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    • 10. 发明授权
    • Uniform current distribution for ECP loading of wafers
    • 晶圆的ECP负载均匀电流分布
    • US07544281B2
    • 2009-06-09
    • US11119183
    • 2005-04-28
    • Ming-Wei LinMing-Hsing Tsai
    • Ming-Wei LinMing-Hsing Tsai
    • C25D5/02
    • C25D17/06C25D5/18C25D7/123C25D17/001C25D17/005H01L21/2885
    • An electrochemical plating apparatus and method for facilitating uniform current distribution across a wafer during loading into an ECP (electrochemical plating) apparatus is disclosed. The apparatus includes a bath container for containing a bath solution, an anode provided in the bath container, a cathode ring for supporting a wafer in the bath container and a current source electrically connected to the anode and the cathode ring. According to the method, a voltage potential is applied to the cathode ring as it is immersed into the solution and prior to immersion of the wafer in the solution, thereby facilitating a substantially uniform plating current across the wafer upon immersion of the wafer.
    • 公开了一种用于在装载到ECP(电化学电镀)装置中时促进在晶片上均匀分布电流的电化学电镀装置和方法。 该装置包括用于容纳浴溶液的浴容器,设置在浴容器中的阳极,用于在浴容器中支撑晶片的阴极环和与阳极和阴极环电连接的电流源。 根据该方法,当阴极环浸入溶液中并且在将晶片浸入溶液之前,电压电势被施加到阴极环上,从而有助于在晶片浸入时跨晶片的基本均匀的电镀电流。