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1. 发明授权

US5613913A Method for developing attractions in a shooting game system 失效
标题翻译：在射击游戏系统中开发景点的方法
公开(公告)号：US5613913A
公开(公告)日：1997-03-25
申请号：US418029
申请日：1995-04-06
申请人： Shinichi Ikematsu , Hiroshi Kawakami , Satoshi Nakano , Tatsuya Kouno , Keisuke Hiromi , Masakazu Yoshimoto
发明人： Shinichi Ikematsu , Hiroshi Kawakami , Satoshi Nakano , Tatsuya Kouno , Keisuke Hiromi , Masakazu Yoshimoto
IPC分类号： F41G3/26 , A63F9/02 , A63F13/00 , F41J7/06 , F41J11/00 , A63F9/24
CPC分类号： A63F9/0291 , F41H7/005 , F41J7/04 , A63F2300/8076
摘要： In a method for developing attractions in a shooting game system with which players can experience gun fights between the targets and players themselves. The shooting game system can be easily installed in a short period anywhere and game quality can be adjusted in the most suitable state. The method for developing attractions includes the steps of producing various types of targets by combining fundamental mechanisms, each of which is used for a unit operation; incorporating unified control equipment and peripherals in the produced target to make them a target unit; embedding the above-described target unit in a target unit case so as to serve also as an indoor partition and posts; and arranging the embedded target units in the designated rooms of the attraction hall. The method for developing attractions alternatively includes inputting information regarding the arrangement of the targets, displaying the arrangement on a screen, and the interaction between the targets and the players. This method thereby allows monitor and control of game quality.
摘要翻译：一种用于在射击游戏系统中开发景点的方法，玩家可以通过这种方法在目标和玩家本身之间体验枪战。射击游戏系统可以在短时间内轻松安装，游戏质量可以在最合适的状态下进行调整。用于开发景点的方法包括通过组合基本机制来生产各种类型的目标的步骤，每个基本机制用于单位操作; 将统一的控制设备和外围设备结合在一起，使其成为目标单位; 将上述目标单元嵌入到目标单元壳体中，以用作室内分区和柱; 并将嵌入的目标单元布置在吸引馆的指定房间中。用于开发景点的方法或者包括输入关于目标的布置的信息，在屏幕上显示布置以及目标和玩家之间的相互作用。因此，该方法允许监视和控制游戏质量。

2. 发明授权

US5775998A Analyzer for developing attractions in a shooting game system 失效
标题翻译：用于在射击游戏系统中开发景点的分析器
公开(公告)号：US5775998A
公开(公告)日：1998-07-07
申请号：US681513
申请日：1996-07-23
申请人： Shinichi Ikematsu , Hiroshi Kawakami , Satoshi Nakano , Tatsuya Kouno , Keisuke Hiromi , Masakazu Yoshimoto
发明人： Shinichi Ikematsu , Hiroshi Kawakami , Satoshi Nakano , Tatsuya Kouno , Keisuke Hiromi , Masakazu Yoshimoto
IPC分类号： F41G3/26 , A63F9/02 , A63F13/00 , F41J7/06 , F41J11/00 , A63F9/22
CPC分类号： A63F9/0291 , F41H7/005 , F41J7/04 , A63F2300/8076
摘要： In a method for developing attractions in a shooting game system with which players can experience gun fights between the targets and players themselves, the present invention provides a method for developing attractions in a shooting game system with which the shooting game system can be easily installed in a short period anywhere and game quality can be always adjusted in the most suitable state. Namely, the method for developing attractions comprises the steps of producing various types of targets by combining fundamental mechanisms, each of which is used for a unit operation; incorporating unified control equipment and peripherals in the produced target to make them a target unit; embedding the above-described target unit in a target unit case so as to serve also as an indoor partition and posts; arranging the embedded target units in the designated rooms of the attraction hall.
摘要翻译：本发明提供了一种用于在射击游戏系统中开发景物的方法，玩家可以在目标和玩家本身之间体验枪战，本发明提供了一种用于在射击游戏系统中开发景点的方法，射击游戏系统可以通过该方法轻松地安装射击游戏系统短时间内任何地方，游戏质量可以随时调整到最合适的状态。也就是说，用于开发景点的方法包括通过组合基本机构来生产各种类型的目标的步骤，每个基本机制用于单位操作; 将统一的控制设备和外围设备结合在一起，使其成为目标单位; 将上述目标单元嵌入到目标单元壳体中，以用作室内分区和柱; 将嵌入的目标单位安排在吸引馆的指定房间内。

