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1. 发明授权

US08811014B2 Heat exchange assembly and methods of assembling same 有权
标题翻译：换热组件及组装方法
公开(公告)号：US08811014B2
公开(公告)日：2014-08-19
申请号：US13340058
申请日：2011-12-29
申请人： Shakti Singh Chauhan , Stanton Earl Weaver, Jr. , Tao Deng , Christopher Michael Eastman , Wenwu Zhang
发明人： Shakti Singh Chauhan , Stanton Earl Weaver, Jr. , Tao Deng , Christopher Michael Eastman , Wenwu Zhang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.
摘要翻译：本文描述了用于冷却电气部件的热交换组件。热组件包括壳体，其包括蒸发器部分，冷凝器部分和沿着纵向轴线在蒸发器部分和冷凝器部分之间延伸的输送部分。壳体被构造成沿着相对于传送部分定向的弯曲轴线弯曲。壳体还包括至少一个侧壁，其包括在蒸发器部分和冷凝器部分之间延伸的至少一个流体室，以在蒸发器部分和冷凝器部分之间引导工作流体。多个流体通道限定在内表面内以将液体流体从冷凝器部分引导到蒸发器部分。至少一个蒸汽通道限定在内表面内，以将气态流体从蒸发器部分引导到冷凝器部分。

2. 发明授权

US08780559B2 Heat exchange assembly for use with electrical devices and methods of assembling an electrical device 有权
标题翻译：用于电气设备的热交换组件和组装电气设备的方法
公开(公告)号：US08780559B2
公开(公告)日：2014-07-15
申请号：US13340309
申请日：2011-12-29
申请人： Stanton Earl Weaver, Jr. , Tao Deng , Hendrik Pieter Jacobus de Bock , Shakti Singh Chauhan
发明人： Stanton Earl Weaver, Jr. , Tao Deng , Hendrik Pieter Jacobus de Bock , Shakti Singh Chauhan
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.
摘要翻译：这里描述了一种电气设备。电气设备包括壳体，其包括限定空腔的内表面，联接到壳体并沿着第一平面定向的散热器，以及定位在壳体空腔内并沿着第二平面定向的至少一个电气部件，与第一架飞机不同。热交换组件耦合到电气部件和散热器，用于调节电气部件的温度。热交换组件包括蒸发器部分，冷凝器部分和在蒸发器部分和冷凝器部分之间延伸的输送部分，用于在蒸发器部分和冷凝器部分之间引导工作流体。热交换组件构造成沿着相对于输送部分定向的至少一个弯曲轴线弯曲。

3. 发明授权

US08405996B2 Article including thermal interface element and method of preparation 有权
标题翻译：文章包括热界面元素和制备方法
公开(公告)号：US08405996B2
公开(公告)日：2013-03-26
申请号：US12826337
申请日：2010-06-29
申请人： David Mulford Shaddock , Deng Tao , Hendrik Pieter Jacobus De Bock , Dalong Zhong , Christopher Michael Eastman , Kevin Matthew Durocher , Stanton Earl Weaver, Jr.
发明人： David Mulford Shaddock , Deng Tao , Hendrik Pieter Jacobus De Bock , Dalong Zhong , Christopher Michael Eastman , Kevin Matthew Durocher , Stanton Earl Weaver, Jr.
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , B82Y30/00 , B82Y40/00 , C25D5/022 , C25D7/12 , F28F2013/006 , F28F2255/00 , H01L2924/0002 , Y10T29/49 , Y10T428/30 , H01L2924/00
摘要： An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition.
摘要翻译：公开了一种形成物品的制品和方法。该制品包括热源，散热器和具有多个独立纳米脉冲，顶层和底层的热界面元件。制品的纳米螺旋，顶层和底层包括至少一种无机材料。该制品可以使用许多方法制备，包括诸如GLAD和电化学沉积的方法。

4. 发明授权

US07431479B2 LED lighting system with reflective board 有权
标题翻译： LED照明系统带反光板
公开(公告)号：US07431479B2
公开(公告)日：2008-10-07
申请号：US11725410
申请日：2007-03-19
申请人： Stanton Earl Weaver, Jr. , Thomas Elliot Stecher
发明人： Stanton Earl Weaver, Jr. , Thomas Elliot Stecher
IPC分类号： F21V7/00
CPC分类号： H05K1/181 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H01S5/005 , H01S5/02216 , H01S5/02292 , H01S5/4025 , H05K1/0274 , H05K2201/0195 , H05K2201/0209 , H05K2201/2054 , Y02P70/611 , Y10S362/80 , H01L2924/00
摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.
摘要翻译：发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

