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    • 5. 发明授权
    • Semiconductor device and fabrication method thereof
    • 半导体器件及其制造方法
    • US06190911B1
    • 2001-02-20
    • US08670148
    • 1996-06-27
    • Ihachiro Gofuku
    • Ihachiro Gofuku
    • H01L21265
    • H01L29/66954H01L21/28525H01L21/31155H01L29/66272
    • A method for fabricating a semiconductor device having a wiring part connected via an opening portion formed in an insulting film on a semiconductor region to the semiconductor region. The wiring part includes a polycrystalline semiconductor layer and a metal or metal silicide on the semiconductor layer. A polycrystalline semiconductor layer is deposited over the opening portion of the semiconductor region. First and second impurities are respectively ion injected into the polycrystalline semiconductor layer, wherein the ion injecting range of the first impurities is longer than that of the second impurities, thereby forming a high concentration region at least on a surface side of the polycrystalline semiconductor layer. Following the ion injection of the first and second impurities, a heat treatment is conducted to grow crystals of the polycrystalline semiconductor layer. After the heat treatment, a metal or a metal silicide is deposited on the polycrystalline layer using a low melting point method.
    • 一种半导体器件的制造方法,其具有通过形成在半导体区域上的绝缘膜上的开口部连接到半导体区域的布线部。 布线部分包括半导体层上的多晶半导体层和金属或金属硅化物。 多晶半导体层沉积在半导体区域的开口部分上。 第一和第二杂质分别离子注入多晶半导体层,其中第一杂质的离子注入范围比第二杂质的离子注入范围长,从而至少在多晶半导体层的表面侧形成高浓度区域。 在离子注入第一和第二杂质之后,进行热处理以生长多晶半导体层的晶体。 在热处理之后,使用低熔点法在多晶层上沉积金属或金属硅化物。