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1. 发明申请

US20070128982A1 Bubble suppressing flow controller with ultrasonic flow meter 有权
标题翻译：超声波流量计气泡抑制流量控制器
公开(公告)号：US20070128982A1
公开(公告)日：2007-06-07
申请号：US11292839
申请日：2005-12-01
申请人： Songjae Lee , Ho Shin , Donald Olgado
发明人： Songjae Lee , Ho Shin , Donald Olgado
IPC分类号： B24B51/00 , B24B29/00 , B24B57/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A method and apparatus for the delivery of slurry solution comprising an ultrasonic flow meter positioned between a fluid preparation manifold and a slurry delivery arm, and a shutoff valve positioned between a proportional valve and the slurry delivery arm. Also, a method and apparatus for the delivery of slurry solution including an ultrasonic flow meter positioned to receive fluid from a fluid preparation manifold, a proportional valve and stepper motor in communication with the flow meter, and a reverse flow restrictor in communication with the proportional valve and a slurry delivery arm.
摘要翻译：一种用于输送浆液的方法和装置，包括位于流体制备歧管和浆料输送臂之间的超声波流量计，以及位于比例阀和浆料输送臂之间的截止阀。另外，一种用于输送浆液的方法和装置，包括：超声波流量计，定位成从流体制备歧管接收流体;与流量计连通的比例阀和步进马达;以及与比例流连通的反向限流器阀和浆料输送臂。

2. 发明申请

US20050284528A1 Methods and apparatus for providing fluid to a semiconductor device processing apparatus 有权
标题翻译：用于向半导体器件处理装置提供流体的方法和装置
公开(公告)号：US20050284528A1
公开(公告)日：2005-12-29
申请号：US11048106
申请日：2005-01-28
申请人： Sandy Chao , Songjae Lee , Ho Shin
发明人： Sandy Chao , Songjae Lee , Ho Shin
IPC分类号： F16K27/00 , F17D1/00
CPC分类号： C07C43/23 , C07C217/84 , C07C237/04 , C07F9/12 , F16K27/003 , Y10T137/87249 , Y10T137/87885
摘要： In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve, and the first valve, second valve and check valve are included in a single manifold.
摘要翻译：在第一方面，提供了一种阀组件，其包括适于输出去离子水和化学品中的至少一种的阀组件输出。阀组件的第一阀包括（1）适于接收化学品的第一输入; （2）适于将化学品循环至化学品返回的第一输出; 和（3）适于将化学品输出到阀组件输出的第二输出。阀组件还包括位于第一阀下游的第二阀。第二阀包括（1）适于接收去离子水（DI）的输入口; 和（2）适于将DI水输出到阀组件输出的输出。止回阀联接在第一阀的第二输出和第二阀的输出之间，并且第一阀，第二阀和止回阀包括在单个歧管中。

3. 发明申请

US20060264160A1 Methods and apparatus for providing fluid to a semiconductor device processing apparatus 审中-公开
公开(公告)号：US20060264160A1
公开(公告)日：2006-11-23
申请号：US11497408
申请日：2006-07-31
申请人： Sandy Chao , Songjae Lee , Ho Shin
发明人： Sandy Chao , Songjae Lee , Ho Shin
IPC分类号： B24B29/00
CPC分类号： C07C43/23 , C07C217/84 , C07C237/04 , C07F9/12 , F16K27/003 , Y10T137/87249 , Y10T137/87885
摘要： In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve, and the first valve, second valve and check valve are included in a single manifold.

