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1. 发明授权

US07056448B2 Method for forming circuit pattern 有权
标题翻译：电路图案形成方法
公开(公告)号：US07056448B2
公开(公告)日：2006-06-06
申请号：US10441588
申请日：2003-05-20
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
IPC分类号： C23F1/00
CPC分类号： C23C18/161 , C23C18/1651 , C23C18/30 , H05K3/181 , Y10T29/49121 , Y10T29/49156
摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.
摘要翻译：形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。电路图案可以形成在印刷线路板上。

2. 发明申请

US20050258134A1 Method for forming circuit pattern 有权
标题翻译：电路图案形成方法
公开(公告)号：US20050258134A1
公开(公告)日：2005-11-24
申请号：US10441588
申请日：2003-05-20
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Shingo Kitamura , Seiichiro Nakao , Osamu Masuyama , Hidenori Tsuji
IPC分类号： C23C18/28 , B05D3/10 , B05D5/12 , C23C18/16 , C23C18/30 , C23C18/38 , H01B13/00 , H05K3/06 , H05K3/18 , H05K3/46
CPC分类号： C23C18/161 , C23C18/1651 , C23C18/30 , H05K3/181 , Y10T29/49121 , Y10T29/49156
摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.
摘要翻译：形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。电路图案可以形成在印刷线路板上。

3. 发明授权

US07166152B2 Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method 有权
标题翻译：用于提供化学镀的催化剂的预处理溶液，使用该溶液的预处理方法以及使用该方法生产的无电镀膜和/或电镀对象
公开(公告)号：US07166152B2
公开(公告)日：2007-01-23
申请号：US10636447
申请日：2003-08-07
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Kim Dong Hyun , Shingo Kitamura , Seiichiro Nakao , Hidenori Tsuji , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Kim Dong Hyun , Shingo Kitamura , Seiichiro Nakao , Hidenori Tsuji , Hidemi Nawafune
IPC分类号： C23C18/28
CPC分类号： C23C18/28
摘要： A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.
摘要翻译：提供了一种用于提供无电镀的催化剂的预处理溶液和使用该溶液的预处理方法。所述预处理溶液包含至少含有以下成分（I），（II）和（III）作为必要成分的银胶体溶液：（I）银胶体粒子，（II）一种或多种离子，选自具有可以将银离子还原成溶液中的金属银的金属和在银离子还原时被氧化的离子的金属，和（III）一种或多种选自羟基羧酸根离子，缩合磷酸根离子和胺羧酸根离子，银胶体粒子（I）由金属（II）的离子产生，具有可以将银离子还原成金属银的电位。当通过使用预处理溶液预处理要镀覆的物体时，实现无电镀的有效催化剂。

4. 发明授权

US4591416A Chromate composition and process for treating zinc-nickel alloys 失效
标题翻译：铬酸盐组成和处理锌镍合金的工艺
公开(公告)号：US4591416A
公开(公告)日：1986-05-27
申请号：US455622
申请日：1983-01-04
申请人： Masaaki Kamitani , Hidenori Tsuji
发明人： Masaaki Kamitani , Hidenori Tsuji
IPC分类号： C23C22/24 , C25D11/38
CPC分类号： C25D11/38 , C23C22/24
摘要： The present invention includes an aqueous acidic chromate solution, suitable for forming colored chromate coatings on zinc-nickel alloy electrodeposits containing up to about 15% by weight nickel, which solutions have a pH within the range of about 1.3 to about 2.7, a hexavalent chromium concentration of at least 0.5 grams per liter, and preferably about 0.5 to about 100 grams per liter, and which contain sulfate in a weight ratio of SO.sub.4 :Cr.sup.+6 of about 0.025-1.5:1.The zinc-nickel alloy electrodeposits are preferably immersed in the chromating solution for a period sufficient to form the desired colored chromate coating. In some instances, a flash electrodeposit of zinc may be applied to the zinc-nickel alloy electrodeposit before it is immersed in the chromating solution. Alternatively, the zinc-nickel alloy electrodeposit may be immersed in the chromating solution and the solution electrolyzed, with the zinc-nickel alloy surface as the anode, at low current densities for a short period of time, after which, the electrolysis is discontinued and the zinc-nickel alloy surface is maintained in the chromating solution until the desired colored chromate film is formed.
摘要翻译：本发明包括酸性铬酸盐水溶液，其适用于在含有高达约15重量％镍的锌镍合金电沉积物上形成有色铬酸盐涂层，该溶液的pH值在约1.3至约2.7的范围内，六价铬浓度为至少0.5克/升，优选约0.5至约100克/升，并且其含有重量比为SO4：Cr + 6的硫酸盐为约0.025-1.5:1。优选将锌 - 镍合金电沉积物浸渍在铬酸盐溶液中足以形成所需着色的铬酸盐涂层的时间。在一些情况下，在将锌 - 镍合金电沉积物浸入铬酸盐溶液之前，锌的闪电电沉积可被施加到锌 - 镍合金电沉积物上。或者，可以将锌 - 镍合金电沉积物浸入铬酸盐溶液中，并以锌 - 镍合金表面为阳极电解溶液，电流密度低，短时间后，电解停止，将锌 - 镍合金表面保持在铬酸盐溶液中，直到形成所需的着色铬酸盐膜。

