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    • 1. 发明授权
    • Method of manufacturing a connector chip
    • 制造连接器芯片的方法
    • US08607443B2
    • 2013-12-17
    • US12827755
    • 2010-06-30
    • Shinji OkamotoKatsumi TakeuchiYutaka Nomura
    • Shinji OkamotoKatsumi TakeuchiYutaka Nomura
    • H05K3/36
    • H05K3/368H01R12/52H05K3/3442H05K2201/10378Y10T29/49126
    • A method of manufacturing a connector chip includes preparing a plate-like insulating substrate material with a plurality of through hole rows arranged therein; forming a plurality of first and second base layers on opposite surfaces of the insulating substrate material; forming insulating layers between each two adjoining first base layers and between each two adjoining second base layers; forming third base layers on the one side over edge portions of the first base layers, internal surfaces of the through holes, and edge portions of the second base layers; forming fourth base layers on the other side over edge portions of the first base layers, the internal surfaces of the through holes, and edge portions of the second base layers; cutting the insulating substrate material along a middle of each of the through hole rows; and forming one or more plated layers over the first to fourth base layers.
    • 一种制造连接器芯片的方法包括制备其中布置有多个通孔列的板状绝缘基板材料; 在所述绝缘基板材料的相对表面上形成多个第一和第二基底层; 在每个两个邻接的第一基底层之间和每个两个相邻的第二基底层之间形成绝缘层; 在所述第一基底层的边缘部分,所述通孔的内表面和所述第二基底层的边缘部分的一侧上形成第三基底层; 在所述第一基底层的边缘部分的另一侧上形成第四基底层,所述通孔的内表面和所述第二基底层的边缘部分; 沿着每个通孔列的中间切割绝缘基板材料; 以及在所述第一至第四基底层上形成一个或多个镀层。
    • 2. 发明申请
    • CONNECTOR CHIP AND MANUFACTURING METHOD THEREOF
    • 连接器芯片及其制造方法
    • US20070072454A1
    • 2007-03-29
    • US10595809
    • 2004-11-12
    • Shinji OkamotoKatsumi TakeuchiYutaka Nomura
    • Shinji OkamotoKatsumi TakeuchiYutaka Nomura
    • H01R4/58
    • H05K3/368H01R12/52H05K3/3442H05K2201/10378Y10T29/49126
    • The present invention provides a connector chip capable of preventing electrical shorting between adjoining electrodes and also capable of readily connecting a plurality of electrodes on a first circuit substrate and a plurality of electrodes on a second circuit substrate without using a dedicated mounting device or the like. A plurality of conductive paths 5 are formed on an outer periphery surface constituted by continuous four surfaces 9A to 9D of an insulating substrate 3 including six surfaces of the surfaces 9A to 9D and surfaces 9E and 9F. Each of the conductive paths 5 goes round on the outer periphery surface. The conductive paths 5 are formed on the outer periphery surface at a predetermined interval in an opposing direction in which the remaining two surfaces 9E and 9F are opposing to each other. Each of insulating layers 7 having a property of repelling molten solder is formed between portions of each two adjoining conductive paths located on a pair of the surfaces 9A and 9B. The width of a conductive-path-formed portion 3A with a conductive path 5 formed thereon, orthogonal to a center line C is formed to be smaller than the width of a conductive-path-unformed portion 3B with no conductive path 5 formed thereon, orthogonal to the center line C.
