09872194
申请日：2001-05-31
申请人： James David Hensley , Stephen Daniel Cromwell , Gregory S. Meyer
发明人： James David Hensley , Stephen Daniel Cromwell , Gregory S. Meyer
IPC分类号： H05K720
CPC分类号： H01L23/40 , H01L23/4006 , H01L2023/405 , H01L2023/4081 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： A method and substrate using a wave spring to clamp a component to the substrate. One embodiment of the invention involves a method to use a wave spring to clamp a component to a substrate. The method includes placing the component on the substrate, placing a structure having holes on the component, placing a number of wave springs on a corresponding number of bolts, inserting the bolts into the holes in the structure, and attaching the bolts to the substrate. A second embodiment of the invention involves a substrate with an electrical contact area, an interposer placed on the electrical contact area, a component placed on the interposer, a block having holes placed on the component, bolts and wave springs inserted in the holes, wherein the bolts and wave springs clamp the component, the interposer and the substrate together on the electrical contact area of the substrate.
摘要翻译：使用波形弹簧将部件夹持到基板的方法和基板。本发明的一个实施例涉及使用波形弹簧来将部件夹持到基底的方法。该方法包括将部件放置在基板上，将具有孔的结构放置在部件上，将多个波形弹簧放置在相应数量的螺栓上，将螺栓插入结构中的孔中，并将螺栓附接到基板。本发明的第二个实施例涉及具有电接触面积的基板，放置在电接触区域上的插入件，放置在插入件上的部件，插入在部件上的孔，插入孔中的螺栓和波形弹簧的块，其中螺栓和波形弹簧将部件，插入器和基板一起夹在基板的电接触区域上。

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