4. 发明申请

US20060207671A1 Methods and apparatus for providing fluid to a semiconductor device processing apparatus 有权
标题翻译：用于向半导体器件处理装置提供流体的方法和装置
公开(公告)号：US20060207671A1
公开(公告)日：2006-09-21
申请号：US11439783
申请日：2006-05-23
申请人： Sandy Chao , Songjae Lee , Ho Shin
发明人： Sandy Chao , Songjae Lee , Ho Shin
IPC分类号： F17D1/00
CPC分类号： C07C43/23 , C07C217/84 , C07C237/04 , C07F9/12 , F16K27/003 , Y10T137/87249 , Y10T137/87885
摘要： In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve, and the first valve, second valve and check valve are included in a single manifold.
摘要翻译：在第一方面，提供了一种阀组件，其包括适于输出去离子水和化学品中的至少一种的阀组件输出。阀组件的第一阀包括（1）适于接收化学品的第一输入; （2）适于将化学品循环至化学品返回的第一输出; 和（3）适于将化学品输出到阀组件输出的第二输出。阀组件还包括位于第一阀下游的第二阀。第二阀包括（1）适于接收去离子水（DI）的输入口; 和（2）适于将DI水输出到阀组件输出的输出。止回阀联接在第一阀的第二输出和第二阀的输出之间，并且第一阀，第二阀和止回阀包括在单个歧管中。

5. 发明申请

US20070131653A1 Methods and apparatus for processing a substrate 审中-公开
公开(公告)号：US20070131653A1
公开(公告)日：2007-06-14
申请号：US11298555
申请日：2005-12-09
申请人： Gary Ettinger , Erik Wasinger , Sen-Hou Ko , Wui-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
发明人： Gary Ettinger , Erik Wasinger , Sen-Hou Ko , Wui-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： B24B9/065 , B24B21/002 , B24B41/002 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

6. 发明申请

US20070238393A1 METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
标题翻译：用于抛光衬底边缘的方法和装置
公开(公告)号：US20070238393A1
公开(公告)日：2007-10-11
申请号：US11693695
申请日：2007-03-29
申请人： Ho Shin , Gary Ettinger , Donald Olgado , Erik Wasinger , Sen-Hou Ko , Charles Dodds , Yufei Chen , Wei-Yung Hsu
发明人： Ho Shin , Gary Ettinger , Donald Olgado , Erik Wasinger , Sen-Hou Ko , Charles Dodds , Yufei Chen , Wei-Yung Hsu
IPC分类号： B24B51/00 , B24B49/00 , B24B7/30
CPC分类号： B24B9/065 , B24B21/002 , B24B41/067 , B24B49/16 , B24B57/02
摘要： Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.
摘要翻译：提供了抛光衬底边缘的方法和系统。本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将衬底旋转抛光膜时施加的能量和扭矩中的一个的量。本发明还可以包括基于在将衬底旋转抛光膜时所检测到的能量或扭矩确定从衬底边缘去除的材料量; 确定确定的去除材料量与预设抛光水平之间的差异; 以及基于所确定的所移除的材料量与所述预设的抛光水平之间的差来确定在旋转所述基板时施加的能量或扭矩的量，所述能量或扭矩适于实现预设的抛光水平。提供了许多其他方面。

7. 发明申请

US20070221256A1 Methods and apparatus for improving edge cleaning of a substrate 审中-公开
标题翻译：改善基材边缘清洁的方法和装置
公开(公告)号：US20070221256A1
公开(公告)日：2007-09-27
申请号：US11389528
申请日：2006-03-24
申请人： Hui Chen , Anne-Douce Coulin , Ho Shin , Donald Olgado
发明人： Hui Chen , Anne-Douce Coulin , Ho Shin , Donald Olgado
IPC分类号： B08B7/00 , B08B3/00
CPC分类号： B08B3/02 , H01L21/67046 , H01L21/67051
摘要： In a first aspect, an apparatus is provided that includes (1) an idler adapted to contact a substrate, to rotate therewith, and to sense rotation of the substrate; and (2) a driving mechanism coupled to the idler and adapted to drive the idler. Numerous other aspects are provided.
摘要翻译：在第一方面中，提供了一种装置，其包括：（1）适于接触衬底以与其一起旋转并且感测衬底的旋转的惰轮; 和（2）联接到惰轮并适于驱动惰轮的驱动机构。提供了许多其他方面。