5. 发明授权

US07934356B2 Machine for filling bag with medicine 失效
标题翻译：机械灌装袋用药
公开(公告)号：US07934356B2
公开(公告)日：2011-05-03
申请号：US12293271
申请日：2007-03-07
申请人： Shoji Yuyama , Takayuki Fujikawa , Hidenori Tsuji
发明人： Shoji Yuyama , Takayuki Fujikawa , Hidenori Tsuji
IPC分类号： B65B5/06
CPC分类号： B65B5/045 , B65B5/067 , B65B39/12 , B65B43/34
摘要： To quickly fill a bag with medicine containers without damaging the containers, a machine for filling a bag with medicine containers includes: a bag positioning member (4) for positioning and opening a bag (13); a first moving member (37) that reciprocates between a supply position inside the bag (13) and a waiting position outside the bag (13), the first moving member including a bottom surface portion for supporting medicine containers; a second moving member that reciprocates relative to the bag (13) and includes a guide surface (47) guiding medicine containers (11) to the bottom surface portion; and a drive-control means (59) that moves the first moving member (37) from the supply position to the waiting position while maintaining the second moving member (38) in a fixed position relative to the bag (13), thereby causing medicine containers (11) guided by the guide surface (47) to the bottom surface portion to remain in the bag (13).
摘要翻译：为了在不损坏容器的情况下快速地将药品填充到药物容器中，用于用药剂容器填充袋子的机器包括：用于定位和打开袋子的袋定位构件（4）; 第一移动构件（37），其在袋（13）内部的供给位置与袋（13）外的等待位置之间往复运动，第一移动构件包括用于支撑药物容器的底面部; 第二移动构件，其相对于所述袋子（13）往复移动并且包括将药剂容器（11）引导到所述底面部分的引导表面（47）; 以及驱动控制装置（59），其将第一移动部件（37）从供给位置移动到等待位置，同时将第二移动部件（38）相对于袋（13）保持在固定位置，从而引起药物由引导表面（47）引导到底表面部分的容器（11）保留在袋子（13）中。