5. 发明授权

US10309587B2 Light emitting diode component 有权
公开(公告)号：US10309587B2
公开(公告)日：2019-06-04
申请号：US13886878
申请日：2013-05-03
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, Jr. , Thomas F. Soules
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, Jr. , Thomas F. Soules
IPC分类号： F21K9/64 , F21K9/68 , F21V13/08 , H01L33/46 , H01L33/50 , H01L33/58 , H01L33/60 , F21Y105/10 , F21Y115/10
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

6. 发明授权

US07498507B2 Device for solid state thermal transfer and power generation 有权
标题翻译：固态热转印和发电装置
公开(公告)号：US07498507B2
公开(公告)日：2009-03-03
申请号：US11081986
申请日：2005-03-16
申请人： Stanton Earl Weaver, Jr. , Robert John Wojnarowski
发明人： Stanton Earl Weaver, Jr. , Robert John Wojnarowski
IPC分类号： H01L35/30 , H02N10/00
CPC分类号： H01L35/32 , Y10T156/1092
摘要： A solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.
摘要翻译：固态热转印装置包括彼此相对定位的第一和第二导电基板。固态热转移装置还包括设置在第一和第二导电基板之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电底物。

7. 发明授权

US07260939B2 Thermal transfer device and system and method incorporating same 失效
标题翻译：热转印装置及其组合方法
公开(公告)号：US07260939B2
公开(公告)日：2007-08-28
申请号：US11015260
申请日：2004-12-17
申请人： Stanton Earl Weaver, Jr.
发明人： Stanton Earl Weaver, Jr.
IPC分类号： F25B21/00 , H01L35/30 , H01L29/36 , H01L29/74 , H01J1/00
CPC分类号： H01L35/00 , B82Y10/00 , B82Y30/00 , F25B21/00 , F25B2321/003 , H01J45/00 , Y02B30/66 , Y10T29/4935
摘要： A method of manufacturing a thermal transfer device including providing first and second thermally conductive substrates that are substantially atomically flat, providing a patterned electrical barrier having a plurality of closed shapes on the first thermally conductive substrate and providing a nanotube catalyst material on the first thermally conductive substrate in a nanotube growth area oriented within each of the plurality of closed shapes of the patterned electrical barrier. The method also includes orienting the second thermally conductive substrate opposite the first thermally conductive substrate such that the patterned electrical barrier is disposed between the first and second thermally conductive substrates and providing a precursor gas proximate the nanotube catalyst material to facilitate growth of nanotubes in the nanotube growth areas from the first thermally conductive substrate toward, and limited by, the second thermally conductive substrate. In this thermal transfer device, introduction of current flow between the first and second thermally conductive substrates enables heat transfer between the first and second thermally conductive substrates via a flow of electrons between the first and second thermally conductive substrates.
摘要翻译：一种制造热转印装置的方法，包括提供基本上原子上平坦的第一和第二导热基底，在第一导热基底上提供具有多个封闭形状的图案化电屏障，并在第一导热基底上提供纳米管催化剂材料衬底在取向于图案化电屏障的多个封闭形状的每一个内的纳米管生长区域中。该方法还包括将第二导热衬底定位成与第一导热衬底相对的方向，使得图案化电阻挡层设置在第一和第二导热衬底之间，并提供靠近纳米管催化剂材料的前体气体，以促进纳米管在纳米管中的生长生长区域从第一导热衬底朝向第二导热衬底限制。在该热转印装置中，在第一导热基板和第二导热基板之间引入电流可以使第一和第二导热基板之间的电流经由第一和第二导热基板之间的电流传递。