3. 发明授权

US5738584A Kit for developing attractions in a shooting game system 失效
标题翻译：用于在射击游戏系统中开发景点的套件
公开(公告)号：US5738584A
公开(公告)日：1998-04-14
申请号：US681514
申请日：1996-07-23
申请人： Shinichi Ikematsu , Hiroshi Kawakami , Satoshi Nakano , Tatsuya Kouno , Keisuke Hiromi , Masakazu Yoshimoto
发明人： Shinichi Ikematsu , Hiroshi Kawakami , Satoshi Nakano , Tatsuya Kouno , Keisuke Hiromi , Masakazu Yoshimoto
IPC分类号： F41G3/26 , A63F9/02 , A63F13/00 , F41J7/06 , F41J11/00 , A63F9/22
CPC分类号： A63F9/0291 , F41H7/005 , F41J7/04 , A63F2300/8076
摘要： In a method for developing attractions in a shooting game system with which players can experience gun fights between the targets and players themselves. The shooting game system can be easily installed in a short period anywhere and game quality can be adjusted in the most suitable state. The method for developing attractions includes the steps of producing various types of targets by combining fundamental mechanisms, each of which is used for a unit operation; incorporating unified control equipment and peripherals in the produced target to make them a target unit; embedding the above-described target unit in a target unit case so as to serve also as an indoor partition and posts; and arranging the embedded target units in the designated rooms of the attraction hall. The method for developing attractions alternatively includes inputting information regarding the arrangement of the targets, displaying the arrangement on a screen, and the interaction between the targets and the players. This method thereby allows monitor and control of game quality.
摘要翻译：一种用于在射击游戏系统中开发景点的方法，玩家可以通过这种方法在目标和玩家本身之间体验枪战。射击游戏系统可以在短时间内轻松安装，游戏质量可以在最合适的状态下进行调整。用于开发景点的方法包括通过组合基本机制来生产各种类型的目标的步骤，每个基本机制用于单位操作; 将统一的控制设备和外围设备结合在一起，使其成为目标单位; 将上述目标单元嵌入到目标单元壳体中，以用作室内分区和柱; 并将嵌入的目标单元布置在吸引馆的指定房间中。用于开发景点的方法或者包括输入关于目标的布置的信息，在屏幕上显示布置以及目标和玩家之间的相互作用。因此，该方法允许监视和控制游戏质量。

4. 发明授权

US08445807B2 Electrode wire for wire electrical discharge machining, method for manufacturing the same, and method for electrical discharge machining using the same 有权
标题翻译：线放电加工用电极线及其制造方法以及使用其的放电加工方法
公开(公告)号：US08445807B2
公开(公告)日：2013-05-21
申请号：US13233303
申请日：2011-09-15
申请人： Koichi Hashizume , Masakazu Yoshimoto , Nobuyuki Washio , Yoichiro Kimoto , Hiroshi Sato , Isao Izui
发明人： Koichi Hashizume , Masakazu Yoshimoto , Nobuyuki Washio , Yoichiro Kimoto , Hiroshi Sato , Isao Izui
IPC分类号： B23H7/08 , B23H1/04 , B23H1/06
CPC分类号： B21C1/003 , B21C9/00 , B23H7/08 , Y10T428/12903
摘要： A wire material having a copper-zinc alloy layer, which is formed by action of thermal diffusion, and a zinc layer on its circumference surface is subjected to processes, including from a step of drawing the wire material to a step of reducing the diameter of the product, to reliably crash the copper-zinc alloy layer into particles. The particles are embedded in the circumference surface of a core to integrate the diffusion alloy layer and zinc layer with the core and prevent the diffusion alloy layer and zinc layer from falling off from the core. In addition, in order to cover cracks formed in the copper-zinc alloy layer during wire drawing with a zinc thin film, wire drawing is performed at temperatures appropriate for maintaining good malleability and ductility of zinc.
摘要翻译：对具有由热扩散作用形成的铜 - 锌合金层和其周面上的锌层的线材进行处理，其中包括从将线材拉丝至减小直径的步骤该产品可以将铜 - 锌合金层可靠地碰撞成颗粒。将颗粒嵌入芯的圆周表面，使扩散合金层和锌层与芯体结合，防止扩散合金层和锌层从芯脱落。此外，为了覆盖用锌薄膜拉丝时在铜 - 锌合金层中形成的裂纹，在适于维持锌的良好延展性和延展性的温度下进行拉丝。

