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1. 发明授权

US08811014B2 Heat exchange assembly and methods of assembling same 有权
标题翻译：换热组件及组装方法
公开(公告)号：US08811014B2
公开(公告)日：2014-08-19
申请号：US13340058
申请日：2011-12-29
申请人： Shakti Singh Chauhan , Stanton Earl Weaver, Jr. , Tao Deng , Christopher Michael Eastman , Wenwu Zhang
发明人： Shakti Singh Chauhan , Stanton Earl Weaver, Jr. , Tao Deng , Christopher Michael Eastman , Wenwu Zhang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.
摘要翻译：本文描述了用于冷却电气部件的热交换组件。热组件包括壳体，其包括蒸发器部分，冷凝器部分和沿着纵向轴线在蒸发器部分和冷凝器部分之间延伸的输送部分。壳体被构造成沿着相对于传送部分定向的弯曲轴线弯曲。壳体还包括至少一个侧壁，其包括在蒸发器部分和冷凝器部分之间延伸的至少一个流体室，以在蒸发器部分和冷凝器部分之间引导工作流体。多个流体通道限定在内表面内以将液体流体从冷凝器部分引导到蒸发器部分。至少一个蒸汽通道限定在内表面内，以将气态流体从蒸发器部分引导到冷凝器部分。

2. 发明授权

US09066443B2 Overlay circuit structure for interconnecting light emitting semiconductors 有权
标题翻译：用于互连发光半导体的叠层电路结构
公开(公告)号：US09066443B2
公开(公告)日：2015-06-23
申请号：US13231547
申请日：2011-09-13
申请人： Arun Virupaksha Gowda , Donald Paul Cunningham , Shakti Singh Chauhan
发明人： Arun Virupaksha Gowda , Donald Paul Cunningham , Shakti Singh Chauhan
IPC分类号： H01L33/00 , H05K1/18 , H01L25/075 , H01L33/62 , H01L33/64 , H05K1/02
CPC分类号： H05K1/189 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/647 , H01L2224/24 , H01L2933/0066 , H01L2933/0075 , H05K1/021 , H05K2201/10106
摘要： A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES chips mounted on the heatsink and electrically connected thereto, with each LES chip comprising connection pads and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure positioned on and electrically connected to each LES chip to provide for controlLES operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips.
摘要翻译：公开了一种用于封装发光半导体（LES）的系统和方法。提供了一种LES装置，其包括散热器和安装在散热器上并电连接到其上的LES芯片阵列，每个LES芯片包括连接焊盘和配置为响应于接收的电力从其发射光的发光区域。 LES装置还包括位于每个LES芯片上并电连接到每个LES芯片以提供LES芯片阵列的控制操作的柔性互连结构，其中柔性互连结构还包括被配置为符合散热器形状的柔性介电膜以及金属互连结构，其形成在柔性电介质膜上并且延伸穿过形成在柔性电介质膜中的通孔，以便电连接到LES芯片的连接焊盘。

3. 发明申请

US20130062630A1 OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICONDUCTORS 有权
公开(公告)号：US20130062630A1
公开(公告)日：2013-03-14
申请号：US13231547
申请日：2011-09-13
申请人： Arun Virupaksha Gowda , Donald Paul Cunningham , Shakti Singh Chauhan
发明人： Arun Virupaksha Gowda , Donald Paul Cunningham , Shakti Singh Chauhan
IPC分类号： H01L33/64 , H01L33/48
CPC分类号： H05K1/189 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/647 , H01L2224/24 , H01L2933/0066 , H01L2933/0075 , H05K1/021 , H05K2201/10106
摘要： A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES chips mounted on the heatsink and electrically connected thereto, with each LES chip comprising connection pads and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure positioned on and electrically connected to each LES chip to provide for controlLES operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips.