8. 发明授权

US07021147B1 Sensor package and method 有权
标题翻译：传感器封装和方法
公开(公告)号：US07021147B1
公开(公告)日：2006-04-04
申请号：US11178128
申请日：2005-07-11
申请人： Kanakasabapathi Subramanian , Donald Joseph Buckley, Jr. , Slawomir Rubinsztajn , Arun Virupaksha Gowda , Stanton Earl Weaver, Jr. , Russell William Craddock , Deborah Ann Haitko
发明人： Kanakasabapathi Subramanian , Donald Joseph Buckley, Jr. , Slawomir Rubinsztajn , Arun Virupaksha Gowda , Stanton Earl Weaver, Jr. , Russell William Craddock , Deborah Ann Haitko
IPC分类号： G01L19/04
CPC分类号： G01L19/0645
摘要： A sensor package and method are described. The sensor package includes an enclosure, a diaphragm coupled to the enclosure. The diaphragm is configured to receive vibrations from an ambient environment. Further, the sensor package includes a pressure sensing element disposed inside the enclosure, and a pressure transfer medium disposed inside the enclosure and proximate the pressure sensing element, where the pressure transfer medium includes a fluid, and a plurality of filler particles suspended in the fluid. The filler particles serve to reduce a coefficient of thermal expansion of the pressure transfer medium.
摘要翻译：描述传感器封装和方法。传感器组件包括外壳，连接到外壳的隔膜。隔膜被配置为从周围环境接收振动。此外，传感器封装包括设置在外壳内部的压力感测元件和设置在外壳内部并且靠近压力感测元件的压力传感介质，其中压力传递介质包括流体，以及悬浮在流体中的多个填料颗粒。填料颗粒用于降低压力传递介质的热膨胀系数。

9. 发明授权

US08506105B2 Thermal management systems for solid state lighting and other electronic systems 有权
标题翻译：固态照明和其他电子系统的热管理系统
公开(公告)号：US08506105B2
公开(公告)日：2013-08-13
申请号：US13212565
申请日：2011-08-18
申请人： Rajdeep Sharma , Stanton Earl Weaver, Jr. , Glenn Howard Kuenzler , Mehmet Arik , Gary Robert Allen , Jeffrey Marc Nall
发明人： Rajdeep Sharma , Stanton Earl Weaver, Jr. , Glenn Howard Kuenzler , Mehmet Arik , Gary Robert Allen , Jeffrey Marc Nall
IPC分类号： F21V33/00
CPC分类号： F21V29/02 , F04B43/046 , F21K9/232 , F21K9/64 , F21V3/02 , F21V7/041 , F21V7/05 , F21V7/22 , F21V13/02 , F21V13/04 , F21V17/12 , F21V29/505 , F21V29/506 , F21V29/63 , F21V29/77 , F21V29/83 , F21Y2115/10
摘要： An apparatus is provided including at least one electronic component. The apparatus also includes an enclosure enclosing the at least one electronic component. The enclosure includes at least one wall defined by a membrane. The apparatus further includes a piezoelectric actuator that is fixed at a first end and rigidly attached to the membrane at a second end. Application of alternating current to the piezoelectric actuator generates a pulsating mechanical deformation of the membrane.
摘要翻译：提供了包括至少一个电子部件的装置。该装置还包括封闭至少一个电子部件的外壳。外壳包括由膜限定的至少一个壁。该装置还包括压电致动器，该压电致动器固定在第一端并且在第二端处刚性地附接到膜。将交流电应用于压电致动器产生膜的脉动机械变形。

10. 发明授权

US08342819B2 System and method for mounting a cooling device and method of fabrication 有权
标题翻译：用于安装冷却装置的系统和方法及其制造方法
公开(公告)号：US08342819B2
公开(公告)日：2013-01-01
申请号：US12840554
申请日：2010-07-21
申请人： Mehmet Arik , Charles Erklin Seeley , Yogen Vishwas Utturkar , William Edward Burdick, Jr. , Kunal Ravindra Goray , Stanton Earl Weaver, Jr.
发明人： Mehmet Arik , Charles Erklin Seeley , Yogen Vishwas Utturkar , William Edward Burdick, Jr. , Kunal Ravindra Goray , Stanton Earl Weaver, Jr.
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , G06F1/20 , H01L23/467 , H01L2924/0002 , Y10T29/49002 , Y10T29/4935 , Y10T29/5313 , H01L2924/00
摘要： A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.
摘要翻译：公开了一种用于冷却装置的安装装置。安装装置包括从冷却装置向外延伸的多个连接器。安装设备还包括至少一个安装柱，其连接到多个连接器并被配置成将冷却装置安装在基板上。

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