5. 发明授权

US07136578B2 Apparatus and method for recording and reproducing data, and AV server 有权
标题翻译：用于记录和再现数据的装置和方法，以及AV服务器
公开(公告)号：US07136578B2
公开(公告)日：2006-11-14
申请号：US10607166
申请日：2003-06-26
申请人： Norikazu Ito , Satoshi Yoneya , Masakazu Yoshimoto , Satoshi Katsuo , Jun Yoshikawa , Satoshi Yutani , Koichi Sato , Tomohisa Shiga , Hiroyuki Fujita , Masaki Hirose
发明人： Norikazu Ito , Satoshi Yoneya , Masakazu Yoshimoto , Satoshi Katsuo , Jun Yoshikawa , Satoshi Yutani , Koichi Sato , Tomohisa Shiga , Hiroyuki Fujita , Masaki Hirose
IPC分类号： H04N5/91
CPC分类号： G06F11/1076 , G06F2211/1016 , G06F2211/1057
摘要： A data recording and reproducing apparatus (11) which generates a plurality of divided data through dividing input data D1 using a distributor (22) if recording data, while generating redundancy-code data P1 and P2 using Read-Solomon-code data which can perform error-correcting on a plurality of divided data, and records the divided data and the redundancy-code data P1, P2 on HDDs 211 to 21K, 281 and 28Z. The data recording and reproducing apparatus (11) reproduces the divided data and the redundancy-code data from the HDDs 211 to 21K, 281 and 28Z, performs error-correcting processing on the divided data based on the redundancy-code data by an error corrector (31), and outputs the divided data which have been error-corrected after multiplying the divided data by a data multiplier (32) if reproducing data.
摘要翻译：一种数据记录和再现装置，用于在产生冗余码数据P 1和P 2的同时，通过使用分配器（22）分割输入数据D＆lt; 1＆gt; 使用可以在多个分割数据上进行纠错的读取 - 所罗门码数据，并将划分的数据和冗余码数据P 1，P 2记录在HDD 21的21 < 28＆gt;和28＆lt; Z＆gt;。数据记录和再现装置（11）从HDD 21的第二个，第二个，第二个，第二个，第二个，第二个，第二个，第二个，第二个，第二个并且通过误差校正器（31）基于冗余码数据对划分的数据进行纠错处理，并且将乘法后的已经被纠错的分割数据输出如果再现数据，则由数据乘法器（32）分割数据。

6. 发明授权

US07056448B2 Method for forming circuit pattern 有权
标题翻译：电路图案形成方法
公开(公告)号：US07056448B2
公开(公告)日：2006-06-06
申请号：US10441588
申请日：2003-05-20
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
IPC分类号： C23F1/00
CPC分类号： C23C18/161 , C23C18/1651 , C23C18/30 , H05K3/181 , Y10T29/49121 , Y10T29/49156
摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.
摘要翻译：形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。电路图案可以形成在印刷线路板上。

7. 发明申请

US20050258134A1 Method for forming circuit pattern 有权
标题翻译：电路图案形成方法
公开(公告)号：US20050258134A1
公开(公告)日：2005-11-24
申请号：US10441588
申请日：2003-05-20
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
IPC分类号： C23C18/28 , B05D3/10 , B05D5/12 , C23C18/16 , C23C18/30 , C23C18/38 , H01B13/00 , H05K3/06 , H05K3/18 , H05K3/46
CPC分类号： C23C18/161 , C23C18/1651 , C23C18/30 , H05K3/181 , Y10T29/49121 , Y10T29/49156
摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.
摘要翻译：形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。电路图案可以形成在印刷线路板上。

8. 发明授权

US5618404A Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use 失效
标题翻译：用于生产铅酸锡和锡磺酸盐的电解工艺用于焊锡电镀
公开(公告)号：US5618404A
公开(公告)日：1997-04-08
申请号：US442535
申请日：1995-05-16
申请人： Yoshiaki Okuhama , Seishi Masaki , Takao Takeuchi , Yoshiharu Matsuda , Masakazu Yoshimoto
发明人： Yoshiaki Okuhama , Seishi Masaki , Takao Takeuchi , Yoshiharu Matsuda , Masakazu Yoshimoto
IPC分类号： C25B3/00 , C25D3/60 , C25B1/00
CPC分类号： C25B3/00 , C25D3/60
摘要： An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode and a plurality of cathodes in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive .alpha. particle counts of less than 0.1 CPH/cm.sup.2.
摘要翻译：一种用于生产铅和锡磺酸盐的电解方法，其包括向电解池中的阳极和多个阴极施加DC电压，从而将铅或锡溶解在电解液中。电解池被阳离子交换膜和阴离子交换膜分隔成阳极室和阴极室。电解液是有机磺酸的溶液，阳极是铅或锡。该方法将诸如铀和钍的放射性同位素的含量降低到低于50ppb的水平，因此根据本发明使用铅和锡盐的焊料镀覆形成的涂层显示出小于0.1CPH / cm2。

