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1. 发明申请

US20030094376A1 Electrolytic copper plating solution and method for controlling the same 失效
标题翻译：电解铜电镀液及其控制方法
公开(公告)号：US20030094376A1
公开(公告)日：2003-05-22
申请号：US10027919
申请日：2001-12-20
申请人： Shipley Company, L.L.C.
发明人： Masaru Seita , Hideki Tsuchida , Shinjiro Hayashi
IPC分类号： C25D003/38
CPC分类号： C25D3/38 , C25D7/12 , H05K3/423
摘要： Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an electrolytic copper plating solution. The present invention can prevent the copper layer on the resulting composite material from forming aggregation and, when the plating is intended to fill vias, make it possible to achieve the via-filling without voids. The present invention also relates to a method for controlling the electrolytic copper plating solution by using an amount of a specific decomposition product of the sulfur-containing compound as an index.
摘要翻译：公开了含有特定含硫化合物和硫醇反应性化合物的电解铜电镀溶液和使用这种电解镀铜溶液的电解铜电镀工艺。本发明可以防止所得复合材料上的铜层形成聚集，并且当电镀用于填充通孔时，可以实现无空隙的通孔填充。本发明还涉及通过使用一定量的含硫化合物的特定分解产物作为指标来控制电解铜电镀溶液的方法。

2. 发明申请

US20040253450A1 Formaldehyde-free electroless copper plating process and solution for use in the process 审中-公开
标题翻译：无甲醛无电解铜电镀工艺及解决方案
公开(公告)号：US20040253450A1
公开(公告)日：2004-12-16
申请号：US10696552
申请日：2003-10-29
申请人： Shipley Company, L.L.C.
发明人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Yoshihiro Sugita , Andre Egli , William Brasch
IPC分类号： B32B009/04 , B05D001/18
CPC分类号： C23C18/30 , C23C18/40 , H05K3/181 , Y10T428/31504
摘要： This invention provides a process for electroless copper plating without using formaldehyde and an electroless copper plating solution which is used in the process. To this end, there is disclosed a process for electroless copper plating, which treatment comprises depositing a palladium or palladium-tin catalyst on a resin substrate, and then treating said resin substrate having the catalyst deposited thereon with a formaldehyde-free electroless copper plating solution that contains copper ions and a reducing agent, wherein the need for an accelerating treatment of a catalyst after said catalyst depositing treatment is obviated. The productivity of a copper-resin composite material is dramatically enhanced by the process of the present invention, because a copper thin layer can be formed on the resin substrate in a short time, even if an accelerating treatment for a catalyst is not performed in a separate process.
摘要翻译：本发明提供一种无需使用甲醛的化学镀铜方法和该方法中使用的化学镀铜溶液。为此，公开了一种无电镀铜方法，该方法包括在树脂基板上沉积钯或钯 - 锡催化剂，然后用不含甲醛的化学镀铜溶液处理其上沉积有催化剂的催化剂的树脂基材其含有铜离子和还原剂，其中消除了在所述催化剂沉积处理之后催化剂的加速处理的需要。通过本发明的方法，铜树脂复合材料的生产率显着提高，因为即使不在催化剂中进行催化剂的加速处理，也可以在短时间内在树脂基板上形成铜薄层单独的过程。

3. 发明申请

US20040072015A1 Composite material with improved binding strength and method for forming the same 审中-公开
标题翻译：具有改善结合强度的复合材料及其形成方法
公开(公告)号：US20040072015A1
公开(公告)日：2004-04-15
申请号：US10034775
申请日：2001-12-27
申请人： Shipley Company, L.L.C.
发明人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Masaru Kusaka , Koichi Yomogida , Hidemi Nawafune , Syozo Mizumoto , Shingo Ikeda
IPC分类号： B22F003/00
CPC分类号： H05K3/181 , C23C30/00 , H05K3/22 , H05K2203/0278 , H05K2203/121 , Y10T428/12014 , Y10T428/31692
摘要： This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.
摘要翻译：本发明提供了具有改进的结合强度的复合材料及其制造方法。特别地，本发明提供一种在树脂基材的表面具有金属的复合材料，其通过使树脂基材的表面进行离子交换基团导入处理，用含有金属离子的液体处理所述树脂基材的表面，以及然后还原所述金属离子，其中上述复合材料树脂的特征在于所述复合材料的树脂基材和金属被热压。所述复合材料相对于通过化学镀获得的复合材料，树脂基材和金属之间的粘合强度差，具有优异的粘结强度。此外，所述复合材料容易制造，因为可以使用热压法来形成所述复合材料。

