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1. 发明授权

US07572973B2 Method of making devices for solid state thermal transfer and power generation 有权
标题翻译：制造固态热转印和发电装置的方法
公开(公告)号：US07572973B2
公开(公告)日：2009-08-11
申请号：US12328788
申请日：2008-12-05
申请人： Stanton Earl Weaver, Jr. , Robert John Wojnarowski
发明人： Stanton Earl Weaver, Jr. , Robert John Wojnarowski
IPC分类号： H01L35/34 , H02N10/00
CPC分类号： H01L35/32 , Y10T156/1092
摘要： A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.
摘要翻译：制造固态热转印装置的方法包括彼此相对定位的第一和第二导电基板。固态热转移装置还包括设置在第一和第二导电基板之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电底物。

2. 发明授权

US5866952A High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate 失效
标题翻译：高密度互连电路模块，其具有作为应力减小模制基板的一部分的柔性层
公开(公告)号：US5866952A
公开(公告)日：1999-02-02
申请号：US565269
申请日：1995-11-30
申请人： Robert John Wojnarowski , Thomas Bent Gorczyca , Stanton Earl Weaver, Jr.
发明人： Robert John Wojnarowski , Thomas Bent Gorczyca , Stanton Earl Weaver, Jr.
IPC分类号： H01L25/18 , H01L21/98 , H01L23/538 , H01L25/04 , H01L23/29
CPC分类号： H01L25/50 , H01L21/568 , H01L21/6835 , H01L23/293 , H01L23/295 , H01L23/4334 , H01L23/5389 , H01L24/24 , H01L24/75 , H01L24/76 , H01L24/82 , H01L24/96 , H01L25/0655 , H01L2224/04105 , H01L2224/24137 , H01L2224/24195 , H01L2224/73267 , H01L2224/75315 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511
摘要： A high density interconnected multi-chip module is provided with a stress-reducing compliant material disposed around the chips prior to molding a polymeric substrate around the chips. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A compliant material is deposited around the chips, and then a mold form is positioned around the chips. Polymeric substrate molding material is added within the mold form, and then the substrate molding material is hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and faces of the chips. A thermal plug may be affixed to the backside of a chip prior to the addition of substrate molding material.
摘要翻译：高密度互连多芯片模块在模制聚合物基片周围的芯片之前设置有围绕芯片布置的减小应力的材料。具有接触垫的芯片面朝下放置在由基底支撑的粘合剂层上。围绕芯片沉积顺应性材料，然后将模具形式定位在芯片周围。在模具形式中加入聚合物基材模塑材料，然后将基材模塑材料硬化。具有与预定接触焊盘对准的通路并具有穿过通孔延伸的电导体的通孔的电介质层位于硬化的基板模制材料和芯片的表面上。在添加基底模制材料之前，可以将热塞固定到芯片的背面。

3. 发明授权

US07498507B2 Device for solid state thermal transfer and power generation 有权
标题翻译：固态热转印和发电装置
公开(公告)号：US07498507B2
公开(公告)日：2009-03-03
申请号：US11081986
申请日：2005-03-16
申请人： Stanton Earl Weaver, Jr. , Robert John Wojnarowski
发明人： Stanton Earl Weaver, Jr. , Robert John Wojnarowski
IPC分类号： H01L35/30 , H02N10/00
CPC分类号： H01L35/32 , Y10T156/1092
摘要： A solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.
摘要翻译：固态热转印装置包括彼此相对定位的第一和第二导电基板。固态热转移装置还包括设置在第一和第二导电基板之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电底物。

4. 发明授权

US06429381B1 High density interconnect multichip module stack and fabrication method 有权
标题翻译：高密度互连多芯片堆栈和制造方法
公开(公告)号：US06429381B1
公开(公告)日：2002-08-06
申请号：US09681555
申请日：2001-04-27
申请人： Richard Joseph Saia , Robert John Wojnarowski , Stanton Earl Weaver, Jr. , Kevin Matthew Durocher , Christopher James Kapusta , James Enrico Sabatini
发明人： Richard Joseph Saia , Robert John Wojnarowski , Stanton Earl Weaver, Jr. , Kevin Matthew Durocher , Christopher James Kapusta , James Enrico Sabatini
IPC分类号： H05K103
CPC分类号： H05K3/403 , H01L23/3677 , H01L23/481 , H01L25/0657 , H01L2224/16 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/3011 , H05K1/0306 , H05K3/0052 , H05K3/0061 , H05K3/321 , H05K3/4605 , H05K3/4611 , H05K3/4629 , H05K2201/09663 , H05K2201/1028 , H05K2203/0415 , H05K2203/063 , H05K2203/0733 , Y10T29/5313 , Y10T29/53174
摘要： A method for fabricating a substrate package for a high density interconnect multichip module stack comprises: providing a substrate having holes extending therethrough and having a bottom surface with metallization situated thereon; providing a metal sheet having grooves extending therethrough; attaching the metal sheet to the bottom surface of the substrate; attaching metal plugs through the holes to the metal sheet; and removing portions of the substrate to expose the metal plugs and separate the metal sheet into a plurality of segments defined by the grooves.
摘要翻译：一种用于制造用于高密度互连多芯片模块堆叠的衬底封装的方法，包括：提供具有延伸穿过其中并且具有位于其上的金属化的底表面的孔的衬底; 提供具有延伸穿过其中的槽的金属片; 将所述金属片附接到所述基板的底面; 将金属塞通过孔附接到金属板; 以及去除所述基板的部分以暴露所述金属塞并将所述金属板分离成由所述槽限定的多个段。