8. 发明申请

US20070131654A1 Methods and apparatus for processing a substrate 有权
标题翻译：用于处理衬底的方法和设备
公开(公告)号：US20070131654A1
公开(公告)日：2007-06-14
申请号：US11299295
申请日：2005-12-09
申请人： Erik Wasinger , Gary Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
发明人： Erik Wasinger , Gary Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： C03C19/00 , B24B1/04 , B24B9/065 , B24B21/004 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
摘要翻译：适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和第一斜面作为基底旋转。提供了许多其他方面。

9. 发明申请

US20080011325A1 METHODS AND APPARATUS FOR SUPPORTING A SUBSTRATE IN A HORIZONTAL ORIENTATION DURING CLEANING 审中-公开
标题翻译：在清洗期间支撑水平方向底板的方法和装置
公开(公告)号：US20080011325A1
公开(公告)日：2008-01-17
申请号：US11757850
申请日：2007-06-04
申请人： Donald Olgado , Roy Nangoy , Shesraj Tulshibagwale , Hui Chen , Ho Shin
发明人： Donald Olgado , Roy Nangoy , Shesraj Tulshibagwale , Hui Chen , Ho Shin
IPC分类号： B08B7/04 , A46B13/00 , B24B51/00 , B08B3/10
CPC分类号： H01L21/67046 , B08B1/04 , B08B11/02
摘要： In one or more aspects, an apparatus for cleaning a substrate includes (1) a plurality of rollers adapted to contact and support the substrate in a horizontal orientation, and (2) at least one brush adapted to contact a major surface of the substrate while the substrate is supported by the plurality of rollers to clean the major surface of the substrate. At least one of the plurality of rollers is adapted to move between an opened position allowing the substrate to be loaded onto or unloaded from the plurality of rollers and a closed position in which the substrate is supported by the plurality of rollers. Numerous other aspects are provided.
摘要翻译：在一个或多个方面中，用于清洁基底的装置包括（1）多个辊，其适于以水平取向接触和支撑基底;以及（2）至少一个刷子，其适于接触基底的主表面，同时基板由多个辊支撑以清洁基板的主表面。所述多个辊中的至少一个适于在允许所述基底装载到所述多个辊子上或从所述多个辊子上卸载的打开位置和所述基板被所述多个辊支撑的关闭位置之间移动。提供了许多其他方面。

10. 发明申请

US20060246690A1 Electro-chemical deposition system 失效
公开(公告)号：US20060246690A1
公开(公告)日：2006-11-02
申请号：US11476945
申请日：2006-06-27
申请人： Yezdi Dordi , Donald Olgado , Ratson Morad , Peter Hey , Mark Denome , Michael Sugarman , Mark Lloyd , Anna Lloyd , Joseph Stevens , Dan Marohl , Ho Shin , Eugene Ravinovich , Robin Cheung , Ashok Sinha , Avi Tepman , Dan Carl , George Birkmaier
发明人： Yezdi Dordi , Donald Olgado , Ratson Morad , Peter Hey , Mark Denome , Michael Sugarman , Mark Lloyd , Anna Lloyd , Joseph Stevens , Dan Marohl , Ho Shin , Eugene Ravinovich , Robin Cheung , Ashok Sinha , Avi Tepman , Dan Carl , George Birkmaier
IPC分类号： H01L21/20 , B05D3/00 , B05C13/00 , B05C13/02
CPC分类号： H01L21/6723 , C25D7/123 , C25D17/001 , C25D17/06 , C25D21/02 , C25D21/12 , H01L21/2885 , H01L21/67028 , H01L21/67051 , H01L21/6708 , H01L21/67126 , H01L21/67167 , H01L21/67184 , H01L21/67745 , H01L21/68707 , H01L21/68721 , H01L21/68728 , H01L21/68742 , H05K3/241
摘要： The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

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