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1. 发明授权

US07866959B2 Fan clutch for an electronics cooling fan 有权
标题翻译：用于电子冷却风扇的风扇离合器
公开(公告)号：US07866959B2
公开(公告)日：2011-01-11
申请号：US11042917
申请日：2005-01-24
申请人： Stephan Karl Barsun , Edward Anglada , James David Hensley
发明人： Stephan Karl Barsun , Edward Anglada , James David Hensley
IPC分类号： F04B35/04
CPC分类号： H05K7/2019 , F04D25/02 , F04D25/0613 , F04D27/008
摘要： An electronic system, an apparatus for cooling an electronic system, an electronics cooling apparatus, and associated method use a clutch to operate a cooling fan. An electronics cooling fan for usage in cooling an electronic system comprises a clutch that disengages upon failure wherein the electronics cooling fan is configured to freewheel upon disengagement of the clutch.
摘要翻译：电子系统，用于冷却电子系统的装置，电子冷却装置和相关联的方法使用离合器来操作冷却风扇。用于冷却电子系统的电子冷却风扇包括离合器，其在故障时脱离，其中电子冷却风扇构造成在离合器脱离时空转。

2. 发明授权

US06711811B2 Method to assemble a uniform force hydrostatic bolster plate 失效
标题翻译：组装均匀力静压垫板的方法
公开(公告)号：US06711811B2
公开(公告)日：2004-03-30
申请号：US09883707
申请日：2001-06-18
申请人： James David Hensley , Michael Alan Brooks
发明人： James David Hensley , Michael Alan Brooks
IPC分类号： H05K330
CPC分类号： H05K7/1061 , H05K3/325 , Y10T29/49126 , Y10T29/4913 , Y10T29/49137
摘要： A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate.
摘要翻译：将均匀的力静压垫板安装到基底上的方法和装置。本发明的一个实施例涉及在衬底上组装均匀的压力静压垫板的方法。

3. 发明授权

US06635513B2 Pre-curved spring bolster plate 失效
公开(公告)号：US06635513B2
公开(公告)日：2003-10-21
申请号：US09870044
申请日：2001-05-29
申请人： James David Hensley , Stephen Daniel Cromwell
发明人： James David Hensley , Stephen Daniel Cromwell
IPC分类号： H01L2144
CPC分类号： H05K7/1007 , H05K3/325
摘要： A method and apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a pre-curved bolster plate. A third embodiment of the invention involves an assembled substrate with a pre-curved bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

4. 发明授权

US07348495B2 Uniform force hydrostatic bolster plate 有权
标题翻译：均匀力静液压板
公开(公告)号：US07348495B2
公开(公告)日：2008-03-25
申请号：US10773723
申请日：2004-02-05
申请人： James David Hensley , Michael Alan Brooks
发明人： James David Hensley , Michael Alan Brooks
IPC分类号： H05K1/16
CPC分类号： H05K7/1061 , H05K3/325 , Y10T29/49126 , Y10T29/4913 , Y10T29/49137
摘要： A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a uniform force hydrostatic bolster plate. A third embodiment of the invention involves an assembled substrate with a uniform force hydrostatic bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.
摘要翻译：将均匀的力静压垫板安装到基底上的方法和装置。本发明的一个实施例涉及在衬底上组装均匀的压力静压垫板的方法。本发明的第二个实施例涉及一种制造均匀的压力静压垫板的方法。本发明的第三实施例涉及在组装的基板上的组件的电接触区域下的组装衬底的相对侧上具有均匀的力静压垫板的组装衬底。

5. 发明授权

US06430050B1 Mechanical loading of a land grid array component using a wave spring 失效
标题翻译：使用波形弹簧对地面阵列部件进行机械加载
公开(公告)号：US06430050B1
公开(公告)日：2002-08-06
申请号：US09872194
申请日：2001-05-31
申请人： James David Hensley , Stephen Daniel Cromwell , Gregory S. Meyer
发明人： James David Hensley , Stephen Daniel Cromwell , Gregory S. Meyer
IPC分类号： H05K720
CPC分类号： H01L23/40 , H01L23/4006 , H01L2023/405 , H01L2023/4081 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： A method and substrate using a wave spring to clamp a component to the substrate. One embodiment of the invention involves a method to use a wave spring to clamp a component to a substrate. The method includes placing the component on the substrate, placing a structure having holes on the component, placing a number of wave springs on a corresponding number of bolts, inserting the bolts into the holes in the structure, and attaching the bolts to the substrate. A second embodiment of the invention involves a substrate with an electrical contact area, an interposer placed on the electrical contact area, a component placed on the interposer, a block having holes placed on the component, bolts and wave springs inserted in the holes, wherein the bolts and wave springs clamp the component, the interposer and the substrate together on the electrical contact area of the substrate.
摘要翻译：使用波形弹簧将部件夹持到基板的方法和基板。本发明的一个实施例涉及使用波形弹簧来将部件夹持到基底的方法。该方法包括将部件放置在基板上，将具有孔的结构放置在部件上，将多个波形弹簧放置在相应数量的螺栓上，将螺栓插入结构中的孔中，并将螺栓附接到基板。本发明的第二个实施例涉及具有电接触面积的基板，放置在电接触区域上的插入件，放置在插入件上的部件，插入在部件上的孔，插入孔中的螺栓和波形弹簧的块，其中螺栓和波形弹簧将部件，插入器和基板一起夹在基板的电接触区域上。

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