6. 发明申请

US20090084070A1 Machine For Filling Bag With Medicine 失效
标题翻译：机械灌装袋与医药
公开(公告)号：US20090084070A1
公开(公告)日：2009-04-02
申请号：US12293271
申请日：2007-03-07
申请人： Shoji Yuyama , Takayuki Fujikawa , Hidenori Tsuji
发明人： Shoji Yuyama , Takayuki Fujikawa , Hidenori Tsuji
IPC分类号： B65B39/06
CPC分类号： B65B5/045 , B65B5/067 , B65B39/12 , B65B43/34
摘要： To quickly fill a bag with medicine containers without damaging the containers, a machine for filling a bag with medicine containers includes: a bag positioning member (4) for positioning and opening a bag (13); a first moving member (37) that reciprocates between a supply position inside the bag (13) and a waiting position outside the bag (13), the first moving member including a bottom surface portion for supporting medicine containers; a second moving member that reciprocates relative to the bag (13) and includes a guide surface (47) guiding medicine containers (11) to the bottom surface portion; and a drive-control means (59) that moves the first moving member (37) from the supply position to the waiting position while maintaining the second moving member (38) in a fixed position relative to the bag (13), thereby causing medicine containers (11) guided by the guide surface (47) to the bottom surface portion to remain in the bag (13).
摘要翻译：为了在不损坏容器的情况下快速地将药品填充到药物容器中，用于用药剂容器填充袋子的机器包括：用于定位和打开袋子的袋定位构件（4）; 第一移动构件（37），其在袋（13）内部的供给位置与袋（13）外的等待位置之间往复运动，第一移动构件包括用于支撑药物容器的底面部; 第二移动构件，其相对于所述袋子（13）往复移动并且包括将药剂容器（11）引导到所述底面部分的引导表面（47）; 以及驱动控制装置（59），其将第一移动部件（37）从供给位置移动到等待位置，同时将第二移动部件（38）相对于袋（13）保持在固定位置，从而引起药物由引导表面（47）引导到底表面部分的容器（11）保留在袋子（13）中。

7. 发明授权

US07058049B2 Load store queue applied to processor 失效
公开(公告)号：US07058049B2
公开(公告)日：2006-06-06
申请号：US10092989
申请日：2002-03-08
申请人： Hidehiko Tanaka , Shuichi Sakai , Hidenori Tsuji , Yuichiro Ajima
发明人： Hidehiko Tanaka , Shuichi Sakai , Hidenori Tsuji , Yuichiro Ajima
IPC分类号： H04L12/50
CPC分类号： G06F9/3834
摘要： An in-order state queue holds store tags as in-order information about store instructions. A temporal store cache, which uses store addresses as indexes, holds store tags and store values. A first retrieving unit retrieves store tags preceding a load tag. A second retrieving unit compares the store tag read from the temporal store cache according to the address for the load instruction with the store tag from the first retrieving unit and, when they coincide with each other, outputs a hit signal.

8. 发明授权

US5441619A Electroplating apparatus 失效
标题翻译：电镀设备
公开(公告)号：US5441619A
公开(公告)日：1995-08-15
申请号：US163069
申请日：1993-12-06
申请人： Norio Kawachi , Midori Ito , Toshiharu Naka , Hidenori Tsuji
发明人： Norio Kawachi , Midori Ito , Toshiharu Naka , Hidenori Tsuji
IPC分类号： C25D5/08 , C25D7/00 , C25D7/06 , C25D17/00 , C25D21/00 , C25D21/12 , C25D21/14 , H05K3/24
CPC分类号： H05K3/241 , C25D17/00 , C25D17/005 , C25D17/10 , C25D21/12 , C25D7/0614
摘要： An electroplating apparatus capable of forming a film of a uniform thickness on a substrate for printed wiring irrespective of a size of the substrate. Insoluble anode plates are arranged in a plurality of pairs in an electroplating tank in a manner to be juxtaposed to each other along a transfer passage along which the substrate is horizontally transferred and electrically independent from each other for every pair. The insoluble anode plates in each pair are arranged so as to be vertically spaced from each other with the transfer passage being interposed therebetween and are independently connected to an anode terminal of each of rectifiers. Cathode terminals of the rectifiers are electrically connected together to clips for holding the substrate. Electroplating on the substrate is carried out by feeding only the insoluble anode plates contained in a plane of projection of the substrate defined in a vertical direction of the substrate with electricity.
摘要翻译：一种能够在基板上形成均匀厚度的印刷电路的电镀设备，而与基板的尺寸无关。不溶性阳极板以电镀槽中的多对形式配置，沿着沿基板被水平传送的传送通道相互并列并且彼此彼此电独立的方式彼此并列。每对中的不溶性阳极板被布置成彼此垂直间隔开，传输通道插入其间，并且独立地连接到每个整流器的阳极端子。整流器的阴极端子一起电连接到用于保持基板的夹子。基板上的电镀仅通过仅供给包含在基板的垂直方向上限定的基板的投影平面中的不溶性阳极板进行。

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