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    • 6. 发明申请
    • Method of Processing Nature Pattern on Expitaxial Substrate
    • 在外延基板上处理自然图案的方法
    • US20080283503A1
    • 2008-11-20
    • US11748478
    • 2007-05-14
    • Cheng-yi LiuYi-ju ChenShih-Chieh HsuChing-Liang Lin
    • Cheng-yi LiuYi-ju ChenShih-Chieh HsuChing-Liang Lin
    • B44C1/22
    • H01L33/22H01L33/0062
    • A method of processing nature pattern on expitaxial substrate, unlike the conventional method of processing regular pattern on expitaxial substrate (such as sapphire substrate) by lithography, wet etches a sapphire substrate directly to obtain a nature pattern, so as to simplify the fabrication process. Compared with the conventional way of processing pattern sapphire, the nature pattern sapphire substrate produced by the method can avoid voids between the interface of sapphire and GaN and apply this technology to a wired bond LED structure to increase the sidewall light extraction and improve the texture of the sapphire surface of a flip chip LED structure. In addition, this method also can be applied to a thin-GaN LED for achieving the surface texture after the sapphire is removed by laser.
    • 在外延衬底上处理自然图案的方法,与通过光刻在外延衬底(例如蓝宝石衬底)上处理规则图案的常规方法不同,直接湿法蚀刻蓝宝石衬底以获得自然图案,从而简化制造工艺。 与传统的蓝宝石处理方式相比,通过该方法生产的蓝宝石蓝宝石衬底可以避免蓝宝石和GaN界面之间的空隙,并将此技术应用于有线键合LED结构,增加侧壁光提取,改善纹理 蓝宝石表面的倒装芯片LED结构。 此外,该方法也可以应用于在通过激光去除蓝宝石之后实现表面纹理的薄GaN LED。
    • 8. 发明授权
    • Light emitting diode device
    • 发光二极管装置
    • US08766307B2
    • 2014-07-01
    • US13778161
    • 2013-02-27
    • Yen-Lin LaiShen-Jie WangYu-Chu LiJyun-De WuChing-Liang LinKuan-Yung Liao
    • Yen-Lin LaiShen-Jie WangYu-Chu LiJyun-De WuChing-Liang LinKuan-Yung Liao
    • H01L33/60
    • H01L33/60H01L33/20H01L2933/0091
    • A light emitting diode device includes an epitaxial substrate, at least one passivation structure, at least one void, a semiconductor layer, a first type doping semiconductor layer, a light-emitting layer and a second type doping semiconductor layer. The passivation structure is disposed on the epitaxial substrate and has an outer surface. The void is located at the passivation structure and at least covering 50% of the outer surface of the passivation structure. The semiconductor layer is disposed on the epitaxial substrate and encapsulating the passivation structure and the void. The first type doping semiconductor layer is disposed on the semiconductor layer. The light-emitting layer is disposed on the first type doping semiconductor layer. The second type doping semiconductor layer is disposed on the light emitting layer.
    • 发光二极管器件包括外延衬底,至少一个钝化结构,至少一个空穴,半导体层,第一类型掺杂半导体层,发光层和第二类型掺杂半导体层。 钝化结构设置在外延衬底上并具有外表面。 空隙位于钝化结构处,并且至少覆盖钝化结构的外表面的50%。 半导体层设置在外延衬底上并封装钝化结构和空隙。 第一类掺杂半导体层设置在半导体层上。 发光层设置在第一型掺杂半导体层上。 第二种掺杂半导体层设置在发光层上。