9. 发明授权

US07166152B2 Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method 有权
标题翻译：用于提供化学镀的催化剂的预处理溶液，使用该溶液的预处理方法以及使用该方法生产的无电镀膜和/或电镀对象
公开(公告)号：US07166152B2
公开(公告)日：2007-01-23
申请号：US10636447
申请日：2003-08-07
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Kim Dong Hyun , Shingo Kitamura , Seiichiro Nakao , Hidenori Tsuji , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Kim Dong Hyun , Shingo Kitamura , Seiichiro Nakao , Hidenori Tsuji , Hidemi Nawafune
IPC分类号： C23C18/28
CPC分类号： C23C18/28
摘要： A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.
摘要翻译：提供了一种用于提供无电镀的催化剂的预处理溶液和使用该溶液的预处理方法。所述预处理溶液包含至少含有以下成分（I），（II）和（III）作为必要成分的银胶体溶液：（I）银胶体粒子，（II）一种或多种离子，选自具有可以将银离子还原成溶液中的金属银的金属和在银离子还原时被氧化的离子的金属，和（III）一种或多种选自羟基羧酸根离子，缩合磷酸根离子和胺羧酸根离子，银胶体粒子（I）由金属（II）的离子产生，具有可以将银离子还原成金属银的电位。当通过使用预处理溶液预处理要镀覆的物体时，实现无电镀的有效催化剂。

10. 发明申请

US20060113006A1 Tin-containing plating bath 审中-公开
标题翻译：含锡电镀浴
公开(公告)号：US20060113006A1
公开(公告)日：2006-06-01
申请号：US10542029
申请日：2004-01-22
申请人： Akihiro Masuda , Masayoshi Kohinata , Keigo Obata , Masakazu Yoshimoto , Kiyotaka Tsuji , Ei Uchida , Keiji Ori , Masahiro Eikawa
发明人： Akihiro Masuda , Masayoshi Kohinata , Keigo Obata , Masakazu Yoshimoto , Kiyotaka Tsuji , Ei Uchida , Keiji Ori , Masahiro Eikawa
IPC分类号： C23C22/48
CPC分类号： C25D3/32 , C25D3/60 , H01L2224/11462
摘要： The present invention provides a tin-containing plating bath comprising: (a) a soluble stannous salt, or a mixture of a soluble stannous salt and at least one soluble salt selected from the group consisting of copper salts, bismuth salts, silver salts, indium salts, zinc salts, nickel salts, cobalt salts and antimony salts; and (b) at least one aliphatic sulfonic acid selected from the group consisting of alkanesulfonic acids and alkanolsulfonic acids, the aliphatic sulfonic acid being a purified aliphatic sulfonic acid in which the total amount of sulfur-containing compounds as impurities consisting of compound(s) containing one or more sulfur atoms with an oxidation number of +4 or less in the molecule and compound(s) containing one or more sulfur atoms and one or more chlorine atoms in the molecule is a minute amount or less. A tin or tin alloy plating film with excellent reflowability, film appearance, etc. can be formed by the use of this plating bath.
摘要翻译：本发明提供一种含锡电镀液，其包含：（a）可溶性亚锡盐或可溶性亚锡盐与至少一种选自铜盐，铋盐，银盐，铟的可溶性盐的混合物盐，锌盐，镍盐，钴盐和锑盐; 和（b）选自烷烃磺酸和链烷醇磺酸的至少一种脂族磺酸，所述脂族磺酸是纯化的脂族磺酸，其中作为杂质的含硫化合物的总量由化合物在分子中含有氧化数为+4以下的一个或多个硫原子，分子中含有一个以上硫原子和一个以上氯原子的化合物为微量以下。可以通过使用该镀浴形成具有优异的回流性，膜外观等的锡或锡合金电镀膜。

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