5. 发明授权

US07482634B2 Monolithic array for solid state ultraviolet light emitters 有权
标题翻译：固态紫外线发射体的单片阵列
公开(公告)号：US07482634B2
公开(公告)日：2009-01-27
申请号：US10950029
申请日：2004-09-24
申请人： Robert John Wojnarowski , Stanton Earl Weaver, Jr. , Abasifreke Udo Ebong , Xian An (Andrew) Cao , Steven Francis LeBoeuf , Larry Burton Rowland , Stephen D. Arthur
发明人： Robert John Wojnarowski , Stanton Earl Weaver, Jr. , Abasifreke Udo Ebong , Xian An (Andrew) Cao , Steven Francis LeBoeuf , Larry Burton Rowland , Stephen D. Arthur
IPC分类号： H01L33/00
CPC分类号： H01L33/20 , H01L27/153 , H01L33/32
摘要： The present invention is directed towards a source of ultraviolet energy, wherein the source is a UV-emitting LED's. In an embodiment of the invention, the UV-LED's are characterized by a base layer material including a substrate, a p-doped semiconductor material, a multiple quantum well, a n-doped semiconductor material, upon which base material a p-type metal resides and wherein the base structure has a mesa configuration, which mesa configuration may be rounded on a boundary surface, or which may be non-rounded, such as a mesa having an upper boundary surface that is flat. In other words, the p-type metal resides upon a mesa formed out of the base structure materials. In a more specific embodiment, the UV-LED structure includes n-type metallization layer, passivation layers, and bond pads positioned at appropriate locations of the device. In a more specific embodiment, the p-type metal layer is encapsulated in the encapsulating layer.
摘要翻译：本发明涉及一种紫外线能量源，其中源是紫外线发射的LED。在本发明的实施例中，UV-LED的特征在于基底层材料，其包括基底，p掺杂半导体材料，多量子阱，n掺杂半导体材料，基底材料为p型金属并且其中基部结构具有台面构造，该台面构造可以在边界表面上圆化，或者可以是非圆形的，例如具有平坦的上边界表面的台面。换句话说，p型金属位于由基底结构材料形成的台面上。在更具体的实施例中，UV-LED结构包括位于设备适当位置的n型金属化层，钝化层和接合焊盘。在更具体的实施例中，p型金属层被封装在封装层中。

6. 发明授权

US07431479B2 LED lighting system with reflective board 有权
标题翻译： LED照明系统带反光板
公开(公告)号：US07431479B2
公开(公告)日：2008-10-07
申请号：US11725410
申请日：2007-03-19
申请人： Stanton Earl Weaver, Jr. , Thomas Elliot Stecher
发明人： Stanton Earl Weaver, Jr. , Thomas Elliot Stecher
IPC分类号： F21V7/00
CPC分类号： H05K1/181 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H01S5/005 , H01S5/02216 , H01S5/02292 , H01S5/4025 , H05K1/0274 , H05K2201/0195 , H05K2201/0209 , H05K2201/2054 , Y02P70/611 , Y10S362/80 , H01L2924/00
摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.
摘要翻译：发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

7. 发明授权

US10309587B2 Light emitting diode component 有权
公开(公告)号：US10309587B2
公开(公告)日：2019-06-04
申请号：US13886878
申请日：2013-05-03
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, Jr. , Thomas F. Soules
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, Jr. , Thomas F. Soules
IPC分类号： F21K9/64 , F21K9/68 , F21V13/08 , H01L33/46 , H01L33/50 , H01L33/58 , H01L33/60 , F21Y105/10 , F21Y115/10
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