    • 本发明提供一种连接器芯片,其能够防止相邻电极之间的电短路,并且还能够容易地连接第一电路基板上的多个电极和第二电路基板上的多个电极,而不使用专用的安装装置等。 在由包括表面9A至9D的六个表面和表面9E和9F的绝缘基板3的连续的四个表面9A至9D构成的外周面上形成多个导电路径5。 导电路径5在外周表面上圆周。 导电路径5以与剩下的两个表面9E和9F相对的相反方向以预定的间隔形成在外周表面上。 具有排斥熔融焊料性质的绝缘层7中的每一个形成在位于一对表面9A和9B上的每个两个邻接导电路径的部分之间。具有导电性的导电路径形成部分3A的宽度 形成在其上的与中心线C正交的路径5形成为小于没有形成在其上的导电路径5的与中心线C正交的导电路径未成形部分3B的宽度。
    • 3. 发明申请
    • CONNECTOR CHIP AND MANUFACTURING METHOD THEREOF
    • 连接器芯片及其制造方法
    • US20100266753A1
    • 2010-10-21
    • US12827755
    • 2010-06-30
    • Shinji OkamotoKatsumi TakeuchiYutaka Nomura
    • Shinji OkamotoKatsumi TakeuchiYutaka Nomura
    • H01R43/00
    • H05K3/368H01R12/52H05K3/3442H05K2201/10378Y10T29/49126
    • The present invention provides a connector chip capable of preventing electrical shorting between adjoining electrodes and also capable of readily connecting a plurality of electrodes on a first circuit substrate and a plurality of electrodes on a second circuit substrate without using a dedicated mounting device or the like. A plurality of conductive paths 5 are formed on an outer periphery surface constituted by continuous four surfaces 9A to 9D of an insulating substrate 3 including six surfaces of the surfaces 9A to 9D and surfaces 9E and 9F. Each of the conductive paths 5 goes round on the outer periphery surface. The conductive paths 5 are formed on the outer periphery surface at a predetermined interval in an opposing direction in which the remaining two surfaces 9E and 9F are opposing to each other. Each of insulating layers 7 having a property of repelling molten solder is formed between portions of each two adjoining conductive paths located on a pair of the surfaces 9A and 9B. The width of a conductive-path-formed portion 3A with a conductive path 5 formed thereon, orthogonal to a center line C is formed to be smaller than the width of a conductive-path-unformed portion 3B with no conductive path 5 formed thereon, orthogonal to the center line C.
    • 本发明提供一种连接器芯片,其能够防止相邻电极之间的电短路,并且还能够容易地连接第一电路基板上的多个电极和第二电路基板上的多个电极,而不使用专用的安装装置等。 在由包括表面9A至9D的六个表面和表面9E和9F的绝缘基板3的连续四个表面9A至9D构成的外周表面上形成多个导电通路5。 导电路径5中的每一个在外周表面上圆周。 导电路径5在剩余的两个表面9E和9F彼此相对的相反方向上以预定的间隔形成在外周表面上。 在位于一对表面9A和9B上的每个两个邻接的导电路径的部分之间形成具有排斥熔融焊料性质的绝缘层7。 形成有与中心线C正交的导电路径5的导电路径形成部3A的宽度形成为比形成有导电路径5的导电路径未成形部3B的宽度小, 与中心线C正交
    • 10. 发明申请
    • Molded member with foamed body
    • 带发泡体的模制件
    • US20060214399A1
    • 2006-09-28
    • US11086190
    • 2005-03-22
    • Shinji OkamotoHiroshi SuzukiTomohiro Chiba
    • Shinji OkamotoHiroshi SuzukiTomohiro Chiba
    • B60R21/20B60R21/16
    • B29C44/1228B29C44/351B29L2022/027B29L2031/3038B60R21/205B60R21/2165
    • Disclosed is a molded member with a foamed body, which is foamed on the top surface sides of a first member and a second member and is prevented from leaking from between abutment surfaces of those members toward the back side. A seal piece of a required width extending in an eaves form outward over the perimeter of the outer contour edge of an airbag door is provided at the outer contour edge. When the airbag door is laid out at a door mount portion, so formed as to surround an opening formed in a base material, the seal piece is set in close contact with the outer surface of the door mount portion in such a way as to surround the opening. This prevents the foamed body, foamed on the top surface side of the base material facing the airbag door, from leaking from a clearance, produced between abutment surface of the base material and the airbag door, toward the back side.
    • 公开了一种具有发泡体的模制构件,其在第一构件和第二构件的顶表面侧上发泡,并且被防止从这些构件的邻接表面向后侧泄漏。 在外轮廓边缘处设置有在安全气囊门的外轮廓边缘的周边外侧向外延伸的所需宽度的所需宽度的密封件。 当安全气囊门布置在门安装部分时,形成为围绕形成在基材中的开口,密封件被设置成与门安装部分的外表面紧密接触,以便围绕 开幕。 这防止了在面向气囊门的基材的顶面侧发泡的发泡体从在基材的抵接面和气囊门之间产生的间隙向后侧泄漏。