4. 发明申请

US20140029234A1 RELIABLE SURFACE MOUNT INTEGRATED POWER MODULE 有权
标题翻译：可靠的表面安装集成电源模块
公开(公告)号：US20140029234A1
公开(公告)日：2014-01-30
申请号：US13561811
申请日：2012-07-30
申请人： Shakti Singh Chauhan , Arun Virupaksha Gowda , Paul Alan McConnelee
发明人： Shakti Singh Chauhan , Arun Virupaksha Gowda , Paul Alan McConnelee
IPC分类号： H05K7/02 , H01L21/56
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/563 , H01L23/3128 , H01L23/3142 , H01L23/3178 , H01L23/3735 , H01L23/49816 , H01L23/49833 , H01L23/49894 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L24/95 , H01L25/072 , H01L2224/04105 , H01L2224/24137 , H01L2224/29339 , H01L2224/32225 , H01L2224/73267 , H01L2224/83192 , H01L2224/8384 , H01L2224/92144 , H01L2924/0781 , H01L2924/12042 , H01L2924/15311 , H01L2924/15313 , H01L2924/15787 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A surface mount packaging structure that yields improved thermo-mechanical reliability and more robust second-level package interconnections is disclosed. The surface mount packaging structure includes a sub-module having a dielectric layer, semiconductor devices attached to the dielectric layer, a first level metal interconnect structure electrically coupled to the semiconductor devices, and a second level I/O connection electrically coupled to the first level interconnect and formed on the dielectric layer on a side opposite the semiconductor devices, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module are attached to the first surface of a multi-layer substrate structure, with a dielectric material positioned between the dielectric layer and the multi-layer substrate structure to fill in gaps in the surface-mount structure and provide additional structural integrity thereto.
摘要翻译：公开了一种表面贴装封装结构，其提供了改善的热机械可靠性和更坚固的二级封装互连。表面贴装封装结构包括具有电介质层的子模块，附着到电介质层的半导体器件，电耦合到半导体器件的第一级金属互连结构以及电耦合到第一级的第二级I / O连接互连并形成在与半导体器件相对的一侧的电介质层上，其中第二级I / O连接被配置为将子模块连接到外部电路。子模块的半导体器件附接到多层衬底结构的第一表面，其中介电材料位于电介质层和多层衬底结构之间以填充表面安装结构中的间隙，并提供额外的结构完整性。

5. 发明申请

US20140029210A1 DIFFUSION BARRIER FOR SURFACE MOUNT MODULES 有权
标题翻译：用于表面安装模块的扩散障碍
公开(公告)号：US20140029210A1
公开(公告)日：2014-01-30
申请号：US13561868
申请日：2012-07-30
申请人： Arun Virupaksha Gowda , Paul Alan McConnelee , Ri-an Zhao , Shakti Singh Chauhan
发明人： Arun Virupaksha Gowda , Paul Alan McConnelee , Ri-an Zhao , Shakti Singh Chauhan
IPC分类号： H05K7/02 , H01L21/58
CPC分类号： H01L23/3121 , H01L21/4853 , H01L21/561 , H01L23/3735 , H01L23/49816 , H01L23/49833 , H01L23/49894 , H01L23/5389 , H01L23/564 , H01L24/19 , H01L24/20 , H01L24/24 , H01L2224/12105 , H01L2224/13022 , H01L2224/131 , H01L2224/24137 , H01L2224/291 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73267 , H01L2224/83192 , H01L2224/83855 , H01L2224/92144 , H01L2224/9222 , H01L2224/97 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2224/83 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： A surface-mount package structure for reducing the ingress of moisture and gases thereto is disclosed. The surface-mount structure includes a sub-module having a dielectric layer, semiconductor devices attached to the dielectric layer, a first level interconnect structure electrically coupled to the semiconductor devices, and a second level I/O connection electrically coupled to the first level interconnect and formed on the dielectric layer, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module are attached to a substrate structure, with a dielectric material positioned between the dielectric layer and the substrate structure to fill in gaps in the surface-mount structure. A diffusion barrier layer is applied over the sub-module, adjacent the first and second level I/O connections, and extends down to the substrate structure to reduce the ingress of moisture and gases from a surrounding environment into the surface-mount structure.
摘要翻译：公开了一种用于减少水分和气体进入的表面贴装封装结构。表面安装结构包括具有电介质层的子模块，附着到电介质层的半导体器件，电耦合到半导体器件的第一级互连结构以及电耦合到第一级互连的第二级I / O连接并形成在电介质层上，其中第二级I / O连接被配置为将子模块连接到外部电路。子模块的半导体器件附接到衬底结构，其中介电材料位于电介质层和衬底结构之间以填充表面安装结构中的间隙。扩散阻挡层施加在子模块上，邻近第一和第二级I / O连接，并向下延伸到衬底结构，以减少水分和气体从周围环境进入表面安装结构。