8. 发明授权

US08811014B2 Heat exchange assembly and methods of assembling same 有权
标题翻译：换热组件及组装方法
公开(公告)号：US08811014B2
公开(公告)日：2014-08-19
申请号：US13340058
申请日：2011-12-29
申请人： Shakti Singh Chauhan , Stanton Earl Weaver, Jr. , Tao Deng , Christopher Michael Eastman , Wenwu Zhang
发明人： Shakti Singh Chauhan , Stanton Earl Weaver, Jr. , Tao Deng , Christopher Michael Eastman , Wenwu Zhang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.
摘要翻译：本文描述了用于冷却电气部件的热交换组件。热组件包括壳体，其包括蒸发器部分，冷凝器部分和沿着纵向轴线在蒸发器部分和冷凝器部分之间延伸的输送部分。壳体被构造成沿着相对于传送部分定向的弯曲轴线弯曲。壳体还包括至少一个侧壁，其包括在蒸发器部分和冷凝器部分之间延伸的至少一个流体室，以在蒸发器部分和冷凝器部分之间引导工作流体。多个流体通道限定在内表面内以将液体流体从冷凝器部分引导到蒸发器部分。至少一个蒸汽通道限定在内表面内，以将气态流体从蒸发器部分引导到冷凝器部分。

9. 发明授权

US07260939B2 Thermal transfer device and system and method incorporating same 失效
标题翻译：热转印装置及其组合方法
公开(公告)号：US07260939B2
公开(公告)日：2007-08-28
申请号：US11015260
申请日：2004-12-17
申请人： Stanton Earl Weaver, Jr.
发明人： Stanton Earl Weaver, Jr.
IPC分类号： F25B21/00 , H01L35/30 , H01L29/36 , H01L29/74 , H01J1/00
CPC分类号： H01L35/00 , B82Y10/00 , B82Y30/00 , F25B21/00 , F25B2321/003 , H01J45/00 , Y02B30/66 , Y10T29/4935
摘要： A method of manufacturing a thermal transfer device including providing first and second thermally conductive substrates that are substantially atomically flat, providing a patterned electrical barrier having a plurality of closed shapes on the first thermally conductive substrate and providing a nanotube catalyst material on the first thermally conductive substrate in a nanotube growth area oriented within each of the plurality of closed shapes of the patterned electrical barrier. The method also includes orienting the second thermally conductive substrate opposite the first thermally conductive substrate such that the patterned electrical barrier is disposed between the first and second thermally conductive substrates and providing a precursor gas proximate the nanotube catalyst material to facilitate growth of nanotubes in the nanotube growth areas from the first thermally conductive substrate toward, and limited by, the second thermally conductive substrate. In this thermal transfer device, introduction of current flow between the first and second thermally conductive substrates enables heat transfer between the first and second thermally conductive substrates via a flow of electrons between the first and second thermally conductive substrates.
摘要翻译：一种制造热转印装置的方法，包括提供基本上原子上平坦的第一和第二导热基底，在第一导热基底上提供具有多个封闭形状的图案化电屏障，并在第一导热基底上提供纳米管催化剂材料衬底在取向于图案化电屏障的多个封闭形状的每一个内的纳米管生长区域中。该方法还包括将第二导热衬底定位成与第一导热衬底相对的方向，使得图案化电阻挡层设置在第一和第二导热衬底之间，并提供靠近纳米管催化剂材料的前体气体，以促进纳米管在纳米管中的生长生长区域从第一导热衬底朝向第二导热衬底限制。在该热转印装置中，在第一导热基板和第二导热基板之间引入电流可以使第一和第二导热基板之间的电流经由第一和第二导热基板之间的电流传递。

10. 发明授权

US07021147B1 Sensor package and method 有权
标题翻译：传感器封装和方法
公开(公告)号：US07021147B1
公开(公告)日：2006-04-04
申请号：US11178128
申请日：2005-07-11
申请人： Kanakasabapathi Subramanian , Donald Joseph Buckley, Jr. , Slawomir Rubinsztajn , Arun Virupaksha Gowda , Stanton Earl Weaver, Jr. , Russell William Craddock , Deborah Ann Haitko
发明人： Kanakasabapathi Subramanian , Donald Joseph Buckley, Jr. , Slawomir Rubinsztajn , Arun Virupaksha Gowda , Stanton Earl Weaver, Jr. , Russell William Craddock , Deborah Ann Haitko
IPC分类号： G01L19/04
CPC分类号： G01L19/0645
摘要： A sensor package and method are described. The sensor package includes an enclosure, a diaphragm coupled to the enclosure. The diaphragm is configured to receive vibrations from an ambient environment. Further, the sensor package includes a pressure sensing element disposed inside the enclosure, and a pressure transfer medium disposed inside the enclosure and proximate the pressure sensing element, where the pressure transfer medium includes a fluid, and a plurality of filler particles suspended in the fluid. The filler particles serve to reduce a coefficient of thermal expansion of the pressure transfer medium.
摘要翻译：描述传感器封装和方法。传感器组件包括外壳，连接到外壳的隔膜。隔膜被配置为从周围环境接收振动。此外，传感器封装包括设置在外壳内部的压力感测元件和设置在外壳内部并且靠近压力感测元件的压力传感介质，其中压力传递介质包括流体，以及悬浮在流体中的多个填料颗粒。填料颗粒用于降低压力传递介质的热膨胀系数。

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