4. 发明申请

US20030066754A1 Method for manufacturing copper-resin composite material 有权
标题翻译：铜树脂复合材料的制造方法
公开(公告)号：US20030066754A1
公开(公告)日：2003-04-10
申请号：US10224831
申请日：2002-08-21
申请人： Shipley Company, L.L.C.
发明人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Yoshihiro Sugita
IPC分类号： C25D005/48
CPC分类号： C23C18/28 , H05K3/181 , Y10T428/12535 , Y10T428/12569
摘要： A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.
摘要翻译：公开了一种形成铜 - 树脂复合材料的方法。该方法将钯或钯 - 锡催化剂固定在树脂基板上，然后将含催化剂的树脂接受化学镀铜浴，而不进行催化剂加速处理步骤。

5. 发明申请

US20040101665A1 Direct patterning method 审中-公开
标题翻译：直接图案化方法
公开(公告)号：US20040101665A1
公开(公告)日：2004-05-27
申请号：US10650119
申请日：2003-08-26
申请人： Shipley Company, L.L.C.
发明人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Hidemi Nawafune , Koichi Yomogida
IPC分类号： B05D003/00 , B32B015/08
CPC分类号： H05K3/185 , C23C18/14 , H05K3/105 , Y10T428/24917 , Y10T428/31678
摘要： A composite material having metal at the surface of a resin base is obtained by subjecting the surface of a resin base to ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions to introduce metal ions, introducing photocatalyst into the resin base containing said introduced metal ions, and then irradiating the resin base with electromagnetic radiation after said photocatalyst introduction. Said composite material is useful for composite materials that require fine metal patterns.
摘要翻译：在树脂基材的表面具有金属的复合材料通过使树脂基材的表面进行离子交换基团导入处理，用含有金属离子的液体处理所述树脂基材的表面以引入金属离子，将光催化剂引入到含有引入的金属离子的树脂基体，然后在引入光催化剂之后用电磁辐射照射树脂基料。所述复合材料可用于需要精细金属图案的复合材料。

6. 发明申请

US20040001957A1 Method for forming resin composite material 失效
标题翻译：树脂复合材料成型方法
公开(公告)号：US20040001957A1
公开(公告)日：2004-01-01
申请号：US10286607
申请日：2002-11-01
申请人： Shipley Company, L.L.C.
发明人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Koichi Yomogida , Hidemi Nawafune
IPC分类号： B32B015/04
CPC分类号： H05K3/025 , B32B15/08 , B32B37/025 , B32B37/12 , B32B38/0008 , B32B38/10 , B32B2311/00 , B32B2311/12 , B32B2375/00 , B32B2379/08 , B32B2457/00 , Y10T428/31678
摘要： This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 nullm or less, can be prepared that is otherwise difficult to prepare using conventional methods.
摘要翻译：本发明提供一种形成树脂复合材料的方法，包括以下步骤：（1）处理载体树脂的表面以处理引入离子交换基团，（2）通过处理表面来引入金属离子以处理载体树脂表面所述载体树脂与含有金属离子的溶液，（3）将所述金属离子转化成含有金属元素的成分，（4）在包含金属元素的所述成分的顶部上形成金属箔，和（5）转移所述金属通过加热所述金属箔对树脂基板箔。该方法提供了具有层压或铸造到其上的任何所需厚度的金属箔的载体树脂基板。以这种方式，可以制备含有诸如8μm或更小的厚度的金属箔，特别是铜箔的载体树脂，否则难以使用常规方法制备。

7. 发明申请

US20030155247A1 Process for electroplating silicon wafers 审中-公开
标题翻译：电镀硅片的工艺
公开(公告)号：US20030155247A1
公开(公告)日：2003-08-21
申请号：US10078766
申请日：2002-02-19
申请人： Shipley Company, L.L.C.
发明人： Takeshi Miura , Masaru Seita , Yasuo Ota
IPC分类号： C25D003/38 , C25D007/12
CPC分类号： C25D7/123 , C25D3/38
摘要： An electroplating solution comprising copper ions and a complexing agent for the copper ions and has a pH in the range of 4 to 10. The electroplating solution of the present invention makes it possible to fill trenches or via holes on silicon wafers for providing copper wiring with copper in a defect-free manner by preventing the seed layer from dissolving in the plating solution.
摘要翻译：一种包含铜离子的电镀溶液和用于铜离子的络合剂，其pH在4至10的范围内。本发明的电镀溶液可以在硅晶片上填充沟槽或通孔，以提供铜布线铜通过防止种子层溶解在电镀液中而以无缺陷的方式。

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