6. 发明授权

US09299630B2 Diffusion barrier for surface mount modules 有权
标题翻译：表面贴装模块的扩散屏障
公开(公告)号：US09299630B2
公开(公告)日：2016-03-29
申请号：US13561868
申请日：2012-07-30
申请人： Arun Virupaksha Gowda , Paul Alan McConnelee , Ri-an Zhao , Shakti Singh Chauhan
发明人： Arun Virupaksha Gowda , Paul Alan McConnelee , Ri-an Zhao , Shakti Singh Chauhan
IPC分类号： H01L23/02 , H01L23/31 , H01L23/538 , H01L23/373 , H01L23/498 , H01L21/48 , H01L23/00 , H01L21/56
CPC分类号： H01L23/3121 , H01L21/4853 , H01L21/561 , H01L23/3735 , H01L23/49816 , H01L23/49833 , H01L23/49894 , H01L23/5389 , H01L23/564 , H01L24/19 , H01L24/20 , H01L24/24 , H01L2224/12105 , H01L2224/13022 , H01L2224/131 , H01L2224/24137 , H01L2224/291 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73267 , H01L2224/83192 , H01L2224/83855 , H01L2224/92144 , H01L2224/9222 , H01L2224/97 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2224/83 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： A surface-mount package structure for reducing the ingress of moisture and gases thereto is disclosed. The surface-mount structure includes a sub-module having a dielectric layer, semiconductor devices attached to the dielectric layer, a first level interconnect structure electrically coupled to the semiconductor devices, and a second level I/O connection electrically coupled to the first level interconnect and formed on the dielectric layer, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module are attached to a substrate structure, with a dielectric material positioned between the dielectric layer and the substrate structure to fill in gaps in the surface-mount structure. A diffusion barrier layer is applied over the sub-module, adjacent the first and second level I/O connections, and extends down to the substrate structure to reduce the ingress of moisture and gases from a surrounding environment into the surface-mount structure.
摘要翻译：公开了一种用于减少水分和气体进入的表面贴装封装结构。表面安装结构包括具有电介质层的子模块，附着到电介质层的半导体器件，电耦合到半导体器件的第一级互连结构以及电耦合到第一级互连的第二级I / O连接并形成在电介质层上，其中第二级I / O连接被配置为将子模块连接到外部电路。子模块的半导体器件附接到衬底结构，其中介电材料位于电介质层和衬底结构之间以填充表面安装结构中的间隙。扩散阻挡层施加在子模块上，邻近第一和第二级I / O连接，并向下延伸到衬底结构，以减少水分和气体从周围环境进入表面安装结构。

7. 发明授权

US08780559B2 Heat exchange assembly for use with electrical devices and methods of assembling an electrical device 有权
标题翻译：用于电气设备的热交换组件和组装电气设备的方法
公开(公告)号：US08780559B2
公开(公告)日：2014-07-15
申请号：US13340309
申请日：2011-12-29
申请人： Stanton Earl Weaver, Jr. , Tao Deng , Hendrik Pieter Jacobus de Bock , Shakti Singh Chauhan
发明人： Stanton Earl Weaver, Jr. , Tao Deng , Hendrik Pieter Jacobus de Bock , Shakti Singh Chauhan
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.
摘要翻译：这里描述了一种电气设备。电气设备包括壳体，其包括限定空腔的内表面，联接到壳体并沿着第一平面定向的散热器，以及定位在壳体空腔内并沿着第二平面定向的至少一个电气部件，与第一架飞机不同。热交换组件耦合到电气部件和散热器，用于调节电气部件的温度。热交换组件包括蒸发器部分，冷凝器部分和在蒸发器部分和冷凝器部分之间延伸的输送部分，用于在蒸发器部分和冷凝器部分之间引导工作流体。热交换组件构造成沿着相对于输送部分定向的至少一个弯曲轴线弯曲。

8. 发明申请

US20130168050A1 HEAT EXCHANGE ASSEMBLY AND METHODS OF ASSEMBLING SAME 有权
标题翻译：热交换装置及组装方法
公开(公告)号：US20130168050A1
公开(公告)日：2013-07-04
申请号：US13340058
申请日：2011-12-29
申请人： Shakti Singh Chauhan , Stanton Earl Weaver, JR. , Tao Deng , Christopher Michael Eastman , Wenwu Zhang
发明人： Shakti Singh Chauhan , Stanton Earl Weaver, JR. , Tao Deng , Christopher Michael Eastman , Wenwu Zhang
IPC分类号： F28D15/02 , B21D53/02
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.
摘要翻译：本文描述了用于冷却电气部件的热交换组件。热组件包括壳体，其包括蒸发器部分，冷凝器部分和沿着纵向轴线在蒸发器部分和冷凝器部分之间延伸的输送部分。壳体被构造成沿着相对于传送部分定向的弯曲轴线弯曲。壳体还包括至少一个侧壁，其包括在蒸发器部分和冷凝器部分之间延伸的至少一个流体室，以在蒸发器部分和冷凝器部分之间引导工作流体。多个流体通道限定在内表面内以将液体流体从冷凝器部分引导到蒸发器部分。至少一个蒸汽通道限定在内表面内，以将气态流体从蒸发器部分引导到冷凝器部分。

9. 发明申请

US20100294461A1 ENCLOSURE FOR HEAT TRANSFER DEVICES, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME 审中-公开
标题翻译：传热装置的外壳，其制造方法和包含其的制品
公开(公告)号：US20100294461A1
公开(公告)日：2010-11-25
申请号：US12470723
申请日：2009-05-22
申请人： Stanton Earl Weaver, JR. , Shakti Singh Chauhan , Aaron Jay Knobloch , Ambarish Jayant Kulkarni , Kripa Kiran Varanasi
发明人： Stanton Earl Weaver, JR. , Shakti Singh Chauhan , Aaron Jay Knobloch , Ambarish Jayant Kulkarni , Kripa Kiran Varanasi
IPC分类号： F28F13/00 , F28F7/00 , B21D53/02 , B23P15/26
CPC分类号： F28D15/046 , F28D15/0233 , F28F2230/00 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10T29/4935 , Y10T29/53113 , H01L2924/00
摘要： Disclosed herein is a heat transfer device that includes a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell during the operation of the heat transfer device; the shell having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell; the porous particle layer having a thickness effective to enclose a vapor space between opposing faces; the vapor space being effective to provide a passage for the transport of a fluid; the heat transfer device having a thermal conductivity of greater than or equal to about 10 watts per meter-Kelvin and a coefficient of thermal expansion that is substantially similar to that of a semiconductor.
摘要翻译：本文公开了一种包括壳体的传热装置; 所述外壳是防止所述壳体内的物质在所述传热装置的操作期间与壳体外的物质交换的外壳; 壳体具有外表面和内表面; 以及设置在所述壳体的内表面上的多孔层; 所述多孔颗粒层具有有效地在相对面之间包围蒸汽空间的厚度; 蒸汽空间有效地提供用于输送流体的通道; 热传导装置具有大于或等于约10瓦/米 - 开尔文的热传导装置和基本上类似于半导体的热膨胀系数。

10. 发明授权

US08941208B2 Reliable surface mount integrated power module 有权
标题翻译：可靠的表面贴装集成电源模块
公开(公告)号：US08941208B2
公开(公告)日：2015-01-27
申请号：US13561811
申请日：2012-07-30
申请人： Shakti Singh Chauhan , Arun Virupaksha Gowda , Paul Alan McConnelee
发明人： Shakti Singh Chauhan , Arun Virupaksha Gowda , Paul Alan McConnelee
IPC分类号： H01L21/70
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/563 , H01L23/3128 , H01L23/3142 , H01L23/3178 , H01L23/3735 , H01L23/49816 , H01L23/49833 , H01L23/49894 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L24/95 , H01L25/072 , H01L2224/04105 , H01L2224/24137 , H01L2224/29339 , H01L2224/32225 , H01L2224/73267 , H01L2224/83192 , H01L2224/8384 , H01L2224/92144 , H01L2924/0781 , H01L2924/12042 , H01L2924/15311 , H01L2924/15313 , H01L2924/15787 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A surface mount packaging structure that yields improved thermo-mechanical reliability and more robust second-level package interconnections is disclosed. The surface mount packaging structure includes a sub-module having a dielectric layer, semiconductor devices attached to the dielectric layer, a first level metal interconnect structure electrically coupled to the semiconductor devices, and a second level I/O connection electrically coupled to the first level interconnect and formed on the dielectric layer on a side opposite the semiconductor devices, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module are attached to the first surface of a multi-layer substrate structure, with a dielectric material positioned between the dielectric layer and the multi-layer substrate structure to fill in gaps in the surface-mount structure and provide additional structural integrity thereto.
摘要翻译：公开了一种表面贴装封装结构，其提供了改善的热机械可靠性和更坚固的二级封装互连。表面贴装封装结构包括具有电介质层的子模块，附着到电介质层的半导体器件，电耦合到半导体器件的第一级金属互连结构以及电耦合到第一级的第二级I / O连接互连并形成在与半导体器件相对的一侧的电介质层上，其中第二级I / O连接被配置为将子模块连接到外部电路。子模块的半导体器件附接到多层衬底结构的第一表面，其中介电材料位于电介质层和多层衬底结构之间以填充表面安装结构中的间隙，并提供额外的结构完整性。

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